Plant-derived wheat seed-dressing agent and preparation method thereof
A technology of seed dressing agent and plant source, which is applied in the field of plant source wheat seed dressing agent and its preparation, can solve the problems of non-very obvious adjustment effect and no strict environmental protection standards, so as to improve the emergence speed and rate, and improve the germination quality , Promote the effect of seedling growth
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0019] A plant source wheat seed dressing agent, its raw materials include by weight: 780 parts of water, 1 part of potassium fulvic acid, 11.2 parts of sodium humate, 12 parts of potassium hydroxide, 3% by weight of fatty alcohol poly 25 parts of an aqueous solution of oxyethylene ether and 2% tristyrylphenol polyoxyethylene ether, and the weight percentage is 0.2 parts of an aqueous solution of 1% polyether-modified organosilane and 1% polydimethylsiloxane, diphosphate 12 parts of potassium hydrogen, 20 parts of ammonium nitrate, 8 parts of urea, 0.2 parts of chitosan oligosaccharide, 2.0 parts of citric acid, 4 parts of EDTA-disodium, 2.6 parts of KOM, 0.22 parts of ammonium molybdate, 1.2 parts of sodium gluconate, boric acid 0.6 parts, 0.4 parts of copper sulfate, 1.0 parts of manganese sulfate, 0.8 parts of magnesium sulfate, 550 parts of ferrous sulfate, 15 parts of Haloxylon seed extract.
[0020] The Haloxylon seed extract adopts the following preparation process: gri...
Embodiment 2
[0022] A plant source wheat seed dressing agent, its raw materials include by weight: 880 parts of water, 3 parts of potassium fulvic acid, 15.2 parts of sodium humate, 18 parts of potassium hydroxide, 8% by weight of fatty alcohol poly 35 parts of an aqueous solution of oxyethylene ether and 4% tristyrylphenol polyoxyethylene ether, the weight percentage is 1.0 parts of an aqueous solution of 3% polyether-modified organosilane and 3% polydimethylsiloxane, diphosphate 18 parts of potassium hydrogen, 30 parts of ammonium nitrate, 12 parts of urea, 0.6 parts of chitosan oligosaccharide, 3.2 parts of citric acid, 8 parts of EDTA-disodium, KOM2.6-3.8 parts, 0.62 parts of ammonium molybdate, 2.4 parts of sodium gluconate , 1.2 parts of boric acid, 1.2 parts of copper sulfate, 2.2 parts of manganese sulfate, 1.2 parts of magnesium sulfate, 650 parts of ferrous sulfate, 15-25 parts of Haloxylon seed extract.
[0023] The Haloxylon seed extract adopts the following preparation process...
Embodiment 3
[0025] A plant source wheat seed dressing agent, its raw materials include by weight: 830 parts of water, 2 parts of potassium fulvic acid, 13.2 parts of sodium humate, 15.2 parts of potassium hydroxide, 5% by weight of fatty alcohol poly 30 parts of an aqueous solution of oxyethylene ether and 3% tristyrylphenol polyoxyethylene ether, the weight percentage is 0.5 parts of an aqueous solution of 2% polyether-modified organosilane and 2% polydimethylsiloxane, diphosphate 15 parts of potassium hydrogen, 25 parts of ammonium nitrate, 10 parts of urea, 0.48 parts of chitosan oligosaccharide, 2.6 parts of citric acid, 6 parts of EDTA-disodium, 3.2 parts of KOM, 0.42 parts of ammonium molybdate, 1.8 parts of sodium gluconate, boric acid 0.9 parts, 0.8 parts of copper sulfate, 1.6 parts of manganese sulfate, 1.08 parts of magnesium sulfate, 600 parts of ferrous sulfate, 20 parts of Haloxylon seed extract.
[0026] The Haloxylon seed extract adopts the following preparation process: G...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com