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Electronic material with high dielectricity and preparation method of electronic material

An electronic material and dielectric technology, applied in the field of electronic materials, can solve problems such as poor bonding performance of PCB boards, harsh process conditions, and limited applications, so as to improve thermal performance, maintain toughness and dielectric properties, and avoid high costs Effect

Inactive Publication Date: 2018-08-10
山东励仙电力工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among the existing capacitor dielectric materials, "ceramic materials" have the advantages of high dielectric properties and low loss, but their bonding performance with PCB boards is poor. At the same time, the powder is easy to agglomerate and the process conditions are harsh, so the practical application is limited.
The "polymer material" has good processing performance, low price, and good bonding performance with the PCB board, but its dielectric constant is very low (generally ε<5)

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] An electronic material with high dielectric properties provided in this embodiment, the fiber composite particles include the following raw materials in parts by weight: 28 parts of fullerene derivatives, 16 parts of cyanate esters, dicarboxyphthaloyl 12 parts of imine, 4 parts of tetraglycidyl diaminodimethyl benzene, 3.7 parts of titanium dioxide whiskers, 11 parts of hollow alumina, 27 parts of short silicon carbide fibers, 5 parts of synthetic base oil, 7 parts of solid paraffin, surface Activated barium titanate 3 parts, epoxy resin 13 parts.

[0026] As a preferred solution, the particle diameter of the hollow alumina is 110 nanometers.

[0027] As a preferred solution, the short silicon carbide fibers have a length of 300 nanometers.

[0028] As a preferred solution, the fullerene derivatives are introduced into amino groups to form aminofullerene derivatives, and the specific preparation process is as follows:

[0029] (1) In an air environment, dissolve the f...

Embodiment 2

[0038] An electronic material with high dielectric properties provided in this embodiment, the fiber composite particles include the following raw materials in parts by weight: 16 parts of fullerene derivatives, 27 parts of cyanate esters, dicarboxyphthaloyl 7 parts of imine, 15 parts of tetraglycidyl diaminodimethyl benzene, 2.5 parts of titanium dioxide whiskers, 23 parts of hollow alumina, 16 parts of short silicon carbide fibers, 13 parts of synthetic base oil, 4 parts of solid paraffin, surface Activated barium titanate 8 parts, epoxy resin 11 parts.

[0039] As a preferred solution, the particle diameter of the hollow alumina is 100 nanometers.

[0040] As a preferred solution, the short silicon carbide fibers have a length of 300 nanometers.

[0041] As a preferred solution, the fullerene derivatives are introduced into amino groups to form aminofullerene derivatives, and the specific preparation process is as follows:

[0042] (1) In an air environment, dissolve the ...

Embodiment 3

[0051] In the electronic material with high dielectric properties provided by this embodiment, the fiber composite particles include the following raw materials in parts by weight: 22 parts of fullerene derivatives, 21 parts of cyanate esters, dicarboxyphthaloyl 11 parts of imine, 8 parts of tetraglycidyl diaminodimethyl benzene, 2.9 parts of titanium dioxide whiskers, 15 parts of hollow alumina, 23 parts of short silicon carbide fibers, 12 parts of synthetic base oil, 5 parts of solid paraffin, surface Activated barium titanate 6 parts, epoxy resin 12 parts.

[0052] As a preferred solution, the particle diameter of the hollow alumina is 107 nanometers.

[0053] As a preferred solution, the short silicon carbide fibers have a length of 295 nanometers.

[0054] As a preferred solution, the fullerene derivatives are introduced into amino groups to form aminofullerene derivatives, and the specific preparation process is as follows:

[0055] (1) In an air environment, dissolve ...

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Abstract

The invention provides an electronic material with high dielectricity, and a preparation method of the electronic material. The electronic material is prepared from the following components: fullerenederivatives, cyanate ester, dicarboxyl phthalimide, tetraglycidyl diamino-dimethylene benzene, titanium dioxide whisker, hollow alumina, silicon carbide short fibers, synthetic base oil, solid paraffin, surface activated barium titanate and epoxy resin. Compared with the prior art, the electronic material prepared from the components has higher dielectricity.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and in particular relates to an electronic material with high dielectric properties and a preparation method thereof. Background technique [0002] With the rapid development of science and technology, the requirements for electronic products are more miniaturization, light weight, low cost, multi-function, and high reliability. In the printed circuit board (PCB), passive components are more than 20 times that of active devices, occupying 40% of the space, and the number of capacitors accounts for 40% of passive components, so capacitors occupy an important role in electronic products. status. [0003] Among the existing capacitor dielectric materials, "ceramic materials" have the advantages of high dielectric properties and low loss, but have poor bonding performance with PCB boards, and at the same time, the powder is easy to agglomerate and the process conditions are harsh, so th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/04C08L91/06C08L91/00C08K13/06C08K7/10C08K7/24C08K7/08C08K3/24C08K3/04
CPCC08L75/04C08L2201/02C08L2201/22C08L2203/20C08L2205/02C08L2205/03C08L91/06C08L91/00C08K13/06C08K7/10C08K7/24C08K7/08C08K3/24C08K3/045
Inventor 伍文慧
Owner 山东励仙电力工程有限公司
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