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A kind of micro-nano mixed solder paste that can be used for pressureless sintering and its preparation method

A hybrid welding, micro-nano technology, applied in the direction of welding equipment, manufacturing tools, welding media, etc., can solve the problems of obvious volume shrinkage, low stacking density, high production cost, etc., to achieve increased stacking density, smooth particle surface, and equipment simple effect

Active Publication Date: 2019-06-18
深圳市先进连接科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the problems existing in the prior art, the purpose of the present invention is to provide a micro-nano hybrid solder paste that can be used for pressureless sintering and its preparation method, aiming to solve the problems of low stacking density, Problems such as obvious volume shrinkage, surface cracks, high manufacturing cost, and low output

Method used

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  • A kind of micro-nano mixed solder paste that can be used for pressureless sintering and its preparation method
  • A kind of micro-nano mixed solder paste that can be used for pressureless sintering and its preparation method

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Effect test

Embodiment 1

[0037] Embodiment 1 A preparation method of a micro-nano hybrid solder paste that can be used for pressureless sintering, comprising:

[0038] (S1) using the formic acid alcohol solution with a volume fraction of 5% to clean the micron copper particles with an average particle size of 500 nm, and then performing centrifugation and drying to obtain clean micron copper particles on the surface;

[0039] (S2) mechanically mixing the micron silver particles with succinic acid, terpineol, ethanol and ethylene glycol to obtain a mixture A, wherein the mass percentage of micron copper is 80%, the mass percentage of succinic acid is 0.5%, terpineol is The mass percentage of ethanol is 4.5%, the mass percentage of ethanol is 5%, and the rest are ethylene glycol;

[0040] (S3) be 70nm and be coated with the nano-silver particles of sodium citrate and gelatin, terpineol, ethanol and ethylene glycol mechanically mix, obtain mixture B, wherein nano-silver mass percentage is 80%, and gelati...

Embodiment 2

[0042] Embodiment 2 A preparation method of a micro-nano hybrid solder paste that can be used for pressureless sintering, comprising:

[0043] (S1) using the dilute nitric acid alcohol solution that volume fraction is 5% to clean the micron silver particles with an average particle size of 1 μm, and then carry out centrifugation and drying treatment to obtain the micron silver particles with clean surface;

[0044] (S2) mechanically mixing micron silver particles with glutaric acid, ethyl cellulose, butanol and ethylene glycol to obtain mixture A, wherein the mass percentage of micron silver is 84%, the mass percentage of glutaric acid is 0.5%, and the pine oil The mass percentage of alcohol is 3.5%, the mass percentage of butanol is 7%, and the rest are ethylene glycol;

[0045] (S3) be 50nm and be coated with the nano silver particles of sodium citrate and fish oil, ethyl cellulose, butanol and ethylene glycol mechanically mix, obtain mixture B, wherein nano silver mass perc...

Embodiment 3

[0047] Embodiment 3 A preparation method of micro-nano hybrid solder paste that can be used for pressureless sintering, comprising:

[0048] (S1) will use the dilute hydrochloric acid alcohol solution that volume fraction is 5% to clean the micron silver particles that the average particle size is 3 μm, and then carry out centrifugation and drying treatment to obtain the micron silver particles that the surface is clean;

[0049] (S2) mechanically mixing micron silver particles with rosin acid, butyl carbitol acetate, butanol and propylene glycol to obtain mixture A, wherein the mass percentage of micron silver is 70%, the mass percentage of rosin acid is 0.2%, and the mass percentage of butyl carbitol is 0.2%. The mass percentage of bisphenol acetate is 3.4%, the mass percentage of butanol is 9%, and the rest is ethylene glycol;

[0050] (S3) the nano-silver particles with an average particle size of 20nm and coated with sodium citrate are mechanically mixed with sodium dodec...

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Abstract

The invention provides a micro-nano mixed welding paste capable of being used for pressureless sintering preparation and a packaging method thereof. The interior of a material is filled with micron-sized spherical particles as a matrix, and the nano-particles are uniformly filled in the material, sintering driving force is provided, so that the whole material is subjected to pressureless sinteringforming at a low temperature. The preparation method comprises the following steps of S1, preparing micron particles with specific sizes and carrying out acid washing and drying; S2, mechanically stirring the micron particle powder with a surfactant, an organic carrier and an organic solvent to obtain a mixture A; S3, fully mixing the metal nano-particles with a dispersing agent, the organic carrier and the organic solvent to obtain a mixture B; and S4, mixing the mixture A and the mixture B to obtain the micro-nano mixed welding paste. According to the micro-nano mixed welding paste capableof being used for pressureless sintering and the preparation method thereof, the welding paste solves problems of volume shrinkage and cracks of the nano welding paste during sintering, the reliability of the welding spots is improved, and the welding paste can be used for packaging and manufacturing for power devices; and according to the scheme, the production process of the welding paste is simplified, the preparation process is green and environment-friendly, the packaging method provided is simple and practical and is beneficial to market popularization.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, and more particularly to a micro-nano hybrid solder paste that can be used for pressureless sintering and a preparation method thereof. Background technique [0002] With the update of microelectronics industry technology, the functional devices in electronic products are constantly developing towards miniaturization and high integration. This brings about higher packaging density and energy density, and puts forward higher mechanical properties and heat dissipation requirements for soldered interconnect materials. Especially in the fields of deep well detection, new energy vehicles, military radar, etc., devices are faced with complex service environments such as high temperature and high frequency vibration, and traditional tin-based interconnect solders can no longer meet the requirements. Therefore, it is urgent to develop new high-temperature-resistant interconnect materials an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30B23K35/14B23K1/00
CPCB23K1/0008B23K35/025B23K35/3006B23K35/302
Inventor 杨帆李明雨胡博赵新亮
Owner 深圳市先进连接科技有限公司
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