Preparation method of flexible iodide film

An iodide and flexible technology, which is applied in the field of preparation of flexible iodide films, can solve problems such as poor thickness controllability, low uniformity, and elevated substrate temperature, to solve easy peeling and peeling, and to solve the problem of thickness Controllability is not strong, solve the effect of low crystallinity

Inactive Publication Date: 2018-11-09
CHENGDU UNIV OF INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The preparation of iodide films by solution spin coating has the disadvantages of low crystallinity of film materials, poor thickness controllability, low uniformity, toxicity and difficulty in preparing large-area films.
The thermal evaporation method has severe fractionation of compound elements, deviation of the film material composition, and heat radiation from the evaporation source to the film deposition substrate during the evaporation process, resulting in an increase in the substrate temperature; for the preparation of iodide films on plastic film substrates using this method When the substrate temperature rises, there will be severe thermal expansion and contraction, resulting in the low quality of the prepared iodide film and easy peeling and peeling.
Toxic, flammable, and explosive metal-organic sources are used in the preparation of iodide thin films by chemical vapor deposition, which has the disadvantages of complex process control, environmental protection, and high cost.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Weigh lead iodide (PbI) with a purity of 99.99% 2 ) 50 grams of powder, spread evenly in a clean quartz petri dish, put the petri dish in a vacuum drying oven, use a mechanical pump to evacuate to about 10kPa, heat to 100 degrees Celsius, keep for 10 hours, and continue to pump during the heat preservation process Vacuum, maintain the vacuum degree by adjusting the vacuum valve. Fill the dried powder into a clean steel circular mold with an inner diameter of 40mm, pressurize it to about 13MPa with a hydraulic press, hold the pressure for 15 minutes, release the pressure and take out the circular block evaporation source. The cut size is 5×5cm 2 , a polyimide (PI) film with a thickness of 12 microns was ultrasonically cleaned in absolute ethanol and acetone solution for 30 minutes, taken out and dried with high-purity nitrogen, cleaned with plasma for 30 minutes, and then cleaned with absolute ethanol Soak for 10 minutes, take it out and place it on a clean polished si...

Embodiment 2

[0031] Bismuth iodide (BiI) with a purity of 99.99% was weighed in the glove box 3 ) 50 grams of powder, the powder is filled into a clean steel circular mold with an inner diameter of 40mm, pressurized to about 20MPa with a hydraulic press, and the pressure is released after holding the pressure for 20 minutes to take out the circular block evaporation source. The cut size is 5×5cm 2 A polyethylene (PE) film with a thickness of 20 microns was ultrasonically cleaned in absolute ethanol and acetone solutions for 30 minutes, taken out and dried with high-purity nitrogen, cleaned with plasma for 30 minutes, and then soaked in absolute ethanol for 10 minutes. Minutes, take it out and place it on a clean polished silicon wafer. After the absolute ethanol is volatilized, the PE film is tightly attached to the silicon wafer. Place the circular block bismuth iodide evaporation source in the circular graphite crucible in the vacuum chamber, install the silicon wafer with PE film attac...

Embodiment 3

[0033] Antimony triiodide (SbI) with a purity of 99.9% was weighed 3 ) powder 70 grams, spread evenly in a clean quartz petri dish, put the petri dish in a vacuum drying box, use a mechanical pump to evacuate to about 5kPa, heat to 60 degrees Celsius, keep for 8 hours, and continue to pump during the heat preservation process Vacuum, maintain the vacuum degree by adjusting the vacuum valve. Fill the dried powder into a clean steel circular mold with an inner diameter of 40mm, pressurize it to about 10MPa with a hydraulic press, hold the pressure for 20 minutes, release the pressure and take out the circular block evaporation source. The cut size is 5×5cm 2 1. A polyester (PET) film with a thickness of 40 microns was ultrasonically cleaned in absolute ethanol and acetone solution for 30 minutes, taken out and dried with high-purity nitrogen, cleaned with plasma for 30 minutes, and soaked in absolute ethanol for 10 minutes. Minutes, take it out and place it on a clean polished...

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Abstract

The invention provides a preparation method of a flexible iodide film. The preparation method comprises the following steps: 1) iodide powder is dried in a vacuum drying oven to remove adsorption moisture; 2) the dried iodide powder is put into a steel mould to be pressed into a compact circular blocky evaporation source by a hydraulic press; 3) the cleaned flexible plastic film is installed on arigid support substrate; and 4) the evaporation source is placed in a round graphite crucible in the vacuum cavity, a rigid supporting base plate provided with the flexible plastic film is installed on a carrying plate, the evaporation source is bombarded by electron beams in a high-vacuum environment, the evaporation power is controlled, and the evaporation time is controlled to obtain the flexible iodide film. The preparation method is high in controllability, simple in process, environment-friendly, low in cost and capable of realizing large-scale preparation.

Description

technical field [0001] The invention belongs to the technical field of compound thin film preparation methods, relates to iodide thin films, and in particular to a preparation method of flexible iodide thin films. Background technique [0002] Flexible iodide thin films have a wide range of application values ​​in the field of flexible optoelectronic devices, and are the core key materials for flexible thin film solar cells, flexible photodetectors, and flexible light-emitting devices. [0003] Most of the existing preparation technologies use solution spin coating method, thermal evaporation method, and chemical vapor deposition method to prepare iodide thin films. The preparation of iodide thin films by solution spin coating has the disadvantages of low crystallinity, poor thickness controllability, low uniformity, toxicity and difficulty in preparing large-area thin films. The thermal evaporation method has severe fractionation of compound elements, deviation of the film...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/06C23C14/30
CPCC23C14/0694C23C14/30
Inventor 孙辉刘一臻杨定宇朱兴华王阳培华
Owner CHENGDU UNIV OF INFORMATION TECH
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