A three-dimensional ceramic circuit board and preparation method thereof

Abstract

The invention belongs to the preparation fields of ceramic circuit boards and discloses a three-dimensional ceramic circuit board and a preparation method thereof. The three-dimensional ceramic circuit board comprises a flat ceramic substrate containing a metal wiring layer on the surface and a three-dimensional ceramic structure arranged on the flat ceramic substrate. The invention also providesa preparation method of the three-dimensional ceramic circuit board, comprising steps of a three-dimensional structure design, preparation of ceramic slurry, direct writing formation of a three-dimensional structure and heat treatment on the three-dimensional structure. The three-dimensional ceramic circuit board and the method have advantages that the process is simple, the material cost is low,the production efficiency is high, the three-dimensional ceramic circuit board with a cavity structure can be prepared and the like, the prepared three-dimensional ceramic circuit board has high strength, good heat resistance, corrosion-resistance, so that the airtight packaging requirements of electronic devices can be met.

Description

technical field [0001] The invention belongs to the field of ceramic circuit board preparation, and more specifically relates to a three-dimensional ceramic circuit board and a preparation method thereof. Background technique [0002] Ceramic substrates are widely used as packaging substrates for power devices because of their advantages such as high thermal conductivity, good thermal stability, matching thermal expansion coefficient with chips, outstanding high-frequency performance, and corrosion resistance (acid, alkali, and water resistance); With the rapid development of modern electronic manufacturing technology, it also puts forward new requirements for the packaging of electronic devices. For electronic devices, hermetic packaging is beneficial to protect electronic devices and improve their service life. However, it is difficult to achieve hermetic packaging on planar ceramic substrates, so a three-dimensional substrate with a cavity structure has been proposed in t...

AI Technical Summary

Problems solved by technology

The biggest disadvantage of this method is that the thermal expansion coefficients of metal materials and ceramic materials are inconsistent, and it needs to work at high temperature, which consumes a lot of energy and is easy to cause damage to electronic products. The cavity is made of polymer materials. Although the manufacturing process is simple, due to high Molecular materials are not airtight materials, and cannot achieve airtight packaging, and polymer materials are difficult to withstand high temperatures, and are prone to failure under die bonding or high temperature use

[0004] Ceramic chambers have many advantages over metal chambers and polymer chambers, such as matching the thermal expansion coefficient of ceramic substrates, corrosion resistance, and good air tightness. At present, LTCC / HTCC ceramic substrates are Firing technology, ceramic cavity can be prepared, but the dimensional accuracy is not high, and the thick film printing process is used to make the circuit. The surface of the circuit is rough and the Ra is about 1-3 μm. These factors lead to LTCC substrate (low temperature co-fired ceramic substrate) / HTCC substrate (High-temperature co-fired ceramic substrate) is limited in application. In addition, this process is difficult to prepare cavity structures on planar ceramic substrates with high line accuracy, such as DPC substrates (electroplated ceramic substrates), DBC substrates (high-temperature bonded ceramic substrates) ), for this reason, people are urgently looking for a ceramic cavity preparation method with simple process and compatible with various ceramic substrate preparation processes

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