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Thinning grinding wheel and preparation method thereof

A grinding wheel and particle size technology, which is applied in the field of thinning grinding wheels and its preparation, can solve the problems of different substrate surface roughness values ​​and subsurface damage values, longitudinal gradients of easily broken teeth of grinding wheels, and changes in substrate surface quality, etc., to achieve Improve geometric accuracy and surface integrity, improve production efficiency and yield, and reduce the effect of surface roughness

Active Publication Date: 2018-12-07
ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when preparing the grinding wheel in this patent, the feeding and molding method adopted is longitudinal feeding and unidirectional pressing. The formed grinding wheel will have uneven density in the longitudinal gradient direction, and the pressure on the upper surface and the lower surface of the grinding wheel during the forming process is different. As a result, there is a density difference between the upper and lower surfaces of the grinding wheel, which will lead to inconsistent grinding force during the grinding process of the grinding wheel, resulting in little change in the overall surface quality of the processed substrate, but the surface roughness value and subsurface of the substrate Damage values ​​vary, and if the subsurface damage value exceeds the limit that the substrate can bear, the substrate will crack or shatter
[0005] How to solve the problems of easily broken teeth and uneven longitudinal gradient of the grinding wheel in the grinding process has not been reported, so further research is necessary

Method used

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  • Thinning grinding wheel and preparation method thereof
  • Thinning grinding wheel and preparation method thereof
  • Thinning grinding wheel and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046]The preparation method of the thinning grinding wheel of this embodiment is composed of the following raw materials in parts by volume: 17 parts of nickel-plated diamond, 9 parts of silicon carbide (4 parts of silicon carbide with a particle size of 3.5 μm, and 4 parts of silicon carbide with a particle size of 5 μm) 5 parts), 2 parts of zinc oxide, 1 part of fine graphite, 25 parts of phenolic resin, 2 parts of sodium bicarbonate (purity is analytically pure), 2 parts of coupling agent 550 (purity is analytical pure), the particle sizes are respectively : Nickel-plated diamond 8-12μm, silicon carbide 3.5μm, 5μm, zinc oxide 1-3μm, fine graphite 2-4μm, phenolic resin 13-20μm, sodium bicarbonate 50-100μm;

[0047] The preparation process comprises the following steps:

[0048] 1) Mix nickel-plated diamond, 3.5μm silicon carbide, and 5μm silicon carbide in the formula through a 100-mesh sieve twice, then drop in coupling agent 550, pour 300mL of ethanol (purity is analytica...

Embodiment 2

[0058] The preparation method of the thinning grinding wheel of this embodiment is composed of the following raw materials in parts by volume: 22 parts of nickel-plated diamond, 19 parts of silicon carbide (10 parts of silicon carbide with a particle size of 3.5 μm, and 10 parts of silicon carbide with a particle size of 5 μm) 9 parts), 5 parts of zinc oxide, 3 parts of fine graphite, 45 parts of phenolic resin, 4 parts of sodium bicarbonate (purity is analytically pure), 4 parts of coupling agent 550 (purity is analytical pure), the particle sizes are respectively : Nickel-plated diamond 8-12μm, silicon carbide 3.5μm, 5μm, zinc oxide 1-3μm, fine graphite 2-4μm, phenolic resin 13-20μm, sodium bicarbonate 50-100μm;

[0059] Compared with the preparation method of Example 1, adjust some preparation parameters as follows:

[0060] All materials pass through a 200-mesh sieve; Step 2) The rotation speed of the stirring head is 100rpm, the ultrasonic time is 10min, and the oven temp...

Embodiment 3

[0062] The preparation method of the thinning grinding wheel of this embodiment is composed of the following raw materials in parts by volume: 18 parts of nickel-plated diamond, 16 parts of silicon carbide (8 parts of silicon carbide with a particle size of 3.5 μm, and 8 parts of silicon carbide with a particle size of 5 μm) 8 parts), 4 parts of zinc oxide, 2 parts of fine graphite, 30 parts of phenolic resin, 3 parts of sodium bicarbonate (purity is analytical pure), 2 parts of coupling agent 550 (purity is analytical pure), the particle diameters are respectively : Nickel-plated diamond 8-12μm, silicon carbide 3.5μm, 5μm, zinc oxide 1-3μm, fine graphite 2-4μm, phenolic resin 13-20μm, sodium bicarbonate 50-100μm;

[0063] Compared with the preparation method of Example 1, adjust some preparation parameters as follows:

[0064] All materials pass through a 150-mesh sieve; Step 2) The rotation speed of the stirring head is 50rpm, the ultrasonic time is 30min, and the oven tempe...

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Abstract

The invention belongs to the technical field of substrate machining, and particularly relates to a thinning grinding wheel and a preparation method thereof. The thinning grinding wheel is prepared from, by volume part, 17-22 parts of diamond, 9-19 parts of silicon carbide, 2-5 parts of zinc oxide, 1-3 parts of graphite, 25-45 parts of phenolic resin, 2-4 parts of sodium bicarbonate and 2-4 parts of a coupling agent. The prepared grinding wheel for machining a substrate is prepared through one-way pressing and two-way pressing, the surface roughness of the ground substrate can be low through the grinding wheel, and scratches, pits, microcracks and other surface / subsurface damage are avoided. By means of the grinding wheel, the longitudinal gradient difference can be smaller than 2%, the surface roughness value of the substrate can be smaller than 20 nm, and the surface geometric accuracy and surface integrity of the substrate are improved; and it is avoided that the machining quality ofthe substrate is unstable, production efficiency is improved, and the yield is increased.

Description

technical field [0001] The invention belongs to the technical field of substrate substrate processing, and in particular relates to a thinning grinding wheel and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics and optoelectronics technology, substrates such as monocrystalline silicon and sapphire are widely used as excellent substrate materials in the fields of integrated circuits, optoelectronics, aerospace and national defense technology. Due to subsequent processing technology and device performance requirements, substrate substrate processing has extremely high surface geometric accuracy and surface integrity requirements. [0003] At present, the crystal substrate processing technology mainly includes grinding, grinding, chemical corrosion and chemical mechanical polishing (CMP), etc., and diamond grinding wheels are commonly used for grinding. However, when using diamond grinding wheel for grinding, it is nece...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/28B24D7/02B24D18/00
Inventor 闫宁赵延军惠珍
Owner ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD