A method for improving field emission performance of carbon nanotube arrays
A carbon nanotube array and nanotube array technology, applied in the field of preparation and application of nanomaterials, can solve the problems of low field emission current density, large number of field emission points, poor stability, etc., and achieve work function reduction, field emission Effects of Enhanced Electron Emission Capability and Enhanced Tube-Base Bonding
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Embodiment 1
[0028] (1) Pretreatment of silicon single wafer:
[0029] First, the n-type (100) silicon single wafer cut into small pieces of 2cm×2cm was cleaned ultrasonically (50W) in deionized water and absolute ethanol for 5 minutes, and then immersed in hydrofluoric acid with a volume ratio of 4%. After 5 minutes, take it out and dry it in the air, and then carry out energy-carrying silver ion bombardment pretreatment in the silicon single wafer with the clean surface obtained in the metal vapor vacuum arc ion source (MEVVA source). During the bombardment, keep the sample stage rotating at a constant speed. The bias voltage is set to -15kV, the beam current is 10 mA, and the bombardment time is 10 minutes. The bombardment pretreatment process can be used to improve the binding force between the carbon nanotubes and the substrate.
[0030] (2) Preparation of carbon nanotube arrays by thermal chemical vapor deposition and annealing at high temperature:
[0031] Put the silicon single wa...
Embodiment 2
[0037] (1) Pretreatment of silicon single wafer:
[0038] First, the n-type (100) silicon single wafer cut into small pieces of 2cm×2cm was cleaned ultrasonically (50W) in deionized water and absolute ethanol for 5 minutes, and then immersed in hydrofluoric acid with a volume ratio of 4%. After 5 minutes, take it out and dry it in the air, and then carry out energy-carrying silver ion bombardment pretreatment in the silicon single wafer with the clean surface obtained in the metal vapor vacuum arc ion source (MEVVA source). During the bombardment, keep the sample stage rotating at a constant speed. The bias voltage was set to -15 kV, the beam current was 10 mA, and the bombardment time was 10 minutes.
[0039] (2) Preparation of carbon nanotube arrays by chemical vapor deposition:
[0040] Put the silicon single wafer obtained in step (1) into a magnetron sputtering device to deposit a thickness of 5 nanometers of iron catalyst film, then put it into a high temperature quartz...
Embodiment 3
[0046] (1) Pretreatment of silicon single wafer:
[0047] First, the n-type (100) silicon single wafer cut into small pieces of 2cm×2cm was cleaned ultrasonically (50W) in deionized water and absolute ethanol for 5 minutes, and then immersed in hydrofluoric acid with a volume ratio of 4%. After 5 minutes, take it out and dry it in the air, and then carry out energy-carrying silver ion bombardment pretreatment in the silicon single wafer with the clean surface obtained in the metal vapor vacuum arc ion source (MEVVA source). During the bombardment, keep the sample stage rotating at a constant speed. The bias voltage was set to -15 kV, the beam current was 10 mA, and the bombardment time was 10 minutes.
[0048] (2) Preparation of carbon nanotube arrays by chemical vapor deposition:
[0049] Put the silicon single wafer obtained in step (1) into a magnetron sputtering device to deposit a thickness of 5 nanometers of iron catalyst film, then put it into a high temperature quartz...
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