Residue-free adhesive material suitable for PC plastic material and preparation method thereof
A non-residue technology for adhesive materials, applied in the direction of adhesives, film/sheet adhesives, epoxy resin glue, etc., can solve the problems of residual glue marks, serious problems, etc.
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[0039] Such as figure 2 As shown, a method for preparing a residue-free adhesive material suitable for PC plastic materials in one embodiment includes the following steps:
[0040] S110, providing a polymer plastic substrate.
[0041] In this embodiment, the thickness of the polymer plastic substrate 110 is 0.5 mm to 1.2 mm; of course, in other embodiments, the thickness of the polymer plastic substrate 110 can also be other values, the polymer plastic The thickness of the base material 110 can be adjusted according to actual needs; the polymer plastic base material 110 has good physical and mechanical properties and chemical properties, and can meet the requirements of bending, stretching, puncturing, etc. in practical applications, and can be combined with the adhesive layer 120 to perform firm bonding and prevent delamination from the adhesive layer 120 during peeling. The polymer plastic substrate 110 can be a high-density polyethylene plastic substrate, a high-density ...
Embodiment 1
[0059] Provide a polymer plastic substrate with a thickness of 0.5mm. The material of the polymer plastic substrate is a high-density polyethylene plastic substrate.
[0060] At a temperature of 170°C, add polydiphenol-based propane type epoxy resin, polymers of methyl acrylate and butyl acrylate, and polyurethane into the reaction kettle, and stir evenly at a speed of 120 rpm for 1.5 hours until complete Melt, then lower the temperature to 50°C, then add azobisisobutyronitrile, starch, nano-titanium dioxide particles, fatty acid, methyl hydroxyethyl cellulose, acetic acid, citric acid, N-phenyl-β-naphthylamine And the mixture of benzophenone functional group compound stabilizer, continue to mix and stir 1.5h to molten state, obtain adhesive; Wherein, described polydiphenol-based propane type epoxy resin, described methyl acrylate and butyl acrylate Polymer, the polyurethane, the azobisisobutyronitrile, the starch, the nano titanium dioxide particles, the fatty acid, methyl h...
Embodiment 2
[0064] Provide a polymer plastic substrate with a thickness of 0.6mm. The material of the polymer plastic substrate is a high-density polyvinyl chloride plastic substrate.
[0065] At a temperature of 170°C, add poly-o-cresol formaldehyde polyepoxy resin, butyl acrylate, dimethylaminoethyl acrylate and polyurethane into the reaction kettle, and stir evenly at a speed of 120 rpm for 1.5 hours To complete melting, then lower the temperature to 50°C, then add sodium bicarbonate, starch, nano zinc oxide particles, fatty acid, methyl hydroxyethyl cellulose, acetic acid, citric acid, N-phenyl-β-naphthylamine And the mixture of benzophenone functional group compound stabilizer, continue to mix and stir 1.5h to molten state, obtain adhesive; The polymer of amino ethyl ester, the polyurethane, the sodium bicarbonate, the starch, the nano zinc oxide particles, the fatty acid, methyl hydroxyethyl cellulose, acetic acid, citric acid, N-phenyl - The mass of the mixture of β-naphthylamine...
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Abstract
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