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Preparation method for resin binder and diamond grinding tool with homogeneous microstructure

A bonding agent and diamond technology, applied in metal processing equipment, grinding/polishing equipment, abrasives, etc., can solve problems such as low grinding efficiency, clogging of abrasive tools, burnt workpieces, etc., and achieve high grinding efficiency and processing surface accuracy High, conducive to the effect of chip removal

Inactive Publication Date: 2019-01-15
HENAN UNIVERSITY OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The surface porosity of the resin bonded diamond grinding tool is very low or even has no pores. When grinding difficult-to-machine materials, it is easy to burn the workpiece, block the grinding tool, and reduce the grinding efficiency.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] a. The phenolic resin binder is surface treated with a mixed solution of silane coupling agent and sodium lauryl sulfate.

[0029] b. Diamond abrasives are surface treated with a mixed solution of silane coupling agent and sodium lauryl sulfate.

[0030] c. Mix the bonding agent in a and the diamond abrasive in b for 45-60 minutes.

[0031] d. The glass hollow microspheres are specially treated with a surfactant, so that the surface is evenly coated with a layer of fly ash.

[0032] e. Pour the homogeneously mixed material in the above step c into the homogeneously mixed material in step d for mixing.

[0033] f. Put asbestos fiber, graphite powder, copper powder, and chromium oxide into the material that has been mixed uniformly in the above step e.

[0034] g. Mix the uniform material in the above step f according to the volume of the mold 8*8*100mm 3 , the molding density is 1.8g / cm 3 After the material is fed, the mold is loaded and hot-pressed, that is, the tem...

Embodiment 2

[0037] a. The phenolic resin binder is surface treated with a mixed solution of silane coupling agent and sodium lauryl sulfate.

[0038] b. Diamond abrasives are surface treated with a mixed solution of silane coupling agent and sodium lauryl sulfate.

[0039] c. Mix the bonding agent in a and the diamond abrasive in b for 45-60 minutes.

[0040] d. The glass hollow microspheres are specially treated with a surfactant, so that the surface is evenly coated with a layer of fly ash.

[0041] e. Pour the homogeneously mixed material in the above step c into the homogeneously mixed material in step d for mixing.

[0042] f. Add asbestos fiber, graphite powder, copper powder, zinc oxide, vanadium pentoxide, and molybdenum disulfide to the uniformly mixed material in the above step e.

[0043] g. Mix the uniform material in the above step f according to the volume of the mold 8*8*100mm 3 , the molding density is 1.8g / cm 3 After the material is fed, the mold is loaded and hot-pre...

Embodiment 3

[0046] a. The polyimide resin binder is surface treated with a mixed solution of oleic acid, sulfonated castor oil, and silane coupling agent.

[0047] b. Diamond abrasives are surface treated with a mixed solution of oleic acid and silane coupling agent.

[0048] c. Mix the bonding agent in a and the diamond abrasive in b for 45-60 minutes.

[0049] d. The ceramic hollow ball is specially treated with a surfactant so that its surface is uniformly coated with a layer of fly ash.

[0050] e. Pour the homogeneously mixed material in the above step c into the homogeneously mixed material in step d for mixing.

[0051] f. Add asbestos fiber, graphite powder, copper powder, zinc oxide, vanadium pentoxide, and molybdenum disulfide to the uniformly mixed material in the above step e.

[0052] g. Mix the uniform material in the above step f according to the volume of the mold 8*8*100mm 3 , the molding density is 2.0g / cm 3 After the material is fed, the mold is loaded and hot-press...

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Abstract

The invention discloses a preparation method for a resin binder and diamond grinding tool with a homogeneous microstructure and belongs to the technical field of abrasives, grinding tools and grinding. The preparation method comprises the main steps that a resin binder and a diamond abrasive are treated with surfactant and then are mixed, and then the mixture is mixed with glass hollow microspheres or ceramic hollow spheres evenly coated with a layer of coal ash; filler is put in; die filling is conducted, and hot press molding is adopted; and finally with-die solidification is conducted, andthe resin binder and diamond grinding tool with the homogeneous microstructure is obtained. The preparation method has the beneficial effects that the grinding tool is provided with homogeneous air holes, and chip removal and chip holding are facilitated for the grinding tool; and the grinding tool is high in holding force, good in sharpness and high in grinding efficiency and has a good blade sharpening effect, and workpiece surface machining precision is high.

Description

Technical field [0001] The patent of the invention belongs to the technical field of abrasive abrasives and grinding, in particular to a method for preparing a resin-bonded diamond abrasive with a homogeneous microstructure. Background technique [0002] Diamond grinding tools have the advantages of high grinding efficiency, long service life, and high precision of processed workpieces, and are widely used in aerospace, mold manufacturing, electronic devices, optical materials, medical devices and other fields. At present, resin bonded diamond abrasives are the most widely used among diamond abrasives. Compared with metal bonded diamond abrasives and vitrified bonded diamond abrasives, they have low hardening temperature, high abrasive sharpness, and The advantages of high surface finish. In addition, it also has the advantages of short production cycle, simple production equipment, less energy consumption, and low cost. [0003] The disadvantages of resin bonded diamond a...

Claims

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Application Information

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IPC IPC(8): B24D3/32B24D3/28B24D3/34B24D18/00
CPCB24D3/285B24D3/32B24D3/344B24D18/0009
Inventor 栗正新王丽晶余威
Owner HENAN UNIVERSITY OF TECHNOLOGY
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