Electronic pouring sealant and preparation method thereof

A potting glue and electronic technology, applied in the field of potting glue, can solve the problems of low thermal conductivity, easy bubbles, poor flame retardancy and bonding performance in potting operation, and achieve increased chemical stability and mechanical mechanics. Excellent performance, waterproof and thermal conductivity, and the effect of improving thermal conductivity

Inactive Publication Date: 2019-01-29
湖州晶合化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a kind of electronic encapsulant and its preparation method, the preparation method is simple, low in equipment requirements, and low in cost; the encapsulant prepared by this method overcomes the air bubbles of polyurethane materials , Complicated potting operations and the problems of low thermal conductivity, poor flame retardancy and bonding performance of silicone materials, combining the excellent properties of the two types of materials, it has high temperature resistance, insulation, sealing, waterproof thermal conductivity and flame retardancy excellent features

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] An electronic potting adhesive, which consists of component A and component B in a weight ratio of 100:13,

[0025] The A component includes the following raw materials in weight percentage: 40 parts of tetramethyltetravinylcyclotetrasiloxane, 20 parts of vinyltrimethoxysilane, 5 parts of (4-vinylphenyl)methanol, 40 parts of polyurethane , 10 parts of nano-silicon carbide, 3 parts of perfluoro-n-propyl vinyl ether;

[0026] The B component includes the following raw materials in weight percentage: 0.2 parts of KOH, 2 parts of benzoin dimethyl ether, and 50 parts of polyurethane;

[0027] Preferably, the polyurethane is cast polyurethane;

[0028] A preparation method for electronic potting glue, comprising the steps of:

[0029] (1) Preparation of component A: tetramethyltetravinylcyclotetrasiloxane, vinyltrimethoxysilane, (4-vinylphenyl)methanol, perfluoron-propyl vinyl ether, polyurethane, Nano-silicon carbide was pumped and stirred for 30 minutes at room temperatu...

Embodiment 2

[0033] An electronic potting adhesive, which consists of component A and component B in a weight ratio of 100:5,

[0034] The A component includes the following raw materials in weight percentage: 43 parts of tetramethyltetravinylcyclotetrasiloxane, 25 parts of vinyltrimethoxysilane, 6 parts of (4-vinylphenyl)methanol, 43 parts of polyurethane , 15 parts of nano-silicon carbide, 4 parts of perfluoro-n-propyl vinyl ether;

[0035] The B component includes the following raw materials in weight percentage: 0.4 parts of NaOH, 4 parts of thiopropoxythioxanthone, and 55 parts of polyurethane;

[0036] Preferably, the polyurethane is cast polyurethane;

[0037] A preparation method for electronic potting glue, comprising the steps of:

[0038] (1) Preparation of component A: tetramethyltetravinylcyclotetrasiloxane, vinyltrimethoxysilane, (4-vinylphenyl)methanol, perfluoron-propyl vinyl ether, polyurethane, Nano-silicon carbide was pumped and stirred for 40 minutes at room temperat...

Embodiment 3

[0042] An electronic potting adhesive, which consists of component A and component B in a weight ratio of 100:16,

[0043] The A component includes the following raw materials in weight percentage: 47 parts of tetramethyltetravinylcyclotetrasiloxane, 26 parts of vinyltrimethoxysilane, 7 parts of (4-vinylphenyl)methanol, 46 parts of polyurethane , 17 parts of nano-silicon carbide, 5 parts of perfluoro-n-propyl vinyl ether;

[0044] The B component includes the following raw materials in weight percentage: 0.2 parts of tetramethylammonium hydroxide, 3 parts of α,α-dimethoxy-α-phenylacetophenone, 57 parts of polyurethane;

[0045] Preferably, the polyurethane is cast polyurethane;

[0046] A preparation method for electronic potting glue, comprising the steps of:

[0047] (1) Preparation of component A: tetramethyltetravinylcyclotetrasiloxane, vinyltrimethoxysilane, (4-vinylphenyl)methanol, perfluoron-propyl vinyl ether, polyurethane, Nano-silicon carbide was pumped and stirre...

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Abstract

The invention discloses an electronic pouring sealant and a preparation method thereof. The electronic pouring sealant is composed of a component A and a components B according to weight ratio of 100:13-18, wherein the component A comprises, by weight, 40-50 parts of tetravinyl tetramethyl cyclotetrasiloxane, 20-30 parts of vinyltrimethoxysilane, 20-30 parts of (4-vinylphenyl)methanol, 40-50 partsof polyurethane, 10-20 parts of nano silicon carbide, and 3-5 parts of perfluoropropoxyethylene; the component B comprises, by weight, 0.2-0.5 parts of a catalyst, 2-5 parts of a photo-initiator, and50-60 parts of polyurethane. The preparation method includes: at normal temperature, uniformly mixing the components A and B according to ratio; defoaming the mixture under vacuum degree of 0.08-0.15MPa for 15-20 min; then irradiating the mixture with ultraviolet light, wavelength being 210-250 nm, for 30-40 min for curing and shaping the mixture to obtain the pouring sealant. The pouring sealant has excellent mechanical, insulating, sealing, waterproof, heat-conductive and flame-retarding performances.

Description

technical field [0001] The invention relates to the technical field of potting glue, in particular to an electronic potting glue and a preparation method thereof. Background technique [0002] With the advancement of science and the development of the economy and society, the fields of electronics, electrical components, machinery, and light industry continue to grow stronger. The requirements for product components in these fields are becoming more and more lightweight, high performance, and high standardization. The potting adhesive for bonding, sealing, potting and coating protection of electronic components also puts forward higher requirements, not only requiring high temperature resistance, insulation, sealing, waterproof and low environmental pollution, stress relief, etc., but also It also has good thermal conductivity and flame retardancy. [0003] At present, the most commonly used potting materials are various synthetic polymers, the most common ones are epoxy re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J11/04C09J11/06
CPCC09J4/06C09J11/04C09J11/06
Inventor 杨俊
Owner 湖州晶合化工有限公司
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