Resist underlayer film forming composition containing compound having hydantoin ring
A technology of resist lower layer and photoresist layer, which is applied in the direction of organic chemistry, photographic plate-making process of pattern surface, photosensitive material used in optomechanical equipment, etc., and can solve the problem that resist pattern cannot be formed , to achieve the effects of reduced sublimation content, thermal sublimation suppression, and high dry etching speed
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[0072] Hereinafter, specific examples of the resist underlayer film-forming composition of the present invention will be described using the following synthesis examples and examples, but the present invention is not limited thereto.
[0073] The apparatus etc. used for the measurement of the weight average molecular weight of the compound obtained in the following synthesis example are shown.
[0074] Device: HLC-8320GPC manufactured by Tosoh Corporation)
[0075] GPC column: KF-803L, KF-802, KF-801 (manufactured by Showa Denko Co., Ltd.)
[0076] Column temperature: 40°C
[0077] Solvent: THF
[0078] Flow: 1.0mL / min
[0079] Injection volume: 50μL
[0080] Measurement time: 35 minutes
[0081] Standard sample: Polystyrene (manufactured by Showa Denko Co., Ltd.)
[0082] Detector: RI
[0083]
[0084] Under a nitrogen atmosphere, 30.0 g of triglycidyl isocyanurate (manufactured by Nissan Chemical Industries, Ltd.), 1-hydroxymethyl-5,5-dimethylhydantoin (Tokyo Kasei...
Embodiment 2
[0095] 0.017 g of 5-sulfosalicylic acid (manufactured by Tokyo Chemical Industry Co., Ltd.), containing 0.017 g of the compound obtained in Synthesis Example 1 above, was mixed with 3.42 g of a solution (the solvent used in the synthesis was PGME) containing 0.51 g of the compound obtained in Synthesis Example 1 above. 0.63 g of a solution of 0.18 g of the compound obtained in 2 (the solvent is PGME used during synthesis), and 0.00051 g of a surfactant (DIC Co., Ltd., trade name: R-30N), 14.06 g of PGME, and 1.88 g of PGMEA, A solution containing 3.54% by mass of mixing components other than the solvent was prepared. This solution was filtered using a polytetrafluoroethylene microfilter with a pore diameter of 0.2 μm to prepare a composition for forming a resist underlayer film.
Embodiment 3
[0097] 1,3,4,6-Tetrakis(methoxymethyl)glycoluril (Mitsui Cytech Co., Ltd. ), product name: Paudarlink 1174) 0.44 g, 5-sulfosalicylic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) 0.22 g, 10.94 g of a solution containing 3.09 g of the compound obtained in Synthesis Example 2 above (solvent: PGME used during synthesis), and surfactant (DIC Co., Ltd., trade name: R-30N) 0.0088g, PGME245.22g, and PGMEA33.74g, made a solution of 3.60% by mass of the mixed components except the solvent . This solution was filtered using a polytetrafluoroethylene microfilter with a pore diameter of 0.2 μm to prepare a composition for forming a resist underlayer film.
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