Copper-based contact material with microscopic orientation structure and preparation method of copper-based contact material

A contact material, copper-based technology, applied in contacts, electrical components, circuits, etc., can solve the constraints of plasticity and toughness of copper-based contact materials, performance advantages cannot be fully utilized, electrical conductivity and thermal conductivity cannot be realized, etc. problems, to achieve considerable application prospects, excellent electrical and thermal conductivity, and good high-temperature mechanical properties

Active Publication Date: 2019-03-19
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the performance advantages of the current copper-based contact materials cannot be fully utilized in the actual use direction
Meanwhile, although the two phases are interconnected in three-dimensional space, the path of communication in either direction is very narrow and tortuous, thus failing to achieve good electr

Method used

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  • Copper-based contact material with microscopic orientation structure and preparation method of copper-based contact material
  • Copper-based contact material with microscopic orientation structure and preparation method of copper-based contact material
  • Copper-based contact material with microscopic orientation structure and preparation method of copper-based contact material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] In this example, a copper / chromium contact material with a microscopic oriented structure is prepared, and the raw materials used include metal chromium powder (average particle diameter is 600 nm), water, hydroxypropyl methylcellulose powder (average particle diameter is 180 μm ), polyethyleneimine and pure copper block for infiltration, the specific preparation process is as follows:

[0030] (A) slurry preparation

[0031] Weigh 120g of water and add it to a 500ml plastic jar, add 480g of metal chromium powder, 6g of hydroxypropyl methylcellulose powder and 9.6g of polyethyleneimine to the jar in turn, and drop 5 drops of Foaming agent (about 0.3ml), this defoaming agent is the XPM-120 type defoaming agent that Nanjing Huaxing Defoamer Co., Ltd. produces, stirs 5min to make slurry evenly disperse, then in slurry, add diameter is 3mm, 6mm, 6 zirconia grinding balls of 10mm and 12mm respectively, after sealing the bottle cap on the jar, place it on a roller ball mill ...

Embodiment 2

[0040] In this example, the copper / chromium contact material with a microscopic oriented structure is prepared, the raw materials used are the same as in Example 1, and the specific preparation process differs from Example 1 in that the amount of water added in the slurry preparation process The mass is 100g, the mass of the metal chromium powder is 600g, the mass of the hydroxypropyl methylcellulose powder is 5g, and the mass of polyethyleneimine is 12g, and the rest of the operations are the same as in Example 1.

[0041] The copper / chromium contact material with microscopic directional structure can be prepared through the above process, and its microstructure can be seen in image 3 , the volume fraction of chromium in this material is 52%, and the corresponding mass fraction is 47%.

Embodiment 3

[0043] In this example, a copper / tungsten carbide contact material with a microscopic oriented structure was prepared, and the raw materials used included tungsten carbide powder (average particle size: 1 μm), water, polyvinyl alcohol (average particle size: 100 μm), polyacrylic acid And pure copper block for infiltration, the specific preparation process is as follows:

[0044] (A) slurry preparation

[0045] The operation of this step is basically the same as step (A) in Example 1, except that the type and amount of raw materials used are specifically: 400 g of tungsten carbide powder, 100 g of water, 5 g of polyvinyl alcohol, and 8 g of polyacrylic acid.

[0046] (B) Freeze casting and vacuum freeze drying

[0047] The operation of this step is the same as step (B) in Example 1.

[0048] (C) Organic matter removal and skeleton sintering

[0049] According to the same operation of step (C) in Example 1, the organic matter in the green body obtained after vacuum freeze-dry...

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Abstract

The invention belongs to the field of metal-based composite materials, and particularly discloses a copper-based contact material with a microscopic orientation structure and a preparation method of the copper-based contact material. The material is prepared by compounding a matrix phase (copper or copper alloy) with a mass fraction of 5%-85% and a second phase (chromium, chromium alloy, tungstencarbide or silicon carbide), and the two phases are microscopically arranged alternately in the freezing direction of a preparation process. The material is prepared by the technological processes ofslurry preparation, freeze casting and vacuum freeze drying, organic matter removal and skeleton sintering and skeleton infiltration, and the content of the two phases in the material is controlled byadjusting the slurry ratio. The copper-based contact material has good plasticity and toughness and high-temperature mechanical properties, and particularly exhibits excellent electrical and thermalconductivity in the microstructure direction, and thus the use effect of a contact is expected to be significantly improved, and energy consumption is reduced.

Description

technical field [0001] The invention belongs to the field of metal-based composite materials, in particular to a copper-based contact material with a microscopic directional structure and a preparation method thereof. Background technique [0002] The contact is the contact part of electrical switches, circuit breakers, relays and other electrical appliances. It is responsible for the task of connecting, disconnecting, carrying and isolating the circuit. Its quality and performance directly affect the performance and stability of the switchgear. , thus affecting the normal operation of electrical equipment and even the entire electrical system. Copper-based composite material is a kind of contact material that is widely used at present. Generally, copper or copper alloy is used as the matrix phase, and tungsten, chromium, tungsten carbide and other high-melting point metals or compounds are used as the second phase. The two phases are mixed with each other microscopically. ...

Claims

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Application Information

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IPC IPC(8): B22F3/22B22F3/26B22F3/10C22C1/05H01H1/025
CPCB22F3/1021B22F3/222B22F3/26C22C1/0425C22C1/05H01H1/025
Inventor 刘增乾谈国旗张哲峰
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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