Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Waste processing device based on two-sided micro-duct dielectric barrier discharge

A technology for dielectric barrier discharge and waste treatment, applied in gas treatment, light water/sewage treatment, membrane technology, etc. It can avoid the problems of slow mass transfer with the liquid phase, and achieve the effect of avoiding spark discharge, low cost and rapid diffusion.

Pending Publication Date: 2019-03-22
CHONGQING TECH & BUSINESS UNIV
View PDF3 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the temperature of the discharge space is too high, the decomposition rate of active substances generated by discharge in the discharge space will be too fast, and the active substances used for pollutant removal will decrease, which will eventually lead to a decrease in the efficiency and rate of wastewater and waste gas treatment. Moreover, the traditional dielectric barrier The discharge is mainly in the gas phase, which makes the plasma technology have the problem of slow mass transfer between the plasma and the liquid phase in the process of wastewater treatment
In addition, when dielectric barrier discharge is used in industry, the gas will stay in the discharge space for a long time due to objective reasons, resulting in a large amount of active substances produced by discharge being decomposed by subsequent discharges, further reducing the production efficiency of active substances and the removal efficiency of pollutants
[0006] At present, in order to solve the high temperature problem in the dielectric barrier discharge process, cooling units are installed in the reactor, including jacket water cooling, enhanced air cooling, liquid nitrogen cooling, etc., resulting in complex structure of the device, increased volume, increased energy consumption, and high efficiency. In order to solve the problem of slow mass transfer between plasma and liquid phase in the dielectric barrier discharge process, a bubbling component is set in the reactor, but there are still some problems in practical applications; for industrial dielectric barrier Due to the long residence time of gas in the discharge space, no better solution has been found.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Waste processing device based on two-sided micro-duct dielectric barrier discharge
  • Waste processing device based on two-sided micro-duct dielectric barrier discharge
  • Waste processing device based on two-sided micro-duct dielectric barrier discharge

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0032] Example: see Figure 1-3 : A waste treatment device based on double-sided microchannel dielectric barrier discharge, which includes a water tank 1, a discharge assembly 2 and a microchannel assembly 3.

[0033] The water inlet of the water tank 1 is connected to the water inlet pipe 1-1, and the water outlet of the water tank 1 is connected to the water outlet pipe 1-2.

[0034] The water tank 1 is grounded or a ground electrode 2-6 is arranged in the water tank 1 . Specifically, when the water tank 1 is made of conductive material, the water tank 1 may be grounded. And when the water tank 1 is non-conductive, the ground electrode 2-6 is arranged in the water tank 1.

[0035]The water tank 1 is grounded or a ground electrode 2-6 is arranged in the water tank 1; the discharge assembly 2 includes a high voltage electrode 2-1 and an insulating medium 2-2, and the insulating medium 2-2 is arranged in the water tank 1, The insulating medium 2-2 has a high-voltage electrod...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a waste processing device based on two-sided micro-duct dielectric barrier discharge. The waste processing device is characterized by comprising a water tank, a discharge component and a micro-duct component, wherein a water outlet of the water tank is connected with a water discharging pipe; the water tank is grounded, or a grounding electrode is arranged in the water tank; the discharge component comprises a high-voltage electrode and an insulating medium, wherein the insulating medium is arranged in the water tank; the insulating medium is provided with a high-voltage electrode containing cavity, and the high-voltage electrode is positioned in the high-voltage electrode containing cavity; the micro-duct component comprises two micro-duct elements and a cover element; the two micro-duct elements and the insulating medium are all positioned in the cover element; in addition, the two micro-duct elements are respectively positioned on two sides of the insulatingmedium; the two micro-duct elements are respectively provided with a plurality of micro-pores; the cover element is provided with a pipeline joint; the pipeline joint is externally connected with an pipeline. According to the waste processing device, refractory organic pollutants can be processed in a self-cooling, high-efficiency and short-process discharge plasma way.

Description

technical field [0001] The invention belongs to the technical field of waste treatment, in particular to a waste treatment device based on double-sided micro-channel dielectric barrier discharge. Background technique [0002] Plasma technology is a new advanced oxidation technology, which integrates free radical oxidation, ozone oxidation, ultraviolet photolysis, high-energy electron bombardment, supercritical effect, local thermal effect, etc. Comprehensive technologies that intersect disciplines such as science. Due to its application value in environmental science, material modification, biomedicine, chemical engineering and other fields, it has gradually become the focus of plasma research. Traditional plasma technology mainly includes corona discharge technology, radio frequency discharge technology, microwave discharge technology, dielectric barrier discharge technology, etc. [0003] In environmental protection, the treatment of refractory organic pollutants has alw...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B01D53/32C02F1/30
CPCB01D53/32C02F1/30B01D2259/818
Inventor 王小平黄秋林
Owner CHONGQING TECH & BUSINESS UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products