Preparation method of an integrated injectable biophotoelectrode microprobe
A photoelectrode and integrated technology, which is applied in the direction of circuits, electrical components, and electrochemical variables of materials, can solve the problems of high cost, wide output wavelength spectrum, complex process, etc. The effect of simple process
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Embodiment 1
[0041] Such as Figures 1 to 6 As shown, this example integrates the photoelectrode of a single semiconductor light-emitting device chip and the microelectrode for cell potential signal recording; the photoelectrode part is sequentially deposited on a sapphire substrate by electron beam thermal evaporation or magnetron sputtering. , n electrodes, traces and pad metal materials, and then use electron beam thermal evaporation or electroplating to deposit bonding metal solder, and then use PECVD to deposit a silicon dioxide insulating layer and pass through the p, n electrodes and pads. method or wet etching method to open the window, and finally use the flip-chip method to bind the semiconductor light-emitting device chip to the reserved p and n electrode positions, and complete the preparation of the photoelectrode through the above steps; After thinning and polishing, use double-side alignment technology to deposit potential signal recording materials, wires and pad metals on ...
Embodiment 2
[0043] as attached Figure 7 As shown, the structure of this device is similar to that of Embodiment 1, the difference is that Embodiment 2 integrates three semiconductor light-emitting device chips, and by integrating multiple semiconductor light-emitting device chips at different positions, it is possible to simultaneously treat nerve cells at different positions in the brain region. Detection and collection of light stimulation and potential signals. This embodiment is not limited to three yellow-light semiconductor light-emitting device chips and the arrangement position of the chips is not limited. If the chip size conditions permit, more semiconductor light-emitting device chips can be integrated to form an array, thereby realizing more positions in the brain area. Simultaneous stimulation and signal detection and acquisition of cells.
Embodiment 3
[0045] Such as Figure 8 As shown, the structure of this device is similar to that of Example 1, the difference is that the microelectrode part and the photoelectrode part of Example 3 are made on different transparent substrates respectively, and this structure has a simple and easy process relative to the manufacturing method of Example 1. Advantages, by fabricating micro-electrodes and photo-electrodes on two different substrates, the difficulty of semiconductor micro-nano processing on the front and back of the same substrate after thinning can be bypassed.
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