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Preparation method of an integrated injectable biophotoelectrode microprobe

A photoelectrode and integrated technology, which is applied in the direction of circuits, electrical components, and electrochemical variables of materials, can solve the problems of high cost, wide output wavelength spectrum, complex process, etc. The effect of simple process

Active Publication Date: 2020-05-01
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Since the yellow LED chip technology is not mature, it is technically difficult to prepare yellow light photoelectrodes by epitaxy on the basis of yellow LED epitaxial wafers, and the luminous efficiency will be affected by the follow-up process, so it is difficult to meet the requirements of halophilic bacteria. Photostimulation Threshold of Rhodopsin (NpHR) Light Sensitive Protein
In addition, for the method of using wavelength conversion substances such as fluorescent powder or quantum dots on the basis of blue light photoelectrodes, there are a series of problems such as large device size affecting biological implantation, high cost, complicated process, low conversion efficiency, and wide output wavelength spectrum. question

Method used

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  • Preparation method of an integrated injectable biophotoelectrode microprobe
  • Preparation method of an integrated injectable biophotoelectrode microprobe
  • Preparation method of an integrated injectable biophotoelectrode microprobe

Examples

Experimental program
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Effect test

Embodiment 1

[0041] Such as Figures 1 to 6 As shown, this example integrates the photoelectrode of a single semiconductor light-emitting device chip and the microelectrode for cell potential signal recording; the photoelectrode part is sequentially deposited on a sapphire substrate by electron beam thermal evaporation or magnetron sputtering. , n electrodes, traces and pad metal materials, and then use electron beam thermal evaporation or electroplating to deposit bonding metal solder, and then use PECVD to deposit a silicon dioxide insulating layer and pass through the p, n electrodes and pads. method or wet etching method to open the window, and finally use the flip-chip method to bind the semiconductor light-emitting device chip to the reserved p and n electrode positions, and complete the preparation of the photoelectrode through the above steps; After thinning and polishing, use double-side alignment technology to deposit potential signal recording materials, wires and pad metals on ...

Embodiment 2

[0043] as attached Figure 7 As shown, the structure of this device is similar to that of Embodiment 1, the difference is that Embodiment 2 integrates three semiconductor light-emitting device chips, and by integrating multiple semiconductor light-emitting device chips at different positions, it is possible to simultaneously treat nerve cells at different positions in the brain region. Detection and collection of light stimulation and potential signals. This embodiment is not limited to three yellow-light semiconductor light-emitting device chips and the arrangement position of the chips is not limited. If the chip size conditions permit, more semiconductor light-emitting device chips can be integrated to form an array, thereby realizing more positions in the brain area. Simultaneous stimulation and signal detection and acquisition of cells.

Embodiment 3

[0045] Such as Figure 8 As shown, the structure of this device is similar to that of Example 1, the difference is that the microelectrode part and the photoelectrode part of Example 3 are made on different transparent substrates respectively, and this structure has a simple and easy process relative to the manufacturing method of Example 1. Advantages, by fabricating micro-electrodes and photo-electrodes on two different substrates, the difficulty of semiconductor micro-nano processing on the front and back of the same substrate after thinning can be bypassed.

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Abstract

The invention relates to the technical field of life science semiconductor chip manufacturing, and relates to an integrated injectable biological photoelectrode microprobe and a manufacturing method thereof. The microprobe includes a semiconductor light emitting device chip photoelectrode and a microelectrode. The front surface of a transparent substrate is integrated by the semiconductor light emitting device chip photoelectrode, and the microelectrode is arranged on the back side of the substrate. Integration of the front side photoelectrode comprises a single or a plurality of semiconductorlight emitting devices, the transparent substrate, p-pole metal, n-pole metal, line and bonding pad metal, metal solder for flip-chip bonding, and an insulating layer. The microelectrode on the backside comprises a signal recording material, the line and bonding pad metal, and the insulating layer. After front and back surface processes of the device are completed, package is performed on the photoelectrode of the semiconductor light emitting device. The manufacturing process is relatively simple, and can realize single-area or multi-area measurement of a brain region, light output in any wavelength with high power density, small size, and high temporal-spatial resolution.

Description

technical field [0001] The invention relates to the technical field of life science semiconductor chip manufacturing, and more specifically relates to a preparation method of an integrated injectable biophotoelectrode microprobe integrating a semiconductor light-emitting device chip and a biosignal recording microelectrode. Background technique [0002] As early as the 1940s, due to the emergence of patch clamp technology, electrophysiological research on the functional activities of cells and the role of neurons in neuronal circuits has begun to emerge. This technology can analyze the physiological activities of cells by applying electrical stimulation and using electrodes made of tungsten metal to collect cell potential change signals. Although this technology can analyze the physiological activities of certain cells, the problems of high stimulation intensity and poor temporal and spatial accuracy caused by electrical stimulation limit the application of this technology i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/12G01N27/30H01L33/48H01L33/52H01L33/36
CPCG01N27/30H01L31/125H01L33/36H01L33/48H01L33/52
Inventor 张佰君温耀辉戴雅琼
Owner SUN YAT SEN UNIV