Antibacterial coating material composition for electronic components

Abstract

The present invention provides an antibacterial coating material composition for electronic components, wherein the antibacterial coating material composition comprises, by weight, 19-32 parts of butyl acrylate, 8-17 parts of methyl methacrylate, 7-18 parts of silicon nitride ceramic powder, 5-11 parts of azobisisobutyronitrile, 13-29 parts of polyvinyl alcohol, 7-12 parts of a dispersant, 5-9 parts of a thickener, 31-38 parts of a bactericide, 4-7 parts of an antifoaming agent, 1-3 parts of a pH value adjuster, 42-59 parts of silicon carbide hollow microspheres, 31-47 parts of a nanometer ZSM-5 molecular sieve, and 17-26 parts of distilled water. According to the present invention, the advantages of the prior art are absorbed; after the external electrode of the electronic component is fired, the surface of the product is coated with the coating material by using the mechanical method, and the high temperature firing is performed, such that the combination of the coating material andthe product is firm, no cracking is generated, and the electrode exposed to the product can be completely covered; and the antibacterial coating material composition for electronic components has functionality so as to further improve the service life of the product.

Description

technical field [0001] The invention relates to the technical field of protection of electronic components, in particular to an antibacterial coating composition for electronic components applied to electronic components. Background technique [0002] Electronic components are components of electronic components and electric small machines and instruments. They are often composed of several parts and can be used in similar products; they often refer to certain parts in industries such as electrical appliances, radios, and instruments, such as capacitors and transistors. The general term for sub-devices such as springs, hairsprings, and springs. Common ones include diodes, etc. [0003] Due to the requirements of product characteristics, the back edge of the existing low-melting point co-fired laminated chip electronic components, that is, the distance between the inner electrode and the edge of the product is getting smaller and smaller. Due to the limitation of processing...

AI Technical Summary

Problems solved by technology

At present, there are roughly two types of protective coatings on the surface. One is based on organic materials, which are mechanically applied to the surface of the product after the outer electrode of the product is fired, and are formed after heating, drying and curing. High temperature firing can not withstand high temperature, the combination of coating and product is not firm; another coating needs to be fired at high temperature (700-900 ℃), after firing, the coating and the porcelain body form a dense overall structure, However, during the firing process, due to the inconsistency of the wettability of the coating material to the product porcelain body and electrode material, and the inherent 15%-20% sintering shrinkage rate of the coating and the volume change rate caused by the thermal expansion of the porcelain body Gap, the coating is easy to crack

At the same time, the coatings of electronic components in the prior art do not have properties such as antibacterial, high temperature resistance, and salt spray resistance.

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