Novel high-temperature-resistant epoxy mold resin preparation method

A technology of epoxy mold and epoxy resin, which is applied in the application field of epoxy resin, can solve the problem of poor yield and quality of bisphenol A epoxy resin, restricting the use range of bisphenol A epoxy resin, and difficult uniformity of curing agent Mixing and other problems, to achieve the effect of long reaction time, increased chance of mutual collision, high withstand voltage value

Pending Publication Date: 2019-08-16
艾普科模具材料(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, in the prior art, dimer fatty acids are generally used to modify bisphenol A epoxy resins. U.S. Patent No. 5,391,652 reports the use of bisphenol A epoxy resins with aliphatic unsaturated C36 dimer acid and stearic acid Under the catalysis of triphenylethyl phosphonate, the high molecular weight modified bisphenol A epoxy resin was obtained, although the modification of bisphenol A epoxy resin with common C36 dimer acid improved the environmental quality to a certain extent. The flexibility and processability of epoxy resin, but the yield and quality of the modified bisphenol A epoxy resin are relatively poor, the high viscosity leads to poor fluidity of the resin, and it is difficult to mix uniformly with the curing agent, and sometimes a diluent has to be added. It may even crystallize at low temperature, which seriously restricts the application range of bisphenol A epoxy resin

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Example 1: In the reaction kettle equipped with a thermometer, condenser and agitator, add the mixing ratio of A component resin and B component curing agent formula, wherein A component resin: aminophenol triglycidyl ether (AFG-90 ) 20-30%, trimethylolpropane triglycidyl ether 25-40%, butanediol diglycidyl ether 10-25%, DGEBA30-40%; among them, component B curing agent: aminomethyl-3, 5, 5, trimethylcyclohexylamine (trade name: isophorone diamine) content: 50-70%, diethyltoluenediamine (DETDA) content: 15-30%, and then under nitrogen protection conditions Stir the mixture, and heat the mixture to 95-100°C at the same time, add a catalyst to carry out the addition reaction, mix 114g of bisphenol A and 3g of glycerol, heat to 50°C, after the bisphenol A is completely dissolved, add 15g of mass Aqueous sodium hydroxide solution with a percentage content of 20% was reacted for 2 hours to obtain a reaction solution, and the above reaction mixture was washed to neutrality, s...

Embodiment 2

[0027]Example 2: In the reaction kettle equipped with a thermometer, condenser and agitator, add the mixing ratio of A component resin and B component curing agent formula, wherein A component resin: aminophenol triglycidyl ether (AFG-90 ) 20-30%, trimethylolpropane triglycidyl ether 25-40%, butanediol diglycidyl ether 10-25%, DGEBA30-40%; among them, component B curing agent: aminomethyl-3, 5, 5, trimethylcyclohexylamine (trade name: isophorone diamine) content: 50-70%, diethyltoluenediamine (DETDA) content: 15-30%, and then under nitrogen protection conditions Stir the mixture, and heat the mixture to 95-100°C at the same time, add a catalyst to carry out the addition reaction, mix 114g of bisphenol A and 3g of glycerol, heat to 50°C, after the bisphenol A is completely dissolved, add 15g of mass Aqueous sodium hydroxide solution with a percentage content of 20% was reacted for 2 hours to obtain a reaction solution, and the above reaction mixture was washed to neutrality, se...

Embodiment 3

[0028] Example 3: In the reaction kettle equipped with a thermometer, a condenser tube and an agitator, add the mixing ratio of the A component resin and the B component curing agent formula, wherein the A component resin: aminophenol triglycidyl ether (AFG-90 ) 20-30%, trimethylolpropane triglycidyl ether 25-40%, butanediol diglycidyl ether 10-25%, DGEBA30-40%; among them, component B curing agent: aminomethyl-3, 5, 5, trimethylcyclohexylamine (trade name: isophorone diamine) content: 50-70%, diethyltoluenediamine (DETDA) content: 15-30%, and then under nitrogen protection conditions Stir the mixture, and heat the mixture to 95-100°C at the same time, add a catalyst to carry out the addition reaction, mix 114g of bisphenol A and 3g of glycerol, heat to 50°C, after the bisphenol A is completely dissolved, add 15g of mass Aqueous sodium hydroxide solution with a percentage content of 20% was reacted for 2 hours to obtain a reaction solution, and the above reaction mixture was w...

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Abstract

The invention discloses a novel high-temperature-resistant epoxy mold resin preparation method, wherein the novel high-temperature-resistant epoxy mold resin comprises a component A resin and a component B curing agent, wherein the component A resin comprises: 20-30% of aminophenol triglycidyl ether (AFG-90), 25-40% of trimethylolpropane triglycidyl ether, 10-25% of butanediol diglycidyl ether, and 30-40% of DGEBA, and the component B curing agent comprises 50-70% of aminomethyl-3,5,5,trimethylcyclohexylamine (trade name: isophorone diamine), and 15-30% of diethyltoluenediamine (DETDA). According to the present invention, by adding an auxiliary agent, bisphenol A, trimethylolpropane triglycidyl ether and hydroxide ions are effectively aggregated so as to increase the chance of the collision between activated molecules, increase the reactivity, and greatly reduce the occurrence of side reactions; and the mixture is heated to a temperature of 95-100 DEG C, a catalyst is added, and an adding reaction is performed, wherein the viscosity of the high-temperature-resistant low-shrinkage mold resin is 250-300 mPa.s, the mixing viscosity is low, the high temperature resistance tg is high, the 500 g reaction time is 180-220 min, and the reaction time is long.

Description

technical field [0001] The invention relates to the technical field of epoxy resin application, in particular to a preparation method of a novel high temperature resistant epoxy mold resin. Background technique [0002] Epoxy resin refers to those resin compounds containing at least two reactive epoxy groups in the molecule. Epoxy resin has many outstanding excellent properties after curing, such as strong adhesion to various materials, especially to metals, It has strong chemical corrosion resistance, high mechanical strength, good electrical insulation, corrosion resistance, etc. In addition, epoxy resin can be cured in a wide temperature range, and the volume shrinkage is small during curing. Bisphenol A ring Oxygen resin is a polymer compound that is condensed by bisphenol A and epichlorohydrin under alkaline conditions, washed with water, and refined from the solvent. The finished product of epoxy resin has good physical and mechanical properties and is resistant to che...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C08G59/32C08G59/38C08G59/50
CPCC08G59/38C08G59/3227C08G59/5026C08G59/5033
Inventor李瑞李敏满洪洋
Owner艾普科模具材料(上海)有限公司