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Low hydroxyl value polyester polyol for fireproof door adhesive

A technology of polyester polyol and low hydroxyl value, applied in the direction of adhesives, etc., can solve the problems of increased processing costs and high energy consumption, and achieve the effects of increasing flexibility, avoiding secondary energy consumption, and increasing flexibility

Inactive Publication Date: 2019-10-25
CHANGZHOU INST OF LIGHT IND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the main liquid components of most solar wafer cutting fluids are linear diols with a molecular weight greater than 150. With the continuous development of the solar photovoltaic industry and the petrochemical industry, various polyol waste liquids will continue to be produced. However, Doing meticulous distillation and purification work not only consumes a lot of energy, but also greatly increases the processing cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1: This example relates to a low hydroxyl value polyester polyol for fire door adhesives. Its components are as follows: 6 Kg of sebacic acid, 6 Kg of trimellitic anhydride, 30 Kg of terephthalic acid, and 20 Kg of neopentyl glycol. , 1,4-cyclohexanedimethanol 6Kg, recovered and vacuum dehydrated solar wafer cutting fluid 23 Kg,

[0020] Monobutyl tin oxide 0.003 Kg, ethyl acetate 8.997 Kg. Among them, the hydroxy value of the solar wafer cutting fluid after the recovery and vacuum dehydration is 700 mg KOH / g, and the water content is 40%.

[0021] The preparation method corresponding to this embodiment is: the recovered and vacuum dehydrated solar wafer cutting fluid, neopentyl glycol, 1,4-cyclohexanedimethanol, sebacic acid, trimellitic anhydride, terephthalic acid and monobutyl Put tin oxide into the polyester reactor; seal the reactor, turn on the stirring and raise the temperature, when the temperature rises to 60 ℃, start vacuuming and dehydration, the vacuum ...

Embodiment 2

[0022] Example 2: The low hydroxyl value polyester polyol involved in this example has the following components by mass: 8 Kg of sebacic acid, 8 Kg of trimellitic anhydride, 32 Kg of terephthalic acid, 12 Kg of neopentyl glycol, 1 , 4-cyclohexanedimethanol 8 Kg, recovered and vacuum dehydrated solar wafer cutting fluid 21.996 Kg, monobutyl tin oxide 0.004Kg, ethyl acetate 10Kg. The hydroxy value of the solar silicon wafer cutting fluid recovered and vacuum dehydrated is 748 mg KOH / g, and the water content is 38%.

[0023] The preparation method corresponding to this embodiment is: the recovered and vacuum dehydrated solar wafer cutting fluid, neopentyl glycol, 1,4-cyclohexanedimethanol, sebacic acid, trimellitic anhydride, terephthalic acid and monobutyl Put tin oxide into the polyester reactor; seal the reactor, turn on the stirring and raise the temperature, when the temperature rises to 60℃, vacuumize and heat dehydration, the vacuum degree is controlled at 0.07MPa, and the de...

Embodiment 3

[0024] Example 3: This example relates to a low hydroxyl value polyester polyol for fire door adhesives. According to the quality, the components are as follows: 6 Kg of sebacic acid, 8 Kg of trimellitic anhydride, 32 Kg of terephthalic acid, new 14 Kg of pentanediol, 6 Kg of 1,4-cyclohexanedimethanol, 25 Kg of solar wafer cutting fluid after recovery and vacuum dehydration, 0.004 Kg of monobutyl tin oxide, and 8.996 Kg of ethyl acetate. Among them, the hydroxy value of the solar wafer cutting fluid after the recovery and vacuum dehydration is 770 mg KOH / g, and the water content is 45%.

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Abstract

The invention relates to a low hydroxyl value polyester polyol for fireproof door adhesive. The low hydroxyl value polyester polyol for fireproof door adhesive is prepared from the components in partsby mass: 6 to 8 parts sebacic acid,6 to 8 partsof trimellitic anhydride, 30 to 32 partsof terephthalic acid, 12 to 20 parts of neopentyl glycol,6 to 8 parts of1,4-cyclohexanedimethanol, 22 to 25 parts ofsolar silicon wafer cutting fluid after recycling and vacuum dehydration, 0.003 to 0.004 part ofcatalyst,and 8 to 10 parts ofsolvent. A related method comprises the following steps that (1) the components,except for the solvent, are put into a polyester reaction vessel; (2) the reaction kettle is sealed, heated up, and dewatered to 80 DEG C; (3) through N2 protection, the temperature continuesto raise to and kept at 226 to 230 DEG C, the acid value of the product for reaction <=1.6 mg KOH / g, and reaction stops when the hydroxyl value is within the range of 35 + / -5 mg KOH / g;and (4) the solvent is added after the temperature is dropped to 58 to 62 DEG C, and the material is discharged through filter pressing after stirring is conducted. The quality of the product is good, the recycled solar energy wafer cutting liquid is used as a part of alcohol reaction raw materials, and environment-friendly, low energy consuming, and reusing values can be realized.

Description

Technical field [0001] The invention belongs to the field of chemical products, and specifically relates to a low hydroxyl value polyester polyol used for making fireproof door adhesives. Background technique [0002] Polyester polyol is one of the important raw materials for the production of polyurethane products. It is a compound with a chain structure that reacts with acid and alcohol and is finally terminated with a hydroxyl group. It is mainly used in adhesives, elastomers, coatings, inks, shoe materials, TPU and synthetic leather and other fields. Polyester polyol is fully biodegradable and will not pollute the environment. It is one of the environmentally friendly materials with more in-depth research and industrialization prospects. [0003] Chinese patent 201810399712.3 discloses a polyester polyol with a low hydroxyl value and a preparation method thereof. Specific steps: In an inert atmosphere, under stirring conditions, mix aromatic dicarboxylic acids or acid anhydri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G63/668C09J167/00
CPCC08G63/668C09J167/00
Inventor 蒋文俊缪双明陈元皓
Owner CHANGZHOU INST OF LIGHT IND TECH