Low hydroxyl value polyester polyol for fireproof door adhesive
A technology of polyester polyol and low hydroxyl value, applied in the direction of adhesives, etc., can solve the problems of increased processing costs and high energy consumption, and achieve the effects of increasing flexibility, avoiding secondary energy consumption, and increasing flexibility
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Embodiment 1
[0019] Example 1: This example relates to a low hydroxyl value polyester polyol for fire door adhesives. Its components are as follows: 6 Kg of sebacic acid, 6 Kg of trimellitic anhydride, 30 Kg of terephthalic acid, and 20 Kg of neopentyl glycol. , 1,4-cyclohexanedimethanol 6Kg, recovered and vacuum dehydrated solar wafer cutting fluid 23 Kg,
[0020] Monobutyl tin oxide 0.003 Kg, ethyl acetate 8.997 Kg. Among them, the hydroxy value of the solar wafer cutting fluid after the recovery and vacuum dehydration is 700 mg KOH / g, and the water content is 40%.
[0021] The preparation method corresponding to this embodiment is: the recovered and vacuum dehydrated solar wafer cutting fluid, neopentyl glycol, 1,4-cyclohexanedimethanol, sebacic acid, trimellitic anhydride, terephthalic acid and monobutyl Put tin oxide into the polyester reactor; seal the reactor, turn on the stirring and raise the temperature, when the temperature rises to 60 ℃, start vacuuming and dehydration, the vacuum ...
Embodiment 2
[0022] Example 2: The low hydroxyl value polyester polyol involved in this example has the following components by mass: 8 Kg of sebacic acid, 8 Kg of trimellitic anhydride, 32 Kg of terephthalic acid, 12 Kg of neopentyl glycol, 1 , 4-cyclohexanedimethanol 8 Kg, recovered and vacuum dehydrated solar wafer cutting fluid 21.996 Kg, monobutyl tin oxide 0.004Kg, ethyl acetate 10Kg. The hydroxy value of the solar silicon wafer cutting fluid recovered and vacuum dehydrated is 748 mg KOH / g, and the water content is 38%.
[0023] The preparation method corresponding to this embodiment is: the recovered and vacuum dehydrated solar wafer cutting fluid, neopentyl glycol, 1,4-cyclohexanedimethanol, sebacic acid, trimellitic anhydride, terephthalic acid and monobutyl Put tin oxide into the polyester reactor; seal the reactor, turn on the stirring and raise the temperature, when the temperature rises to 60℃, vacuumize and heat dehydration, the vacuum degree is controlled at 0.07MPa, and the de...
Embodiment 3
[0024] Example 3: This example relates to a low hydroxyl value polyester polyol for fire door adhesives. According to the quality, the components are as follows: 6 Kg of sebacic acid, 8 Kg of trimellitic anhydride, 32 Kg of terephthalic acid, new 14 Kg of pentanediol, 6 Kg of 1,4-cyclohexanedimethanol, 25 Kg of solar wafer cutting fluid after recovery and vacuum dehydration, 0.004 Kg of monobutyl tin oxide, and 8.996 Kg of ethyl acetate. Among them, the hydroxy value of the solar wafer cutting fluid after the recovery and vacuum dehydration is 770 mg KOH / g, and the water content is 45%.
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Abstract
Description
Claims
Application Information
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