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A preparation method for micron-scale ultra-thin metal sheets used for conductive adhesive fillers

A micron-scale, metal flake technology, applied in metal processing equipment, metal material coating technology, transportation and packaging, etc., can solve the problem of unable to meet the large demand of flake silver powder, uncontrollable shape of nano silver powder, and wide particle size distribution range and other issues, to achieve the effect of low production cost, good uniformity, and controllable thickness and size

Active Publication Date: 2022-04-19
南京柔导科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the concentration of silver particles is low, the cost is high and the yield is low, which cannot meet the large demand for flake silver powder. Increasing the concentration of silver particles in the reaction system will lead to problems such as uncontrollable nano-silver powder morphology and wide particle size distribution range.

Method used

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  • A preparation method for micron-scale ultra-thin metal sheets used for conductive adhesive fillers
  • A preparation method for micron-scale ultra-thin metal sheets used for conductive adhesive fillers
  • A preparation method for micron-scale ultra-thin metal sheets used for conductive adhesive fillers

Examples

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Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 2 Shown is the preparation method for micron-sized ultra-thin metal sheets used for conductive adhesive fillers. The cracking material is protein powder, and the substrate is selected as flexible PET. figure 2 (1) Coating of cracking solution; (2) Natural cracking of the template; (3) Magnetron sputtering of metallic silver; (4) Separation and cleaning of metallic silver microchips.

[0040] Specific steps are as follows:

[0041] (1) Coating of cracking fluid

[0042]Mix protein powder with water and stir to make a cracking solution, in which the mass ratio of protein powder to water is 1:1. The coiled PET flexible substrate was pre-cleaned with ultrasonic waves, dried with nitrogen gas, and loaded on a coating machine for use. Turn on the coating machine, and the PET coil is cleaned by atmospheric plasma sputtering and coated with cracking liquid ( figure 2 shown in step 1). The coil speed is set to 1m / s, and the thickness of the coated cracking...

Embodiment 2

[0051] The present embodiment provides another preparation method for micron-scale ultra-thin metal sheets used for conductive adhesive fillers, the cracking material is nail polish CA600, and the substrate is selected as flexible PEN, wherein (1) coating of cracking liquid; 2) Natural cracking of the template; (3) Magnetron sputtering metal copper and silver; (4) Separating and cleaning the micron-sized copper-silver alloy metal sheet, the specific steps are as follows:

[0052] (1) Coating of cracking fluid

[0053] First, put the nail polish CA600 as cracking solution into a beaker and set it aside. Then the coiled PEN flexible substrate is cleaned by ultrasonic heating, and then dried by nitrogen gas. After drying, plasma cleaning is carried out. After cleaning, it is flatly spread on the coating machine. Install the coating cutter head, and use deionized water to adjust the uniformity of the cutter head. After the uniformity is adjusted, replace it with the cracking solu...

Embodiment 3

[0061] This embodiment provides a kind of preparation method that is used for the micron-scale ultra-thin metal sheet of conductive adhesive filler, and its cracking material is natural egg white aqueous solution, and substrate is selected as rigid glass, wherein (1) coating of cracking liquid; (2) ) natural cracking of the template; (3) magnetron sputtering metal copper; (4) separation and cleaning of micron-sized copper metal sheets, the specific steps are as follows:

[0062] (1) Coating of cracking fluid

[0063] Mix egg white with water, stir, and make a cracking liquid, in which the volume ratio of egg white to water is 2:1~3:1, put it into a beaker, and set it aside. The rigid glass substrate is cleaned by ultrasonic heating, and then dried by nitrogen gas. After drying, plasma cleaning is performed. After cleaning, it is tiled and fixed on the operating table.

[0064] The egg white aqueous solution was drop-coated on one end of the glass, and then scraped with a 40 μ...

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Abstract

The invention provides a method for preparing a micron-scale ultra-thin metal sheet for conductive adhesive, comprising the following steps: (1) coating a cracking liquid on a substrate; (2) controlling temperature, humidity and time to make cracking (3) Deposit the metal film on the cracked template by vacuum coating; (4) Separate the cracked block from the substrate, and then separate the metal film from the cracked Block separation obtains micron-sized ultra-thin metal flakes. The preparation method of the present invention, compared with the traditional mechanical ball milling method, light induction method, template method, chemical reduction method, etc., the method is simple, low in production cost, high in yield, can be industrialized, and is green and pollution-free; the prepared micron-sized super The thin metal sheet has good thickness uniformity, large specific surface area, excellent electrical properties, no impurity atoms are introduced, and the size and thickness of the micron-scale ultra-thin metal sheet can be controlled through different concentrations of cracking fluid, deposition power and time.

Description

technical field [0001] The invention belongs to the field of electronic components, and in particular relates to a preparation method of micron-sized ultra-thin metal sheets used for conductive adhesive fillers. Background technique [0002] The electronic component manufacturing industry is the main component of the electronic component industry and the foundation of the electronic information industry. Its technical level and production capacity directly affect the development of the entire industry. Conductive adhesive has high electrical conductivity, excellent adhesion, weldability and other mechanical properties and has become a key functional material for the production of various electronic components. Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/58C23C14/20B22F1/05B22F9/02
CPCC23C14/0005C23C14/35C23C14/205C23C14/5873B22F9/02B22F1/068
Inventor 高进伟朱燕波刘赛张东伟
Owner 南京柔导科技有限公司
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