Copper-based metal surface tin immersion liquid and application thereof

A base metal, immersion tin technology, applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the need of not achieving the flexibility of the coating, affecting the processing and use of circuit boards, signal transmission and stability. and other problems, to achieve the effect of improving activity and stability, high compactness, and maintaining solderability

Active Publication Date: 2020-02-07
上海天承化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, the Giavani effect of chemical immersion tin will have a certain impact on signal transmission and stability
[0004] CN101705482A discloses an alkylsulfonic acid chemical tin plating solution, which includes the following components: organic sulfonic acid tin salt 1-40g/L, organic acid 5-250g/L, complexing agent 5-300g/L, Reducing agent 20-150g/L, surfactant 0.5-50g/L, antioxidant 0.1-25g/L, noble metal salt 1-500mg/L and brightener 0.5-3g/L, the alkylsulfonic acid chemical tin plating solution Add a large amount of reducing agent and brightener, so the organic content of the prepared coating is high, the coating is brittle, and cannot meet the needs of electronic devices for the flexibility of the coating, so it is su

Method used

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  • Copper-based metal surface tin immersion liquid and application thereof
  • Copper-based metal surface tin immersion liquid and application thereof
  • Copper-based metal surface tin immersion liquid and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0069] Example 1

[0070] This embodiment provides a copper-based metal surface immersion tin solution and a processing method for a printed circuit board:

[0071] The copper-based metal surface tin immersion liquid contains the following components in terms of mass concentration:

[0072]

[0073] The method for processing a printed circuit board provided in this embodiment specifically includes the following steps:

[0074] (1) Pretreatment: After soaking the printed circuit board with an acidic degreasing solution for 1 min at 60°C for degreasing, then at 40°C, using a microetching solution to soak the printed circuit board for 2 minutes for microetching , And control the micro-etching amount to 1.2μm;

[0075] (2) Pre-dipping: Put the printed circuit board pretreated in step (1) in the above copper-based metal surface tin immersion solution at 20°C for 2 minutes to form 0.2 μm on the copper-based surface of the printed circuit board Pre-dip tinned layer;

[0076] (3) Immersion tin...

Example Embodiment

[0079] Example 2

[0080] This embodiment provides a copper-based metal surface immersion tin solution and a processing method for a printed circuit board:

[0081] The copper-based metal surface tin immersion solution contains the following components in terms of mass concentration:

[0082]

[0083]

[0084] The method for processing a printed circuit board provided in this embodiment specifically includes the following steps:

[0085] (1) Pretreatment: After immersing the printed circuit board with acidic degreasing solution for 5 minutes at 40°C for degreasing, then at 30°C, using a microetching solution to soak the printed circuit board for 5 minutes for microetching , And control the amount of micro-etching to 1.5μm;

[0086] (2) Pre-dipping: Put the printed circuit board pretreated in step (1) in the above copper-based metal surface immersion tin solution at 20°C for 3 minutes to form a 0.3μm surface on the copper-based surface of the printed circuit board Pre-dip tin layer;

[...

Example Embodiment

[0089] Example 3

[0090] This embodiment provides a copper-based metal surface immersion tin solution and a processing method for a printed circuit board:

[0091] The copper-based metal surface tin immersion solution contains the following components in terms of mass concentration:

[0092]

[0093]

[0094] The method for processing a printed circuit board provided in this embodiment specifically includes the following steps:

[0095] (1) Pretreatment: After immersing the printed circuit board with acidic degreasing solution for 5 minutes at 40°C for degreasing, then at 30°C, using a microetching solution to soak the printed circuit board for 5 minutes for microetching , And control the amount of micro-etching to 1.5μm;

[0096] (2) Pre-dipping: Put the printed circuit board pretreated in step (1) in the above copper-based metal surface tin immersion solution at 20°C for 1 minute to form 0.2μm on the copper-based surface of the printed circuit board Pre-dip tin layer;

[0097] (3) I...

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Abstract

The invention provides a copper-based metal surface tin immersion liquid and application thereof. The copper-based metal surface tin immersion liquid comprises the following components by mass concentration: 10-200g/L of tin salt, 50-300g/L of a complexing agent, 10-400g/L of organic acid, 1-100g/L of a surfactant, 10-100g/L of an antioxidant and 1-100ppm of precious metal, wherein the complexingagent is a combination of citric acid, thiourea, isothiourea and mercaptan. The copper-based metal surface tin immersion liquid provided by the invention is simple in formula, applicable to horizontalor vertical production processes, easy to control and simple to operate; and the obtained tin surface is uniform and compact and has good multiple weldability.

Description

technical field [0001] The invention belongs to the field of electroless tin plating, and in particular relates to a copper-based metal surface immersion tin solution and an application thereof. Background technique [0002] Tin is a metal with good solderability and corrosion resistance, which is widely used in the electronics industry. With the miniaturization of electronic development, the lines and BGA points on the printed circuit board (PCB) are getting smaller and smaller, tin has been widely used as a solderable coating, and the traditional hot air leveling process can no longer meet the existing process requirements . The chemical immersion tin process has the advantages of excellent multiple solderability, dense coating, simple process flow, and environmental protection, and is widely used. But because the hydrogen evolution potential of tin is high and the catalytic activity is low, if sodium hypophosphite, borohydride, Ti 3+ Reductants such as tin can’t realiz...

Claims

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Application Information

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IPC IPC(8): C23C18/31C23C18/18H05K3/22
CPCC23C18/1844C23C18/31H05K3/22H05K2203/1163
Inventor 刘江波林章清章晓冬童茂军王亚君
Owner 上海天承化学有限公司
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