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Dicing die bonding film

A technology for cutting dies and bonding films, applied in the direction of adhesive types, synthetic resin layered products, film/sheet adhesives, etc., capable of solving problems such as circuit damage, material adsorption, and circuit contamination

Active Publication Date: 2020-02-11
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a high possibility that various problems may occur due to static electricity, for example, a circuit formed on a semiconductor wafer may be destroyed, or a material may be adsorbed on the circuit so that the circuit is contaminated
When these problems occur, there is a problem that the reliability of the final product decreases and the yield rate of the product decreases

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0075] Preparation Example 1: Preparation of (meth)acrylate-based resin

[0076] According to the composition shown in Table 1 below, it will consist of 68.5 parts by weight of 2-ethylhexyl acrylate (2-EHA), 8.5 parts by weight of methyl acrylate (MA) and 23 parts by weight of hydroxyethyl acrylate (HEA). The monomer mixture was placed in a reactor equipped with a cooling system to achieve reflux of nitrogen and easy temperature control.

[0077] Then, based on 100 parts by weight of the monomer mixture, 400 pm of n-DDM as a chain transfer agent (CTA) and 100 parts by weight of ethyl acetate (EAc) as a solvent were added thereto, and nitrogen was injected to remove from the reactor. They were mixed well with each other at 30°C for 30 minutes or more while removing oxygen. Then, the temperature was raised and kept at 62°C, and 300 ppm of V-60 (azobisisobutyronitrile) as a reaction initiator was added thereto to initiate a reaction, followed by polymerization for 6 hours to p...

preparation example 2

[0079] Preparation Example 2: Preparation of Polyurethane Resin

[0080] Adipic acid, ethylene glycol and 1,4-butanediol were reacted in a molar ratio of 1:0.5:0.5 under the conditions of a temperature of 200°C, a reduced pressure of 500mmHg to 760mmHg and a vacuum atmosphere to synthesize polyester polyol .

[0081] Then, the synthesized polyester polyol, chain extender [2,2'-(ethylenedioxy)bis(ethylamine)] and NMP were put into the reactor in the presence of dibutyltin dilaurate, and The temperature was raised to 60°C.

[0082] 1,4-Cyclohexanediisocyanate was added to the reactor so that the sum of the moles of hydroxyl groups contained in the polyester polyol and the chain extender and the moles of isocyanate of 1,4-cyclohexylmethane diisocyanate (CHDI) The ratio is 1:1. After raising the temperature to 80°C, a small amount of cyclohexane diisocyanate was further added thereto and polymerization was performed.

[0083] Then, when the polyurethane having the target vis...

preparation example 3

[0084] Preparation Example 3: Preparation of Polyurethane Resin

[0085] A polyurethane resin was synthesized in the same manner as in Preparation Example 2, except that the 1,4-cyclohexylmethane diisocyanate (CHDI) material was changed to hexamethylene diisocyanate (HDI).

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Abstract

The present invention relates to a dicing die bonding film and a dicing method of a semiconductor wafer using the dicing die bonding film, the dicing bonding film comprising: a substrate; an antistatic layer formed on the substrate and including an aliphatic or alicyclic polyurethane resin and a conductive filler; an adhesive layer formed on the antistatic layer; and an adhesive layer formed on the adhesive layer.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2017-0172472 filed with the Korean Intellectual Property Office on December 14, 2017 and Korean Patent Application No. 10-2018-0081251 filed with the Korean Intellectual Property Office on July 12, 2018 The filing date benefit of , the entire contents of which are incorporated herein by reference. [0003] The present invention relates to dicing die-bonding films, and more particularly, to the ability to impart antistatic properties and reduce the occurrence of static electricity generated during a semiconductor packaging process, thereby improving packaging reliability and preventing damage to semiconductor devices A dicing die-bonding film, and a dicing method of a semiconductor wafer using the dicing die-bonding film. Background technique [0004] In general, processes for manufacturing semiconductor chips include a process of forming fine p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29H01L21/683H01L21/67B32B27/08B32B27/40B32B27/20H01B1/12C09J163/00
CPCH01L21/6836H01L2221/68327H01L2221/68381H01L2221/68377C09J7/29C09J163/00B32B27/08B32B27/40B32B27/20H01B1/124H01L21/67132C09J2203/326C09J2301/208H01L21/78
Inventor 韩智浩金塞拉宋文燮李光珠柳营任
Owner LG CHEM LTD
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