A room temperature rapid vulcanization condensation type heat conduction potting glue and preparation method thereof

A potting glue and condensation-type technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of decreased overall mechanical properties, improved flame retardancy and thermal conductivity, etc., to achieve low production costs, The effect of fast curing and simple preparation method

Active Publication Date: 2021-06-22
中电保力(北京)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides a room-temperature rapid vulcanization condensation type heat-conducting and flame-retardant potting compound and a preparation method thereof, so as to improve the overall comprehensive performance of the existing acetone-removed silicone potting compound, especially to overcome the existing The improvement of flame retardant performance or thermal conductivity of acetone-free silicone potting compound leads to the decline of overall mechanical properties

Method used

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  • A room temperature rapid vulcanization condensation type heat conduction potting glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] a. Clean and preheat the vacuum mixing equipment to 60°C;

[0046] b. Add 35 parts of hydroxyl-terminated polysiloxane with a viscosity of 1500 mps.s and 15 parts of hydroxyl-terminated polysiloxane with a viscosity of 20,000 mps.s, with a solid content of 50% (150°C*2H), MQ 5 parts of SH-MQ silicone resin with a ratio of 0.5-0.8:1 and a specific surface area of ​​300m 2 5 parts per g of hexamethyldisilazane modified fumed silica, 30 parts of the compound of guanidine sulfamate and guanidine polyphosphate, the weight ratio is 4:1, 12.5 parts of aluminum nitride, ultraviolet light 1 part of stabilizer bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, 2 parts of heat stabilizer nanometer ferric oxide with a particle size of 40nm, structure control agent methylbenzene 2 parts of diethoxysilane and 2 parts of defoamer XP-008, and stirred, and heated to 120 ° C, vacuumed to 0.6mpa;

[0047] c. Mix for 2 hours, stop stirring and heating, and store in airtight;

[0048] d. A...

Embodiment 2

[0052] The rest are the same as in Example 1, except that the weight ratio of guanidine sulfamate and guanidine polyphosphate is 2:1.

Embodiment 3

[0054] The rest are the same as in Example 1, except that the weight ratio of guanidine sulfamate and guanidine polyphosphate is 1:1.

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Abstract

The invention provides a room-temperature fast vulcanization condensation type heat-conducting and flame-retardant potting glue and a preparation method thereof. The potting glue includes the following raw materials: hydroxyl-terminated polysiloxane, SH-MQ silicone resin, modified gas phase Silicon dioxide, an organic guanidine flame retardant, a heat conducting agent, a crosslinking agent, an organic guanidine catalyst and a diluent, wherein the organic guanidine flame retardant is a composite of guanidine sulfamate and guanidine polyphosphate. In the present invention, the acetone-free silicone potting compound has excellent flame retardant performance by introducing an organic guanidine flame retardant into the raw material. At the same time, it is unexpectedly found that when the organic guanidine flame retardant is guanidine sulfamate and When the guanidine polyphosphate is compounded, the flame retardant and the organic guanidine catalyst can cooperate with the catalyst to play a catalytic role. At this time, the potting compound can achieve rapid curing, and the deep curing thickness is large. The potting glue prepared by the invention has excellent mechanical properties, simple preparation method, low production cost, easy mass production, environmental protection and no pollution, and is suitable for large-scale industrial production.

Description

technical field [0001] The invention belongs to the field of silicone potting glue, and in particular relates to a room-temperature rapid vulcanization condensation type heat-conducting and flame-retardant potting glue and a preparation method thereof. Background technique [0002] In the electronics industry, in order to improve the stability and reliability of the components and the whole machine, it is often necessary to pot the electronic components or assembly parts. Except for the lead wires or connectors, the whole part is wrapped and sealed by the potting compound. The outside atmosphere is isolated to ensure that the whole machine can still work normally in environments such as vibration, high humidity, drastic temperature changes, and air pollution. The most commonly used potting materials are epoxy resin, polyurethane and silicone rubber. Because silicone rubber has excellent properties such as high and low temperature resistance, weather resistance, moisture res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J11/06C09J11/04
CPCC08K2003/321C08K2201/006C08L2201/02C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J11/06C09J183/04C08L83/04C08K13/06C08K9/06C08K7/26C08K5/31C08K3/32
Inventor 姬振行王少华王宇川
Owner 中电保力(北京)科技有限公司
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