Flexible packaging adhesive film for flexible OLED device

A flexible packaging and adhesive film technology, which is applied in the manufacture of electric solid-state devices, semiconductor devices, semiconductor/solid-state devices, etc., can solve the problems of burnout of the organic light-emitting layer of OLED devices, side leakage of packaged devices, and no heat dissipation layer, etc., to achieve increased Water-blocking and oxygen-blocking properties, solving side leakage, and simplifying the packaging process

Pending Publication Date: 2020-02-21
CHINA LUCKY FILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the encapsulation films currently used for imprinting and encapsulation of flexible OLED devices have the following problems: 1) There is no barrier property, and there is a side leakage problem in the encapsulation devices, and water and oxygen will invade the interior of the device through the encapsulation film and destroy it, affecting its life; 2) There is no heat dissipation layer. When an OLED device is powered on and emits light, a part of the electricity will inevitably be converted into heat, which will then accumulate inside the device. When the temperature of the device gradually rises and the heat cannot be dissipated, the local organic light-emitting layer of the OLED device will burn out, resulting in blackout. even completely ineffective

Method used

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  • Flexible packaging adhesive film for flexible OLED device
  • Flexible packaging adhesive film for flexible OLED device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Choose 50μm PET, first slit-coat a layer of polyurethane organic planarization layer with a thickness of 0.1μm; then use PECVD to plate a layer of 200nm silicon oxide film on its surface; then coat a layer with a thickness of 5μm on its surface An organic water-absorbing layer containing 1wt% calcium oxide; then a layer of 15nm aluminum oxide film is plated on its surface by PECVD; then a heat dissipation layer containing graphene with a thickness of 10 μm is screen-printed on its surface; A pressure-sensitive adhesive layer containing 10wt% alumina barrier particles with a thickness of 1.5 μm is coated on the surface with a microgravure; finally, a PET release film with a thickness of 12 μm is pasted on its surface. The flexible encapsulation adhesive film prepared in this example has a water vapor transmission rate of 5.1×10 -6 g / m 2 24h, the oxygen transmission rate is 3.4×10 -6 cc / m 2 24h atm.

Embodiment 2

[0037] Select 25μm PI, first scrape coat a layer of polyester organic planarization layer with a thickness of 5μm; then use magnetron sputtering to coat a layer of 20nm aluminum oxide film on its surface; then coat a layer of slit coating on its surface An organic water-absorbing layer containing 1wt% barium oxide with a thickness of 0.1 μm; then a layer of 100 nm silicon oxide film is plated on its surface by PECVD; Then, a layer of pressure-sensitive adhesive layer containing 5wt% magnesium oxide with a thickness of 20 μm is scraped on its surface; finally, a PE release film with a thickness of 50 μm is pasted on its surface. The water vapor transmission rate of the flexible packaging film prepared in this example is 4.1×10 -6 g / m 2 24h, the oxygen transmission rate is 3.2×10 -6 cc / m 2 24h atm.

Embodiment 3

[0039] Choose 175μm PET, first slit-coat a layer of acrylic resin organic planarization layer with a thickness of 0.5μm; then use ALD to plate a layer of 100nm silicon oxide film on its surface; then screen print a layer of thickness on its surface. 5 μm organic water-absorbing layer containing 10wt% calcium chloride; then a layer of 50nm silicon nitride film is plated on its surface by PECVD; Then, a layer of pressure-sensitive adhesive layer containing 1wt% boron nitride barrier particles with a thickness of 1.5 μm is scraped on its surface; finally, a PET release film with a thickness of 38 μm is pasted on its surface. The water vapor transmission rate of the flexible packaging film prepared in this example is 3.6×10 -6 g / m 2 24h, the oxygen transmission rate is 2.9×10 -6 cc / m 2 24h atm.

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Abstract

The invention relates to a flexible packaging adhesive film for a flexible OLED device. An organic planarization layer, an inorganic barrier layer, an organic water absorption layer, an inorganic barrier layer, a heat dissipation layer, a barrier pressure-sensitive adhesive layer and a release film are sequentially arranged on the packaging adhesive film on one side of a flexible transparent substrate from inside to outside. According to the flexible packaging adhesive film disclosed by the invention, the heat dissipation layer is introduced into the adhesive film; heat generated in the flexible OLED device is conducted out in time by utilizing the excellent heat conduction performance of the heat dissipation layer; the failure of the device, caused by temperature rise caused by heat accumulation in the device, is avoided; the thermal stability of the OLED device is remarkably improved; by adding barrier filling particles in the pressure-sensitive adhesive, the water and oxygen blocking performance of the adhesive layer is improved; the problem of side leakage of the flexible OLED packaged by the existing imprint lithography is solved; and the water and oxygen stability of the OLEDdevice is remarkably improved. The flexible packaging adhesive film is used for packaging the flexible OLED device, and has a simple process. Reel-to-reel transmission production can be achieved. Therequirements for flexibility and practicability are met. The service life of the packaged device is prolonged by about 40 times.

Description

technical field [0001] The invention relates to the technical field of optoelectronic devices, in particular to a flexible packaging adhesive film for flexible optoelectronic devices (including organic light-emitting diode OLED, organic solar cell OPV, perovskite solar cell PSC, electrochromic device ECD, etc.). Background technique [0002] Flexible electronic technology is considered to be the future of the electronics industry, because flexible electronic products can be bent, stretched, and sometimes even wearable, giving human vital signs data, flexible electronic technology has become an important subject of research by governments of various countries, and many research institutions And companies are pouring money into research into flexible materials. [0003] Flexible OLED technology is a new type of flexible electronic technology. It has the advantages of self-luminescence, lightness, flexibility, surface emission, low power consumption, no heat radiation, energy s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52
CPCH10K50/87H10K50/844
Inventor 侯丽新王亚丽王佳刘贤豪
Owner CHINA LUCKY FILM CORP
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