Thermoplastic conductive silver adhesive containing polymer resin

Abstract

The invention discloses a thermoplastic conductive silver adhesive containing polymer resin. The thermoplastic conductive silver adhesive is composed of the following components: 20-24 parts by mass of zinc phenolic resin, 20-24 parts by mass of epoxy resin, 100-110 parts by mass of electrolytic silver powder, 1-3 parts by mass of a coupling agent, 10-12 parts by mass of quartz sand, 20-24 parts by mass of polyvinyl butyral, 10-12 parts by mass of a curing agent, 3-5 parts by mass of a catalyst, 20-30 parts by mass of a metal mixture, 10-12 parts by mass of ethyl alcohol, 10-12 parts by mass of ethylhexyl glycidyl ether, 20-24 parts by mass of graphite and 8-10 parts by mass of carbon fibers. The invention relates-the technical field of conductive silver adhesives. The thermoplastic conductive silver adhesive containing the polymer resin achieves the purposes of realizing the thermoplasticity of the conductive silver adhesive, improving the recovery rate of the conductive silver adhesive and achieving high heat dissipation efficiency when the conductive silver adhesive works.

Description

technical field [0001] The invention relates to the technical field of conductive silver glue, in particular to a thermoplastic conductive silver glue containing polymer resin. Background technique [0002] Conductive silver glue is, it is usually considered as the main, through the bonding effect of the matrix resin, the conductive particles are combined to form a conductive path, and realize the conductive connection of the adhered materials. Since the matrix resin of the conductive silver adhesive is an adhesive, you can choose a suitable curing temperature for bonding. For example, the epoxy resin adhesive can be cured at room temperature to 150°C, which is much lower than that of tin-lead soldering above 200°C. Soldering temperature, which avoids material deformation, thermal damage of electronic devices and internal stress formation that may be caused by high temperature welding. At the same time, due to the miniaturization and miniaturization of electronic components ...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the present invention provides a thermoplastic conductive silver glue containing polymer resin, which solves the problem that the current conductive silver glue cannot be plasticized and recycled after curing, which is not conducive to the recovery of circuit components and conductive silver glue. At the same time, the traditional The heat dissipation performance of conductive silver glue is poor, which is not conducive to the heat dissipation of circuit components. Long-term heat accumulation will easily cause component aging and low service life.