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A UV-anaerobic dual-mode curing bonding material

A dual-mode, bonding material technology, applied in the direction of non-polymer organic compound adhesives, adhesives, polyether adhesives, etc., can solve the problems of large shrinkage stress and difficult degumming, and achieve small shrinkage stress and low viscosity Effect

Active Publication Date: 2021-12-07
HANGZHOU DIANZI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the content of high molecular weight epoxy acrylate and polyurethane acrylate in this patent composition is greater than 60%, so the shrinkage stress is large, and it is difficult to degumming in hot water

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The raw materials and proportions (parts by weight) of the UV-anaerobic dual mode curing bonding material are as follows:

[0033] 10 parts by weight of hydroxypropyl methacrylate

[0034] 30 parts by weight of hydroxypropyl acrylate

[0035] 15 parts by weight of polyethylene glycol (200) dimethacrylate

[0036] 10 parts by weight of polyethylene glycol (200) diacrylate

[0037] Acryloylmorpholine 24 parts by weight

[0038] 2-Hydroxy-2-methyl-1-phenylacetone (1173) 0.5 parts by weight

[0039] 0.5 parts by weight of cumene hydroperoxide

[0040] N, N-dimethylaniline 0.1 parts by weight

[0041] Mercapto polyethylene glycol acrylate (400) 0.5 parts by weight

[0042] Hydroquinone 1.7 parts by weight

[0043] 8 wt% disodium edetate aqueous solution 0.4 parts by weight.

[0044] Add the above-mentioned components into the reaction kettle in sequence according to the amount, stir evenly, and then fill it into a light-proof container.

Embodiment 2

[0046] The raw materials and proportions (parts by weight) of the UV-anaerobic dual mode curing bonding material are as follows:

[0047] 40 parts by weight of hydroxyethyl methacrylate

[0048] 20 parts by weight of hydroxyethyl acrylate

[0049] 15 parts by weight of polyethylene glycol (400) dimethacrylate

[0050] 15 parts by weight of polyethylene glycol (400) diacrylate

[0051] Acryloylmorpholine 24 parts by weight

[0052] 1-hydroxycyclohexyl phenyl ketone (184) 1.0 parts by weight

[0053] Butanone peroxide 1.0 parts by weight

[0054] Acetyl phenylhydrazine 0.5 parts by weight

[0055] Mercapto polyethylene glycol acrylate (600) 1.0 parts by weight

[0056] 1.7 parts by weight of p-methoxyphenol

[0057] 8 wt% disodium edetate aqueous solution 0.8 parts by weight.

[0058] Add the above-mentioned components into the reaction kettle in sequence according to the amount, stir evenly, and then fill it into a light-proof container.

Embodiment 3

[0060] The raw materials and proportions (parts by weight) of the UV-anaerobic dual mode curing bonding material are as follows:

[0061] 20 parts by weight of hydroxypropyl methacrylate

[0062] 25 parts by weight of hydroxyethyl acrylate

[0063] 12 parts by weight of polyethylene glycol (600) dimethacrylate

[0064] 11 parts by weight of polyethylene glycol (600) diacrylate

[0065] Acryloylmorpholine 19 parts by weight

[0066] 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1 acetone (907) 0.7 parts by weight

[0067] Dicumyl peroxide 0.9 parts by weight

[0068] 0.3 parts by weight of 1,2,3,4-tetrahydroquinoline

[0069] Mercapto polyethylene glycol acrylate (1000) 0.8 parts by weight

[0070] 2,6-di-tert-butyl-p-cresol 1.4 parts by weight

[0071] 8 wt% disodium edetate aqueous solution 0.6 parts by weight.

[0072] Add the above-mentioned components into the reaction kettle in sequence according to the amount, stir evenly, and then fill it into a light-proo...

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Abstract

The invention discloses a UV-anaerobic dual-mode curing bonding material. The raw materials and proportions (parts by weight) thereof are as follows: 10-40 parts by weight of hydroxy methacrylate; 20-30 parts by weight of hydroxy acrylate Parts; 10-15 parts by weight of polyethylene glycol methacrylate; 10-15 parts by weight of polyethylene glycol acrylate; 17-24 parts by weight of acryloyl morpholine; 0.5 parts by weight of free radical initiator ~1 part by weight; 0.5~1.0 parts by weight of oxidizing agent; 0.1~0.5 parts by weight of reducing agent; 0.5~1.0 parts by weight of adhesion promoter; 1.0~1.7 parts by weight of polymerization inhibitor; stable Agent 0.4~0.8 parts by weight. The invention has the characteristics of low viscosity, small shrinkage stress, proper bonding strength and easy degumming in hot water.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, in particular to a method for preparing a UV-anaerobic dual-mode curing adhesive material. Background technique [0002] UV curing adhesive refers to a type of one-component adhesive that undergoes intermolecular polymerization and cross-linking and curing under UV light irradiation. UV curing adhesive was developed in the 1950s. It has the characteristics of high efficiency, energy saving, environmental protection, fast and one-component. Once it came out, it aroused extensive interest and research of material scientists. However, the curing reaction time of UV-curable adhesives is very short, which makes the volume shrinkage rate more obvious after curing. In addition, for the bonding of glass cutting materials with low transparency or complex geometric curves, the curing of UV-curable adhesives and hot water degumming are difficult to complete. [0003] Invention patent of Tianjin ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J171/02C09J4/02C09J11/06C09J11/08
CPCC08L2205/025C09J4/00C09J11/06C09J11/08C09J171/02C08L71/02C08K5/37
Inventor 聂秋林
Owner HANGZHOU DIANZI UNIV
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