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Ceramic micro-crack repairing method

A repair method, ceramic micro technology, applied in the field of repair of ceramic materials, can solve problems such as repair after breakage, achieve the effects of increasing the use limit, promoting environmental protection, and reducing the defective rate

Active Publication Date: 2020-06-26
NANJING INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a ceramic microcrack repair method to solve the problem of repairing ceramic cracks in the prior art only for macro cracks, which belongs to the problem of post-break repair

Method used

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  • Ceramic micro-crack repairing method

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Experimental program
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Effect test

Embodiment 1

[0030] A method for repairing ceramic microcracks, comprising the steps of:

[0031] Use the non-destructive testing process to find and extract the size characteristic parameters of the micro-cracks 2 on the ceramic part 1, especially the depth value of the micro-cracks 2; the ceramic part 1 can be a boride ceramic part, an oxide ceramic part, a nitride ceramic part or Carbide ceramic parts;

[0032] Under the condition of vacuum or inert gas protection, the micro-crack 2 area is processed into micro-holes 3 through the fiber laser processing process. The fiber laser 4 is required in the fiber laser processing process. The parameters of the fiber laser 4 are based on the size characteristics of the micro-crack 2 In the fiber laser processing process, the processing power is 0.1-10W, the processing frequency is 1-1000 times, and the processing speed is 0.1-100mm / s; the micro-hole 3 is a blunt hole, such as a hemispherical hole, a semi-ellipse Shaped holes, the tip radius of t...

Embodiment 2

[0039] a ZrB 2 -SiC ceramic micro-crack repair method, comprising the following steps:

[0040] Step 1: Indentation method on ZrB 2 -SiC ceramic sample (3×4×36mm 3 ) artificially introduce micro-cracks 2 on the surface, polish and remove the indentation pit, leaving only semi-circular micro-cracks 2, the length and depth of micro-cracks 2 obtained by CT non-destructive testing are about 50 μm and 25 μm, respectively;

[0041] Step 2: Using the fiber laser processing parameters of processing power of 3W, processing times of 5 times, and processing speed of 10mm / s, the microcrack 2 is processed into a microhole with a tip radius of 29 μm, a length of 75 μm, and a depth of 36 μm 3. After polishing with 1000-grit sandpaper, ultrasonic cleaning in acetone medium for 30 minutes;

[0042] Step 3: the cleaned ZrB 2 - SiC ceramic samples were placed in an annealing furnace, annealed at 1200°C for 30 minutes under argon protection, and then cooled to room temperature;

[0043] Step...

Embodiment 3

[0048] A kind of Si 3 N 4 Ceramic microcrack repair method, other operations in this embodiment are the same as in Example 2, the difference is that the length and depth of the microcrack 2 are about 200 μm and 50 μm respectively, the processing power is 5W, the number of processing is 20 times, and the processing speed is 50mm / s fiber laser processing process parameters, the microcrack 2 is processed into a microhole 3 with a tip radius of 49 μm, a length of 480 μm, and a depth of 52 μm. The brazing material 6 is Ag-28Cu, and the brazing process is under the protection of argon. Heat to 760°C at a heating rate of 20°C / min, then hold for 10 minutes, then continue to heat at a heating rate of 10°C / min to 860°C, hold for 5 minutes, and then slowly cool to room temperature with the furnace.

[0049] Measurement of pristine microcrack-free Si by three-point bending test 3 N 4 Ceramic sample, containing semicircular micro-crack Si 3 N 4 Ceramic specimens and repaired Si 3 N ...

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Abstract

The invention discloses a ceramic micro-crack repairing method. The method comprises the following steps: discovering and extracting size characteristic parameters of micro-cracks on a ceramic part byutilizing a nondestructive testing process; processing the micro-crack area into micro-holes by using an optical fiber laser processing procedure; removing burrs on the surface of the optical fiber laser machining area and chipping residues in the micro holes through a polishing and cleaning procedure; removing residual thermal stress of the fiber laser processing area by using a thermal treatment process; filling the micro-holes after the chipping residues are removed with brazing filler metal by utilizing a brazing filler metal coating procedure, and compacting; tightly combining the brazing filler metal and the ceramic matrix combined through a brazing procedure; removing excess brazing filler metal reactants through a polishing post-treatment procedure to obtain a repaired smooth ceramic surface. After the microcracks on the ceramic are repaired through the method, the defective rate in the ceramic production and machining process can be greatly reduced, and the use limit of the repaired ceramic product is greatly improved.

Description

technical field [0001] The invention relates to the technical field of repairing ceramic materials, in particular to a method for repairing ceramic microcracks. Background technique [0002] Ceramic is a kind of brittle material after sintering. Because of its unique molecular structure, ceramic products have high hardness, wear resistance and corrosion resistance. They have very broad application prospects in the fields of aerospace, machinery and technology, but Due to the inherent brittleness of ceramic materials, it is extremely easy to crack at defects. A large number of studies have shown that machining, thermal cycling, mechanical fatigue, corrosion, etc. will introduce microcracks in ceramics, and these microcracks will lead to a significant attenuation of the mechanical properties of the material, resulting in macroscopic damage and catastrophic accidents. How to repair microcracks in ceramics is an urgent problem to be solved. [0003] At present, the repair meth...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/88C04B41/80
CPCC04B41/88C04B41/80C04B41/0036C04B41/0072C04B41/5133C04B41/5127C04B41/5116
Inventor 王安哲查光成孔凡新李振红赵伟凌子涵吴浩肖天
Owner NANJING INST OF TECH
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