Copper-zirconium alloy for electronic component and preparation method of copper-zirconium alloy
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHINALCO MATERIALS APPL RES INST CO LTD
- Publication Date
- 2020-07-14
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Abstract
Description
technical field
[0001] The invention relates to the technical field of nonferrous metal processing, in particular to a copper-zirconium alloy for electronic components and a preparation method thereof. Background technique
[0002] Copper-zirconium alloy has a conductivity as high as 90-95% IACS and has high heat resistance. It is often used as a copper alloy for electronic components such as high-power lead frames and electronic connectors. With the rapid development of high-tech fields such as microelectronics, communications, transportation, aerospace, and aviation, electronic components are also developing in the direction of high integration, miniaturization, and thin-walled, and the transmission volume and heat generation of electronic components are increasing. This puts forward higher requirements for copper alloy materials. In addition to having high electrical and thermal conductivity and heat resistance, it also needs to have high strength. An alloy material with ...