Browning liquid used for printing circuit board

A printed circuit board and browning liquid technology, which is applied in the secondary treatment of printed circuits, the improvement of metal adhesion of insulating substrates, and the coating process of metal materials. It can solve blistering, poor peel strength performance, high temperature thermal shock It can solve the problems of weak bearing capacity and other problems, so as to achieve the effect of strong bonding ability, strong bearing capacity and good anti-peeling performance.

Inactive Publication Date: 2020-07-17
国网河南省电力公司社旗县供电公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The above two browning solutions have poor peel strength performance, and the thermal stress test shows blist...

Method used

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  • Browning liquid used for printing circuit board

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Effect test

Embodiment 1

[0044] This embodiment provides a browning solution for printed circuit boards. The parts by weight of each component are shown in Table 1, wherein the inorganic acid is sulfuric acid with a mass fraction of 40%. The oxidizing agent is hydrogen peroxide. The corrosion inhibitor is benzotriazole. The stabilizer is benzenesulfonic acid. The inorganic salt is zinc sulfate. Described additive is methoxylated ethylene glycol, methyltriethoxysilane, polyimide, methoxylated ethylene glycol: methyltriethoxysilane: the weight ratio of polyimide is 1:2:0.5. Described plasticizer is dibutyl phthalate.

Embodiment 2

[0046] This embodiment provides a browning solution for printed circuit boards. The parts by weight of each component are shown in Table 1, wherein the inorganic acid is phosphoric acid with a mass fraction of 42%. The oxidizing agent is hydrogen peroxide. The corrosion inhibitor is 4-hydroxybenzotriazole. The stabilizer is ethylenediaminetetraacetic acid. The inorganic salt is zinc sulfate. Described additive is methoxylated ethylene glycol, methyltriethoxysilane, polyimide, methoxylated ethylene glycol: methyltriethoxysilane: the weight ratio of polyimide is 1:2.2:0.6. Described plasticizer is dibutyl phthalate.

Embodiment 3

[0048] This embodiment provides a browning solution for printed circuit boards. The parts by weight of each component are shown in Table 1, wherein the inorganic acid is nitric acid with a mass fraction of 45%. The oxidizing agent is hydrogen peroxide. The corrosion inhibitor is benzotriazole. The stabilizer is benzenesulfonic acid. The inorganic salt is zinc sulfate. Described additive is methoxylated ethylene glycol, methyltriethoxysilane, polyimide, methoxylated ethylene glycol: methyltriethoxysilane: the weight ratio of polyimide is 1:2.4:0.6. Described plasticizer is dibutyl phthalate.

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Abstract

The invention discloses browning liquid used for a printing circuit board, and belongs to the technical field of circuit boards. The liquid comprises an aqueous solution of inorganic acid, an oxidizing agent, a corrosion inhibitor, a stabilizing agent, inorganic salt, an addition agent, a plasticizer and N-methyl pyrrolidone. The prepared browning liquid shows the good stripping-property property,the peeling strength can be up to 0.84 Kg/cm or above, through a heat stress test, no bubbling and layering appear in the surface, it shows that a sample treated through the browning liquid is high in bearing capacity for the high temperature heat impact, the micro-etching depth ranges from 1.26 to 1.35 micrometers, and combination capacity with a copper coating is high.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a browning solution for printed circuit boards. Background technique [0002] Dr. Eisler of the United Kingdom first proposed the concept of printed circuit boards in 1936, and used this method to prepare copper clad laminates, which laid the foundation for today's integrated circuit PCB manufacturing technology. At present, printed circuit boards can be divided into paper base, glass cloth base, synthetic fiber base, ceramic base, metal core base and so on according to the base material. According to the structure, it can be divided into: rigid board, flexible board, rigid-flex printed board, etc. According to the classification of use, it can be divided into: civilian printed boards, industrial printed boards, military printed boards, etc. According to the base resin, it can be divided into: epoxy resin, phenolic resin, polytetrafluoroethylene, etc. In recent years, t...

Claims

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Application Information

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IPC IPC(8): C23C22/52C23F1/18H05K3/38
CPCC23C22/52C23F1/18H05K3/38
Inventor 张菲李红英刘璐张远蓓王珂刘鑫东刘杰李俊明段周涛刘东
Owner 国网河南省电力公司社旗县供电公司
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