Epoxy thermocuring adhesive film with initial viscosity and preparation method and application thereof
A thermosetting adhesive and epoxy thermal technology, which is applied in the direction of epoxy resin adhesive, film/sheet without carrier, non-polymer organic compound adhesive, etc., can solve the problem of long process, complex construction process of thermosetting adhesive film, Solve problems such as low yield rate, achieve high bonding strength, high tape process performance, and cost advantages
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Embodiment 1
[0039] (1) Preparation of epoxy resin thermosetting adhesive film
[0040] Mix solid epoxy resin, solid epoxy accelerator, stabilizer, filler and solvent A to obtain the required epoxy resin liquid mixture, then apply the epoxy resin liquid mixture evenly on the temporary release film, and enter the oven Baking at 40°C for 20 minutes, the epoxy resin thermosetting adhesive film can be obtained on the release film, and the thickness of the epoxy resin thermosetting adhesive film is 100 μm; among them, solid epoxy resin, solid epoxy accelerator, stabilizer, The weight ratio of filler and solvent A is: 100:10:1:10:200;
[0041] The solvent A is acetone; the solid epoxy resin is poly[(2-oxiranyl)-1,2-cyclohexanediol] 2-ethyl-2-(hydroxymethyl)-1, 3-propylene glycol ether (3:1); The solid epoxy resin accelerator is Nadic acid anhydride; The stabilizer is barbituric acid; The filler is calcium carbonate with a particle size of 10nm.
[0042] (2) Synthesis of acrylic modified cycloa...
Embodiment 2
[0056] (1) Preparation of epoxy resin thermosetting adhesive film
[0057] Mix solid epoxy resin, solid epoxy accelerator, stabilizer, filler and solvent A to obtain the required epoxy resin liquid mixture, then apply the epoxy resin liquid mixture evenly on the temporary release film, and enter the oven Baking at 40°C for 20 minutes, the epoxy resin thermosetting adhesive film can be obtained on the release film, and the thickness of the epoxy resin thermosetting adhesive film is 10 μm; among them, solid epoxy resin, solid epoxy accelerator, stabilizer, The weight ratio of filler and solvent A is: 100:10:5:100:1000;
[0058] The solvent A is chloroform, and the solid epoxy resin is an aralkylphenol type epoxy resin; the solid epoxy resin accelerator is 4,4'-diamino-3,3'-diethyl diphenylmethane; the stabilizer is phenylboronic acid; the filler is spherical silica.
[0059] (2) Synthesis of acrylic modified cycloaliphatic epoxy resin
[0060] The synthetic route of acrylic m...
Embodiment 3
[0073] (1) Preparation of epoxy resin thermosetting adhesive film
[0074]Mix solid epoxy resin, solid epoxy accelerator, stabilizer, filler, and solvent A to obtain the required epoxy resin liquid mixture, and then apply the epoxy resin liquid mixture evenly on the temporary release film, and enter the oven Baking at 70°C for 40 minutes, the epoxy resin thermosetting adhesive film can be obtained on the release film, and the thickness of the epoxy resin thermosetting adhesive film is 80 μm; among them, solid epoxy resin, solid epoxy accelerator, stabilizer, The weight ratio of filler and solvent A is: 100:20:5:100:600;
[0075] The solvent A is tetrahydrofuran; the solid epoxy resin is EOCN6000; the solid epoxy resin accelerator is 2P4MHZ from Shikoku Chemicals; the stabilizer is ascorbic acid; the filler is magnesium oxide with a particle size of 100nm.
[0076] (2) Synthesis of acrylic modified cycloaliphatic epoxy resin
[0077] The synthetic route of acrylic modified cy...
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Abstract
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