Adhesive tape and method for producing semiconductor device using same
A technology of adhesive tape and semiconductor, which is applied in the direction of semiconductor/solid device manufacturing, semiconductor devices, adhesive types, etc., and can solve the problem of difficult peeling of the adherend, resin leakage of the packaging resin, and difficulty in obtaining heat resistance for the adhesive tape In order to achieve stable adhesion, prevent leakage of encapsulation resin, and easy peeling
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no. 1 Embodiment approach
[0033] The adhesive tape of this embodiment is an adhesive tape which has an adhesive layer on at least one surface of a base film.
[0034] (substrate film)
[0035] The base film is made of a heat-resistant resin and is not particularly limited as long as it does not have a glass transition temperature or a melting point in a temperature range of 250° C. or lower. By using such a base film, an excellent adhesive tape that prevents resin leakage can be obtained even in a resin sealing step at a temperature of about 180° C. during resin sealing.
[0036] Examples of such materials include polyamideimide (PAI) resin, polyether ether ketone (PEEK) resin, polyarylate (PAR) resin, polyimide (PI) resin, and liquid crystal polymer (LCP) resin. )Wait. Among these, polyimide resins are preferable from the viewpoint of heat resistance, dimensional stability, and substrate strength.
[0037] In the present invention, the glass transition temperature of the base film means an intermed...
no. 2 Embodiment approach
[0071] The adhesive tape of this embodiment has an adhesive layer on both surfaces of a base film. That is, in addition to the adhesive tape of the first embodiment, the adhesive tape according to this embodiment further has an adhesive layer (hereinafter also referred to as "the first adhesive layer") on the surface of the base film on which the first adhesive layer is not laminated. 2 adhesive layer"). Since it is the same as that of 1st Embodiment about a base film and a 1st adhesive layer, description is abbreviate|omitted here.
[0072] (2nd adhesive layer)
[0073] As the second adhesive layer, depending on the application, it is possible to use the same (meth)acrylate copolymer as (A) (meth)acrylate copolymer or a different (meth)acrylate copolymer, and (B) An isocyanate-based curing agent or an epoxy-based curing agent, and an adhesive composition that further contains (C) a tackifying resin or does not contain (C) a tackifying resin. Since the same resin as (A) (me...
Embodiment 1
[0140] The adhesive composition which forms an adhesive layer was produced as follows. First, in order to synthesize a (meth)acrylate copolymer, 200 parts by mass of water containing 0.2 mass % of polyvinyl alcohol, 72 parts by mass of n-butyl acrylate, 20 parts by mass of parts by mass of methyl methacrylate, 3 parts by mass of glycidyl methacrylate, 5 parts by mass of 2-hydroxyethyl methacrylate, 0.1 parts by mass of benzoyl peroxide as a polymerization initiator, and 0.2 Parts by mass of 2-ethylhexyl-3-mercaptopropionate for adjusting the molecular weight.
[0141] It heated up to 70 degreeC, stirring this under nitrogen atmosphere, and performed suspension polymerization for 4 hours. Next, water was removed from the suspension by decantation. Wash the solid matter with water while suction filtering, remove the moisture, and then vacuum-dry it at 60°C to obtain a copolymer resin ((A) (meth)acrylate copolymer with a moisture content of 0.5% or less. ).
[0142] The obtai...
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Abstract
Description
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Application Information
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