Adhesive tape and method of manufacturing semiconductor device using the same
A technology of adhesive tape and semiconductor, applied in the direction of semiconductor/solid state device manufacturing, semiconductor device, adhesive type, etc., can solve the problem that the adhesive tape is difficult to obtain heat resistance, the resin leakage of the encapsulating resin, and the difficulty of the adherend. Peeling and other problems, to achieve the effect of stable adhesion, prevention of leakage of encapsulation resin, and easy peeling
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no. 1 Embodiment approach
[0033] The adhesive tape of this embodiment is an adhesive tape which has an adhesive layer on at least one surface of a base film.
[0034] (Substrate film)
[0035] The base film is composed of a heat-resistant resin, and is not particularly limited as long as it does not have a glass transition temperature or a melting point in a temperature range of 250° C. or lower. By using the base film, it is possible to obtain an excellent pressure-sensitive adhesive tape for preventing resin leakage even in the resin encapsulation process in which the temperature at the time of resin encapsulation is about 180°C.
[0036] Examples of such materials include polyamideimide (PAI) resins, polyetheretherketone (PEEK) resins, polyarylate (PAR) resins, polyimide (PI) resins, and liquid crystal polymer (LCP) resins. )Wait. Among them, polyimide resins are preferred from the viewpoints of heat resistance, dimensional stability, and substrate strength.
[0037] In the present invention, the...
no. 2 Embodiment approach
[0071] The pressure-sensitive adhesive tape of the present embodiment has adhesive layers on both surfaces of the base film. That is, in addition to the pressure-sensitive adhesive tape of the first embodiment, the pressure-sensitive adhesive tape according to the present embodiment further includes an adhesive layer (hereinafter also referred to as "the first adhesive layer") on the surface of the base film on which the first adhesive layer is not laminated. 2 Adhesive Layer"). Since the base film and the first adhesive layer are the same as those of the first embodiment, descriptions thereof are omitted here.
[0072] (Second adhesive layer)
[0073] As the second adhesive layer, a (meth)acrylate copolymer containing the same (meth)acrylate copolymer as (A) (meth)acrylate copolymer or a different (meth)acrylate copolymer can be used depending on the application, and (B) An isocyanate-based curing agent or an epoxy-based curing agent further contains (C) a tackifier resin o...
Embodiment 1
[0140] The adhesive composition which forms an adhesive layer was produced as follows. First, in order to synthesize a (meth)acrylate copolymer, 200 parts by mass of water containing 0.2 mass % of polyvinyl alcohol, 72 parts by mass of n-butyl acrylate, 20 parts by mass of methyl methacrylate, 3 parts by mass of glycidyl methacrylate, 5 parts by mass of 2-hydroxyethyl methacrylate, 0.1 parts by mass of benzoyl peroxide as a polymerization initiator, and 0.2 parts by mass Parts by mass of 2-ethylhexyl-3-mercaptopropionate for molecular weight adjustment.
[0141] The temperature was raised to 70°C while stirring in a nitrogen atmosphere, and suspension polymerization was performed for 4 hours. Next, the water is removed from the suspension by decantation. The solid matter was washed with water while suction filtration was carried out, and after removing the moisture, it was vacuum-dried at 60° C. to obtain a copolymer resin ((A) (meth)acrylate copolymer with a moisture conten...
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Abstract
Description
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