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A kind of high-performance metal grid transparent electrode manufacturing method and its obtained transparent electrode and application

A metal grid, transparent electrode technology, used in cable/conductor manufacturing, equipment for manufacturing conductive/semiconducting layers, final product manufacturing, etc., can solve the problem of low-cost manufacturing of rigid base metal grids, high viscosity Difficulty of paste printing, low resolution of inkjet printing, etc., to achieve the effect of enhancing jetting stability and deposition accuracy, high efficiency and low cost, large-scale manufacturing, and low precision requirements

Active Publication Date: 2022-04-19
QINGDAO TECHNOLOGICAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dwindling reserves of indium and its toxicity limit its further large-scale application to some extent.
However, the photolithography method has a long production cycle and high manufacturing cost, and it is difficult to realize large-area manufacturing; the manufacturing cost of nanoimprint master is high and the cycle is long; the resolution of inkjet printing is low, and it is difficult to print with high-viscosity conductive paste; Although sol-jet printing has greatly improved the printing accuracy, the viscosity of the printing material is usually not higher than 1000cP, and it is very difficult to print high-viscosity slurry with high metal content; although electrohydrodynamic jet printing can achieve High-resolution printing of high-viscosity materials, but it is difficult to achieve high-resolution printing of thick-film pastes with high metal content (the fineness of thick-film pastes is generally greater than 5 microns), and it is also difficult to achieve high-efficiency conductive pastes with large aspect ratios Printing; the silk screen technology has the problem of complicated process; although the screen printing technology uses thick film paste with high metal content, the screen printing line width is large, and the light transmittance is difficult to guarantee
To sum up, it is still difficult to realize low-cost manufacturing of rigid base metal grids with high light transmittance, low impedance and high adhesion, especially difficult to achieve square resistance less than 1Ω / sq, light transmittance greater than 90%, and adhesion greater than 80N. Fabrication of Transparent Electrodes on Rigid Substrates
[0004] In summary, among the many manufacturing technologies of transparent electrodes on rigid substrates, it is difficult to achieve low square resistance (less than 1Ω / sq), high light transmittance (greater than 90%), and high adhesion (greater than 80N) at low cost. Batch and efficient manufacturing, urgently need to develop new technologies to achieve low-cost and efficient manufacturing of transparent electrodes with high-performance rigid substrates with a heating line light transmittance greater than 90%, square resistance less than 1Ω / sq, and adhesion greater than 80N

Method used

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  • A kind of high-performance metal grid transparent electrode manufacturing method and its obtained transparent electrode and application
  • A kind of high-performance metal grid transparent electrode manufacturing method and its obtained transparent electrode and application
  • A kind of high-performance metal grid transparent electrode manufacturing method and its obtained transparent electrode and application

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Experimental program
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Effect test

Embodiment 1

[0045] This embodiment is based on the embedded 3D printing technology of electric field-driven spray deposition liquid film, and selects high-temperature sintered silver paste to directly print a graphic structure with a large aspect ratio on the substrate spin-coated with liquid PDMS. The manufactured graphic structure is a line grid structure. Concrete preparation steps include:

[0046] (1) Substrate pretreatment

[0047] Ordinary glass is used as the substrate. First, ultrasonically treat the glass substrate with deionized water for 10 minutes, then dry it with nitrogen gas, and finally use a plasma processor to conduct plasma bombardment treatment on the glass surface to modify the surface of the substrate and improve the adhesion between the printing material and the substrate;

[0048] (2) Coating liquid PDMS material

[0049] Spread a layer of liquid PDMS polymer on the surface of the substrate, select an appropriate amount of Dow Corning 184 canned glue, mix the P...

Embodiment 2

[0060] This embodiment is based on the electric field-driven jet deposition liquid film embedded 3D printing technology, selects high-temperature sintered silver paste (Shanghai Xinlui 8060 silver paste), and prints a large aspect ratio by directly printing on the substrate spin-coated with liquid PDMS. The conductive pattern of the structure, the pattern structure manufactured is a grid structure. Concrete preparation steps include:

[0061] (1) Pretreatment

[0062] Take ordinary glass as the substrate for 3D printing, first use acetone to ultrasonically clean it for 10 minutes, then use isopropanol to ultrasonically clean it for 10 minutes, then rinse it with deionized water, then dry it with nitrogen, and take it out for use;

[0063] (2) Coating liquid PDMS material

[0064] A layer of PDMS film with a thickness of about 10 microns is coated on the surface of the substrate by spin coating. The specific operation is as follows: select Sylgard 184 PDMS liquid from Dow Cor...

Embodiment 3

[0075] In this embodiment, a silicon wafer is used as the printing substrate, and the solar cell panel uses front silver conductive silver paste (DuPont MD2SP (PV20A)) as the metal paste for printing, and Sylgard 184PDMS liquid of Dow Corning Company is selected as the polymerizable material. This embodiment is applicable to the manufacture of the front wire grid electrode of the solar cell panel.

[0076] Step 1: Substrate Pretreatment

[0077] Using a silicon wafer as the printing substrate, it was first ultrasonically cleaned with acetone for 10 min, then with isopropanol for 10 min, then rinsed with deionized water, and then dried with nitrogen.

[0078] Step 2: Spin-coat a layer of liquid PDMS on the silicon substrate

[0079] Sylgard 184PDMS liquid from Dow Corning Company was selected as the spin-coating material. After the PDMS monomer and its corresponding curing agent were mixed uniformly at a ratio of 10:1, they were fully stirred and placed in a vacuum drying oven...

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Abstract

The invention relates to the field of transparent electrode manufacturing, in particular to a method for manufacturing a high-performance metal grid transparent electrode and the obtained transparent electrode and its application. The embedded 3D printing technology based on electric field-driven jet deposition liquid film is used to print with conductive paste. The material directly prints the graphic structure on the liquid PDMS film. Since the conductive paste and liquid PDMS are incompatible with each other, and because the printing substrate is a liquid material that can significantly inhibit the diffusion of the printed wire, the printed single-layer electric heating wire The aspect ratio can reach 0.8‑1.0.

Description

technical field [0001] The invention belongs to the field of transparent electrode manufacturing, and in particular relates to a method for manufacturing a high-performance metal grid transparent electrode, the obtained transparent electrode and its application. Background technique [0002] A transparent electrode is a film that can conduct electricity and has high light transmittance in the visible light range. It has excellent optical transparency, conductivity and stability. It is used in touch screens, flexible transparent displays, OLEDs, and Wearable devices, flexible thin-film solar cells, transparent electromagnetic interference shielding windows, smart windows, electronic paper, and transparent electric heating have a wide range of applications. At present, the supporting substrates of transparent electrodes can be divided into rigid substrates, flexible substrates and stretchable substrates, which correspond to different application fields. [0003] At present, w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B13/00H01L31/0224H01L31/18B82Y10/00B82Y30/00B82Y40/00H05B3/84
CPCH01B5/14H01B13/0026H01L31/022491H01L31/1884B82Y10/00B82Y30/00B82Y40/00H05B3/84Y02P70/50
Inventor 朱晓阳李政豪兰红波李红珂张广明王飞
Owner QINGDAO TECHNOLOGICAL UNIVERSITY
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