Low-melting-point and high-strength low-silver cadmium-free manganese-free multi-element silver solder and preparation method thereof
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A high-strength, low-melting-point technology, used in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of high silver content, cannot replace mature low-silver solder products, and high cost, and achieves a simple preparation method. Processability, low cost effect
Pending Publication Date: 2021-03-19
HANGZHOU HUAGUANG ADVANCED WELDING MATERIALS CO LTD +1
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The silver content of the solder involved in the above three patent documents is < 20 wt.%, but the soldering temperature is high, and it cannot replace mature low-silver solder products such as BAg25CuZnSn and BAg26CuZnSnIn
CN10494247B recommends a cadmium-free silver solder containing tin, silicon, zinc and praseodymium and its preparation method. The silver content is 30 wt.%, the solidus temperature is 670°C, and the liquidus temperature is 765°C. The advantage is that after adding the rare earth element Pr, the spreading performance and the tensile strength of the brazed joint are effectively improved, and it can be used to replace BAg45CuZn with high silver content. The brazed brass joint can reach 320MPa-370MPa, but the silver content is relatively hig
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Embodiment 1
[0024] Embodiment 1: according to mass percentage, each component of low-melting-point cadmium-free manganese-free low-silver solder alloy of the present embodiment is selected as follows:
[0025] Ag: 21.0%, Zn: 34.5%, Sn: 1.5%, In: 1.0%, X: 0.2%, and the balance is Cu. The alloying element X in this example is P: 0.195%, Ce: 0.005%. The solidus temperature is 636°C, the liquidus temperature is 783°C, and the unit spread area on pure copper (copper) is 3.50 mm 2 / g, the tensile strength of the joint used for 45# steel is 377 MPa, the tensile strength of the joint used for H62 brass is 342 MPa, and the microhardness of the solder is 215 HV0.2.
Embodiment 2
[0026] Embodiment 2: According to the mass percentage, the components of the low-melting point cadmium-free manganese-free low-silver solder alloy in this embodiment are selected as follows:
[0027] Ag: 22.0%, Zn: 34.5%, Sn: 1.0%, X: 0.5%, and the balance is Cu. The alloy element X in this example is P: 0.49%, La: 0.01%. The solidus temperature is 613°C, the liquidus temperature is 772°C, and the unit spread area on pure copper is 3.80 mm 2 / g, the tensile strength of the joint used for 45# steel is 380 MPa, the tensile strength of the joint used for H62 brass is 337 MPa, and the microhardness of the solder is 215 HV0.2.
Embodiment 3
[0028] Embodiment 3: according to mass percentage, each component of low-melting point cadmium-free manganese-free low-silver solder alloy of the present embodiment is selected as follows:
[0029] Ag: 23.0%, Zn: 34.4%, Sn: 1.5%, X: 0.8%, and the balance is Cu. The alloy element X in this example is P: 0.785%, La: 0.01%, and Ce: 0.005%. The solidus temperature is 584°C, the liquidus temperature is 762°C, and the unit spread area on pure copper is 5.03 mm 2 / g, the tensile strength of the joint used for 45# steel is 392 MPa, the tensile strength of the joint used for H62 brass is 357 MPa, and the microhardness of the solder is 244 HV0.2.
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Abstract
The invention relates to a low-melting-point and high-strength low-silver cadmium-free manganese-free multi-element silver solder and a preparation method thereof. The multi-element silver solder is composed of 19%-23% of silver, 32%-35% of zinc, 1.0%-3.0% of tin, 0-2.0% of nickel, 0-3.0% of indium, 0.01%-1.0% of alloying elements and the balance of copper, wherein the alloying elements are one ormore of phosphorus, lanthanum and cerium; and the alloying elements are composed of the following components in percentage by mass: 0.2%-1% of phosphorus, 0-0.02% of lanthanum and 0-0.01% of cerium.The preparation method of the multi-element silver solder comprises the following steps: S1, heating copper in Cu-X alloy in a medium-frequency smelting furnace crucible to be completely molten, and then adding alloy metal X till the Cu-X alloy is completely molten; S2, adding silver, zinc, tin, nickel and indium with the purity being at least 99.99% and the remaining part of the Cu-X alloy from which copper is removed into the medium-frequency smelting furnace crucible containing the molten Cu-X alloy to be smelted and cast according to the component proportion of the low-silver cadmium-freemanganese-free multi-element silver solder; and S3, carrying out subsequent treatment. The silver solder is easy to prepare, the total content of cadmium, manganese, silver and indium is low, the solid phase line temperature, the liquid phase line temperature and the welding performance are proper, and the machinable performance is high.
Description
technical field [0001] The application relates to a low-melting-point, high-strength low-silver, cadmium-free, manganese-free multi-component silver solder and a preparation method thereof. Background technique [0002] Silver-based brazing filler metal is a medium-temperature hard brazing filler metal widely used in low-carbon steel, stainless steel, copper alloy and other alloys. It has excellent process performance, suitable melting temperature, good gap filling ability and wettability. With the increase of silver price, the cost of silver-based solder is also rising. High-performance low-silver solder has always been the goal pursued by enterprises. Among the traditional low-silver solders, the performance of cadmium-containing silver solders is the most prominent, mainly because as the silver content in the solder decreases, its melting temperature will continue to rise, and the spreading performance will also decrease. At this time, the addition of cadmium can effectiv...
Claims
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