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A modified fluorinated cycloaliphatic epoxy resin and its preparation method

A technology of epoxy resin and fluorinated resin, which is applied in the field of modified fluorinated cycloaliphatic epoxy resin and its preparation, and can solve the problem of low UV radiation curing activity, difficult to fast microelectronic packaging field, water absorption and dielectric Unsatisfactory constants and other problems, to achieve the effect of significant technological progress, convenient operation, and short preparation routes

Active Publication Date: 2022-06-21
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Epoxy resin refers to a resin containing two or more epoxy groups in its molecule. Due to its good heat resistance, solvent resistance, physical, mechanical and electrical insulation properties, and good adhesion to various materials , Good chemical stability and widely used as adhesives, coatings, resin-based composite materials, widely used in the field of electronic packaging, but its water absorption and dielectric constant are not ideal, the dielectric constant value is 3 to 4, And the usual epoxy resin is bisphenol A type epoxy resin, because UV radiation curing activity is low, and it is difficult to meet the rapid microelectronic packaging field.

Method used

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  • A modified fluorinated cycloaliphatic epoxy resin and its preparation method
  • A modified fluorinated cycloaliphatic epoxy resin and its preparation method
  • A modified fluorinated cycloaliphatic epoxy resin and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] A modified fluorinated alicyclic epoxy resin, calculated in parts by weight, its composition and content are as follows:

[0047]

[0048] Wherein, the acrylate monomer is a mixture of methyl acrylate and butyl acrylate in a mass ratio of 30:10;

[0049] The alicyclic epoxy acrylate compound is provided by Jiangsu Taiter Chemical Co., Ltd.;

[0050] Described emulsifier is the mixture that sodium dodecyl sulfate, sodium dodecylbenzene sulfonate are formed by mass ratio 1:1;

[0051] The initiator is potassium persulfate.

[0052] The above-mentioned fluorinated acrylate monomer is calculated in parts by weight, and its composition and content are as follows:

[0053]

[0054] Wherein, the catalyst is dibutyltin dilaurate.

[0055]The preparation method of above-mentioned modified fluorinated alicyclic epoxy resin, the steps are as follows:

[0056] 1) Put isophorone diisocyanate into a 500mL round-bottom four-necked flask, under the protection of N2, control t...

Embodiment 2

[0062] A modified fluorinated alicyclic epoxy resin, calculated in parts by weight, its composition and content are as follows:

[0063]

[0064] Wherein, the acrylate monomer is a mixture of methyl acrylate and butyl acrylate in a mass ratio of 30:10;

[0065] The alicyclic epoxy acrylate compound is provided by Jiangsu Taiter Chemical Co., Ltd.;

[0066] Described emulsifier is the mixture that sodium dodecyl sulfate, sodium dodecylbenzene sulfonate are formed by mass ratio 1:1;

[0067] The initiator is potassium persulfate.

[0068] The above-mentioned fluorinated acrylate monomer is calculated in parts by weight, and its composition and content are as follows:

[0069]

[0070] Wherein, the catalyst is dibutyltin dilaurate.

[0071] The preparation method of above-mentioned modified fluorinated alicyclic epoxy resin, the steps are as follows:

[0072] 1) Put isophorone diisocyanate into a 500mL round-bottom four-necked flask, under the protection of N2, control ...

Embodiment 3

[0078] A modified fluorinated alicyclic epoxy resin, calculated in parts by weight, its composition and content are as follows:

[0079]

[0080] Wherein, the acrylate monomer is a mixture of methyl acrylate, butyl acrylate, and 2-ethylhexyl acrylate in a mass ratio of 20:5:1;

[0081] The alicyclic epoxy acrylate compound is provided by Jiangsu Taiter Chemical Co., Ltd.;

[0082] The emulsifier is a mixture of sodium dodecyl sulfate, sodium dodecylbenzene sulfonate, and nonylphenol polyoxyethylene ether in a mass ratio of 2:2:1;

[0083] The initiator is ammonium persulfate.

[0084] The above-mentioned fluorinated acrylate monomer is calculated in parts by weight, and its composition and content are as follows:

[0085]

[0086] Wherein, the catalyst is dibutyltin dilaurate.

[0087] The preparation method of above-mentioned modified fluorinated alicyclic epoxy resin, the steps are as follows:

[0088] 1) Put isophorone diisocyanate into a 1000mL round-bottom four-...

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Abstract

The invention discloses a modified fluorinated cycloaliphatic epoxy resin, which is characterized in that the raw materials include fluorinated acrylate monomers, acrylate monomers, cycloaliphatic epoxy acrylate compounds, emulsifiers, and initiators and deionized water. The preparation method is to drop the mixture of fluorinated acrylate monomer, acrylate monomer and alicyclic epoxy acrylate compound into deionized water and emulsifier, raise the temperature to 70-80°C, and then add the initiator dropwise , react under stirring, then raise the temperature to 85-90°C, react under stirring, and obtain the modified fluorinated cycloaliphatic epoxy resin. The modified fluorinated alicyclic epoxy resin has UV rapid curing ability, and the cured product has a low dielectric constant, and can be widely used in ultra-large scale integrated circuit technology.

Description

technical field [0001] The invention relates to a modified fluorinated alicyclic epoxy resin and a preparation method thereof, belonging to the technical field of polymer materials. Background technique [0002] The integration of integrated circuit components has been continuously improved, and the feature size has been continuously reduced, especially the line width has been reduced to sub-micron size. The corresponding signal delay and crosstalk between signals have become bottlenecks that limit the overall performance of integrated circuits. Resistor-capacitor delay is a metal interconnection problem. The biggest challenge facing connection reliability. In the traditional process, aluminum is used as metal interconnect and SiO is used 2 The resistance-capacitance interconnection delay brought by the interconnecting metal-dielectric layer is already greater than the gate delay of the signal itself. The parasitic capacitance effect between metal lines can be reduced by u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/32C08F220/34C08F220/14C08F220/18
CPCC08F220/32C08F220/343C08F220/14C08F220/1804C08F220/1808
Inventor 高楠张英强王晓瑞
Owner SHANGHAI INST OF TECH