A low filler content field-sensitive nonlinear conductive composite film and its preparation method
A composite material film and filler content technology, applied in the field of dielectric composite materials, can solve the problems of limited practical application, degradation of plasticity, toughness and other mechanical properties of composite materials, and achieve excellent nonlinear conductance characteristics, good nonlinear conductance characteristics, tensile The effect of enhanced elongation
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Embodiment 1
[0033] (1) Add 2% SiC nanowires (50 microns in length and 500 nanometers in diameter) to 30 ml of N,N-dimethylformamide relative to the volume fraction of the final composite material film, ultrasonically disperse for 0.5 hours, and then add 4.6g of 4,4'-diaminodiphenyl ether was stirred until completely dissolved, and then 7.55g of 3,3',4,4'-benzophenone tetracarboxylic dianhydride was added in batches to the solution. The solution was subjected to in-situ polymerization for 24 hours under nitrogen atmosphere and ice-water bath conditions to obtain a polyamic acid / SiC nanowire solution.
[0034] (2) Use a film maker to cast the above polyamic acid / SiC nanowire solution on a glass plate to form a film, and keep the film at 50°C, 100°C, 150°C, 200°C, 250°C and 300°C for one Hours to complete the solvent evaporation and thermal imidization process, after cooling, immerse the glass plate in distilled water, remove the film, wash it with distilled water and dry it to obtain a poly...
Embodiment 2
[0036] (1) Add 1% SiC nanowires (15 microns in length and 300 nanometers in diameter) to 30 ml of N,N-dimethylformamide relative to the volume fraction of the final composite material film, ultrasonically disperse for 0.5 hours, and then add Stir 5.78g of 4,4'-diaminodiphenyl ether until completely dissolved, and then add 6.37g of pyromellitic anhydride in batches to the solution. The solution was subjected to in-situ polymerization for 24 hours under nitrogen atmosphere and ice-water bath conditions to obtain a polyamic acid / SiC nanowire solution.
[0037] (2) Use a film maker to cast the above polyamic acid / SiC nanowire solution on a glass plate to form a film, and keep the film at 50°C, 100°C, 150°C, 200°C, 250°C and 300°C for one Hours to complete the solvent evaporation and thermal imidization process, after cooling, immerse the glass plate in distilled water, remove the film, wash it with distilled water and dry it to obtain a polyimide / SiC nanowire composite film.
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