Modified hydrocarbon-modified syndiotactic polystyrene composite material, copper-clad plate containing same and preparation method of modified hydrocarbon-modified syndiotactic polystyrene composite material

Abstract

The invention discloses a modified hydrocarbon-modified syndiotactic polystyrene composite material and a copper-clad plate prepared from the material. The composite material formed from 40-50% by mass of SPS resin, 40-50% by mass of hydrocarbon resin, 10-15% by mass of a modified SPS resin mixed solution, 4-8% by mass of modified hydrocarbon resin, 0.5-2% by mass of a cross-linking agent, 0.2-1% by mass of a cross-linking accelerator and 0.1-0.5% by mass of a nucleating agent is added into and mixed with an organic solvent to obtain a modified carbon-hydrogen-modified syndiotactic polystyrene composite glue solution, glass fiber cloth is dipped in a uniform dispersion liquid of the modified carbon-hydrogen-modified syndiotactic polystyrene composite glue solution, and baking is performed to obtain modified carbon-hydrogen-modified syndiotactic polystyrene prepregs; and the prepregs are laminated, the laminated prepregs are covered with an electrolytic copper foil, and the modified hydrocarbon-modified syndiotactic polystyrene composite material copper-clad plate is preprared through a high-temperature lamination process. The composite material has the dielectric constant and dielectric loss meeting the ultra-low dielectric requirement of a high-frequency and high-speed high-density board.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a modified hydrocarbon-modified syndiotactic polystyrene composite material copper-clad laminate and a preparation method thereof. Background technique [0002] With the rapid development of the information industry and the electronics industry represented by smart electronic products, digital circuits have gradually entered the stage of high-speed information processing and high-frequency signal transmission. Development in the direction of reliability and low cost. With the development of high-density printed circuit board (PCB) wiring and high-speed electrical signal transmission, it is very necessary to realize the performance of PCB substrate materials with low dielectric constant (Dk) and low dielectric loss factor (Df) of. [0003] The dielectric constant (Dk) and dielectric loss (Df) of traditional CCL (copper clad laminate) are relatively high. Even if the PC...

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Problems solved by technology

[0007] 1) The surface is inert, it is difficult to activate, it is difficult to combine with copper foil, and the adhesion is poor;

[0008] 2) The Tg itself is low, the thermal expansion is large, and the yield rate of micro-circuit processing is very low;

[0009] 3) The mechanical properties are insufficient, such as the tensile strength and modulus of PTFE are very low, and the hardness is also low;

[0010] 4) There are few sources of PTFE, and its own cost is also high, and the cost of the copper clad laminate made is extremely expensive;

Due to the gradual spread of 5G commercial use, mobile digital terminals with higher and higher integration densities have higher and higher requirements on the dielectric properties of circuit boards. Due to the introduction of a large number of epoxy resins and other polar groups in this system, the composite The dielectric constant and dielectric loss of materials cannot meet the ultra-low dielectric requirements of high-frequency and high-speed high-density boards

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