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A kind of high temperature resistant 3D printing photosensitive resin and its preparation method and application

A 3D printing and photosensitive resin technology, which is applied in the direction of additive processing, etc., can solve the problems of continuous use of high temperature resistance, increase of resin system, and inapplicability of low-viscosity resin, etc., to reduce interaction, reduce viscosity, high glass The effect of transition temperature

Active Publication Date: 2022-07-12
中山市杰事达精细化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is necessary to modify the photosensitive resin for high temperature resistance. The existing modification mainly improves the high temperature resistance of the photocurable resin by adding fillers, such as Chinese patents CN110724236A and CN106749986A. However, adding too much inorganic nano filler will affect the increase of the resin system. Viscosity is not suitable for 3D printing technology that requires low-viscosity resins; while Chinese patent CN106380556A uses a high-temperature-resistant crosslinking agent, and CN106947205A uses a specific resin raw material to overcome the problem of increased viscosity caused by adding inorganic fillers. A high temperature resistant photosensitive resin has been prepared, but its high temperature resistant continuous use time still needs to be improved

Method used

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  • A kind of high temperature resistant 3D printing photosensitive resin and its preparation method and application
  • A kind of high temperature resistant 3D printing photosensitive resin and its preparation method and application
  • A kind of high temperature resistant 3D printing photosensitive resin and its preparation method and application

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Embodiment 1

[0036] The present invention provides a high temperature resistant 3D printing photosensitive resin, which is made of the following components calculated in parts by weight:

[0037] 40 parts of aromatic polyester acrylate, 20 parts of phenolic epoxy resin, 20 parts of adamantane acrylate, 3 parts of hyperbranched polyester acrylate, 1.5 parts of hybrid modified glass fiber, 1.5 parts of benzoin dimethyl ether, triphenyl 4 parts of base sulfur tetrafluoroborate.

[0038] The preparation method of the above-mentioned high temperature resistant 3D printing photosensitive resin comprises the following steps:

[0039] S1. Preparation of Hybrid Modified Glass Fibers

[0040] After 5g of reinforcing glass fiber, 10g of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 10g of 3-(methacryloyloxy)propyltrimethoxysilane were mixed uniformly, The hybrid modified glass fiber was obtained by reacting at 60 °C for 6 h;

[0041] In the hybrid modified glass fiber, the graft ratio of epoxy gr...

Embodiment 2

[0045] The present invention provides a high temperature resistant 3D printing photosensitive resin, which is made of the following components calculated in parts by weight:

[0046] 40 parts of bisphenol A epoxy acrylate, 10 parts of cyclohexane-1,2-dicarboxylate diglycidyl ester, 4-(2,3-glycidoxy)-N,N-bis(2 , 10 parts of 3-epoxypropyl)aniline, 20 parts of dicyclopentyl acrylate, 5 parts of hyperbranched silicone resin, 5 parts of hybrid modified carbon fiber, 1.5 parts of 1-hydroxycyclohexyl phenone, diphenyl iodide 4 parts of hexafluorophosphate.

[0047] The preparation method of the above-mentioned high temperature resistant 3D printing photosensitive resin comprises the following steps:

[0048] S1. Preparation of Hybrid Modified Carbon Fibers

[0049] After 5g of reinforcing carbon fiber, 10g of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 10g of 3-(methacryloyloxy)propyltrimethoxysilane were mixed uniformly, they were mixed at 60 The hybrid modified carbon fiber...

Embodiment 3

[0054] The present invention provides a high temperature resistant 3D printing photosensitive resin, which is made of the following components calculated in parts by weight:

[0055] 50 parts of bisphenol F type epoxy acrylate, 20 parts of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane, 25 parts of dicyclopentenyl acrylate, 10 parts of hyperbranched epoxy resin, 1.5 parts of hybrid modified quartz fiber, 1 part of benzoin dimethyl ether, 1 part of 1-hydroxycyclohexyl phenone, and 4 parts of diphenyliodo hexafluorophosphate.

[0056] The preparation method of the above-mentioned high temperature resistant 3D printing photosensitive resin comprises the following steps:

[0057] S1. Preparation of Hybrid Modified Quartz Fibers

[0058] After 5g of reinforced quartz fiber, 15g of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 10g of 3-(methacryloyloxy)propyltrimethoxysilane were mixed uniformly, The hybrid modified quartz fiber was obtained by reacting at 70°C for 10h;

...

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Abstract

The invention provides a high temperature resistant 3D printing photosensitive resin and a preparation method and application thereof. The high temperature resistant 3D printing photosensitive resin of the present invention is made of the following components calculated in parts by weight: 20-90 parts of acrylate resin, 5-60 parts of epoxy resin, 15-40 parts of rigid monomer, and enhanced by hybridization modification 0.1 to 5 parts of body, 3 to 10 parts of hyperbranched resin, 1 to 5 parts of free-radical photoinitiator, and 3 to 8 parts of cationic photoinitiator, wherein, the hybrid modified reinforcement is grafted on the surface at the same time Reinforcement of epoxy groups and acrylate groups. The prepared material has good mechanical properties and heat resistance: the glass transition temperature of the material is 130-165 ℃; the heat distortion temperature is as high as 197-278 ℃; and it can be used at 200 ℃ for at least 6 hours; the prepared photosensitive The viscosity of the resin is 300-800cps; the molding shrinkage rate is 0.5-3.0%.

Description

technical field [0001] The invention belongs to the technical field of functional polymer materials, and in particular relates to a high temperature resistant 3D printing photosensitive resin and a preparation method and application thereof. Background technique [0002] Photosensitive resin has the characteristics of fast curing rate and low energy consumption. With the improvement of people's awareness of environmental protection, photosensitive resin occupies an increasing share of the protective coating market. Light-curing 3D printing technology has been widely used in aerospace, automobile manufacturing, mold manufacturing, biomedicine, culture and art and other fields due to its fast forming speed, high precision, low cost, and environmental friendliness. [0003] Photosensitive resin is the main material for light-curing 3D printing, and its properties have a direct and significant impact on the molding accuracy, mechanical properties, and application fields of the d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L67/06C08L63/10C08L83/07C08L63/04C08L63/00C08L33/08C08L33/10C08L35/02C08L83/04C08K9/04C08K7/14C08K7/06C08K7/10C08K7/04B33Y70/10
CPCC08L67/06C08L63/10C08L83/06B33Y70/10C08L2201/08C08L63/04C08L63/00C08L33/08C08L33/10C08L35/02C08L83/04C08K9/04C08K7/14C08K7/06C08K7/10C08K7/04
Inventor 向洪平王世崇
Owner 中山市杰事达精细化工有限公司