A kind of high temperature resistant 3D printing photosensitive resin and its preparation method and application
A 3D printing and photosensitive resin technology, which is applied in the direction of additive processing, etc., can solve the problems of continuous use of high temperature resistance, increase of resin system, and inapplicability of low-viscosity resin, etc., to reduce interaction, reduce viscosity, high glass The effect of transition temperature
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Embodiment 1
[0036] The present invention provides a high temperature resistant 3D printing photosensitive resin, which is made of the following components calculated in parts by weight:
[0037] 40 parts of aromatic polyester acrylate, 20 parts of phenolic epoxy resin, 20 parts of adamantane acrylate, 3 parts of hyperbranched polyester acrylate, 1.5 parts of hybrid modified glass fiber, 1.5 parts of benzoin dimethyl ether, triphenyl 4 parts of base sulfur tetrafluoroborate.
[0038] The preparation method of the above-mentioned high temperature resistant 3D printing photosensitive resin comprises the following steps:
[0039] S1. Preparation of Hybrid Modified Glass Fibers
[0040] After 5g of reinforcing glass fiber, 10g of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 10g of 3-(methacryloyloxy)propyltrimethoxysilane were mixed uniformly, The hybrid modified glass fiber was obtained by reacting at 60 °C for 6 h;
[0041] In the hybrid modified glass fiber, the graft ratio of epoxy gr...
Embodiment 2
[0045] The present invention provides a high temperature resistant 3D printing photosensitive resin, which is made of the following components calculated in parts by weight:
[0046] 40 parts of bisphenol A epoxy acrylate, 10 parts of cyclohexane-1,2-dicarboxylate diglycidyl ester, 4-(2,3-glycidoxy)-N,N-bis(2 , 10 parts of 3-epoxypropyl)aniline, 20 parts of dicyclopentyl acrylate, 5 parts of hyperbranched silicone resin, 5 parts of hybrid modified carbon fiber, 1.5 parts of 1-hydroxycyclohexyl phenone, diphenyl iodide 4 parts of hexafluorophosphate.
[0047] The preparation method of the above-mentioned high temperature resistant 3D printing photosensitive resin comprises the following steps:
[0048] S1. Preparation of Hybrid Modified Carbon Fibers
[0049] After 5g of reinforcing carbon fiber, 10g of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 10g of 3-(methacryloyloxy)propyltrimethoxysilane were mixed uniformly, they were mixed at 60 The hybrid modified carbon fiber...
Embodiment 3
[0054] The present invention provides a high temperature resistant 3D printing photosensitive resin, which is made of the following components calculated in parts by weight:
[0055] 50 parts of bisphenol F type epoxy acrylate, 20 parts of N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane, 25 parts of dicyclopentenyl acrylate, 10 parts of hyperbranched epoxy resin, 1.5 parts of hybrid modified quartz fiber, 1 part of benzoin dimethyl ether, 1 part of 1-hydroxycyclohexyl phenone, and 4 parts of diphenyliodo hexafluorophosphate.
[0056] The preparation method of the above-mentioned high temperature resistant 3D printing photosensitive resin comprises the following steps:
[0057] S1. Preparation of Hybrid Modified Quartz Fibers
[0058] After 5g of reinforced quartz fiber, 15g of 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane and 10g of 3-(methacryloyloxy)propyltrimethoxysilane were mixed uniformly, The hybrid modified quartz fiber was obtained by reacting at 70°C for 10h;
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