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AMB ceramic-metal brazing method

A metal brazing and ceramic technology, applied in metal processing equipment, welding equipment, welding/welding/cutting items, etc., can solve the problems of cracked copper cladding, voids, and strict product stability requirements, and achieve full brazing. Fusion effect

Pending Publication Date: 2022-01-21
黎铭坚
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solder paste has a great influence on the reliability of soldering. At present, the high-reliability active metal solder paste technology is still in the hands of several companies such as Japan and Germany. The common problem with domestic AMB solder paste is that the reliability of brazing is not good enough. The performance fluctuates greatly, and defects such as voids, virtual welding, and insufficient welding strength are prone to occur
These defects make the packaging substrate prone to cracks or copper clad layer peeling failure after long-term use, affecting the reliability of high-power IGBT power modules
This lack of quality severely limits the domestic supply of ceramic copper clad laminates in high-speed railways, urban rail transit, new energy vehicles, smart grids and wind power generation, because these high-voltage and high-power IGBT modules require packaging materials with better heat dissipation performance and reliability Higher stability, larger carrying capacity, more stringent requirements for product stability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The present embodiment provides a kind of AMB ceramic-metal brazing method based on supersonic cold air power spraying technique, at least comprises the following steps:

[0026] Step 1. Ultrasonic cleaning and drying the AlN ceramic standard substrate, sandblasting the ceramic surface with boron carbide particles with a particle size of 30 to 60 mesh, to obtain a clean substrate surface with certain unevenness on the surface, and use it as an active solder to embed with it. fit interface.

[0027] Step 2: Input the AgCuTi4.5 active solder powder into the powder delivery system of the cold spray coating system. The AgCuTi4.5 powder is an alloy powder produced by inert gas atomization method. The particle size distribution range is 5-53 microns, and the sphericity is > 80%, powder oxygen content <800ppm. Among them, the cold spraying system includes a powder feeding system, a high-pressure gas source, a gas heater for heating the high-pressure gas source, a gas regulati...

Embodiment 2

[0031] The present embodiment provides a kind of AMB ceramic-metal brazing method based on supersonic cold air power spraying technique, at least comprises the following steps:

[0032] Step 1, Si 3 N 4 The ceramic standard substrate is ultrasonically cleaned and dried, and the ceramic surface is sandblasted with boron carbide particles with a particle size of 16-30 mesh to obtain a clean substrate surface with certain unevenness on the surface, which serves as the interface for the active solder to be embedded.

[0033] Step 2: Input the AgCuTi4.5 alloy powder into the powder delivery system of the cold spray coating system. The AgCuTi4.5 powder is produced by the inert gas atomization method. Oxygen content 3 N 4 A relatively uniform active solder coating can be obtained on the ceramic substrate, and the spraying process conditions are controlled so that the thickness of the active solder coating is 90-100 μm.

[0034] Step 3, use a grinder to grind the Si 3 N 4 The act...

Embodiment 3

[0037] The present embodiment provides a kind of AMB ceramic-metal brazing method based on supersonic cold air power spraying technique, at least comprises the following steps:

[0038] Step 1, Al 2 o 3 The ceramic standard substrate is ultrasonically cleaned and dried, and the ceramic surface is sandblasted with silicon carbide particles with a particle size of 30-60 mesh to obtain a clean substrate surface with certain unevenness on the surface, which serves as the interface for the active solder to be embedded.

[0039] Step 2: Input the AgCu28 solder alloy powder into the powder delivery system of the cold spray coating system. The AgCu28 alloy powder is spherical powder produced by inert gas atomization method, the particle size distribution range is 8-53 μm, and the oxygen content of the powder is 2 o 3 A relatively uniform active solder coating can be obtained on the ceramic substrate, and the spraying process conditions are controlled so that the thickness of the acti...

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Abstract

The invention belongs to the technical field of ceramic-metal composite material manufacturing, and particularly relates to an AMB ceramic-metal brazing method based on a cold spraying process. The AMB ceramic-metal brazing method comprises the following steps that ultrasonic cleaning, drying and sand blasting treatment is conducted on a ceramic substrate; active brazing filler metal powder is sprayed on the ceramic substrate with inert gas as a medium to form a brazing filler metal coating with a certain thickness; the active brazing filler metal coating on the ceramic substrate is machined into the required thickness through a grinding machine; and clean oxygen-free copper foil is clamped on the composite substrate, the active brazing filler metal coating is located between the oxygen-free copper foil and the ceramic substrate, the composite substrate is placed in a vacuum brazing furnace to be subjected to high-temperature brazing, and sufficient brazing fusion among the ceramic substrate, the active brazing filler metal coating and the copper foil is achieved. Compared with the prior art, by means of the process, compact and reliable brazing combination between the ceramic substrate and a copper conductor layer is achieved, and the reliability of cold and hot circulation of an AMB ceramic copper-clad plate is improved.

Description

technical field [0001] The invention belongs to the technical field of ceramic-metal composite material manufacturing, and in particular relates to an AMB (Active Metal Bonding, active metal brazing) ceramic-metal brazing method based on a supersonic cold air dynamic spraying process. Background technique [0002] The IGBT (Insulated Gate Bipolar Transistor, Insulated Gate Bipolar Transistor), which is widely used in the third-generation semiconductor industry, is the most advanced power electronic device for power conversion and control. It has large input impedance, low driving power, and fast switching speed. , high operating frequency, lower saturation voltage, large safe working area and high voltage and high current resistance. It is widely used in strategic industries such as power generation and national defense industry. Ceramic copper-clad laminates are important components in IGBT modules, and the high-quality ceramic substrates used in them mainly include Al 2 ...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23K1/008B23K1/20B23K3/06B23K3/08H05K3/34B23K103/18
CPCB23K1/0008B23K1/20B23K1/206B23K3/0607B23K1/008B23K3/085H05K3/34B23K2103/18
Inventor 黎铭坚
Owner 黎铭坚
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