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Low-temperature silver paste and heterojunction battery

A technology of silver paste and low temperature, applied in the direction of circuits, electrical components, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of battery components scrapped, easy to tear, etc., to improve welding tension, increase wettability, The effect of lowering the interface barrier

Pending Publication Date: 2022-02-08
SUZHOU ISILVER MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the heterojunction conductive silver paste, the silver powder and the silver and the substrate are bonded by organic resins. The silver powder generally has too little tension and is easily torn under force. separation, resulting in the scrapping of the battery pack

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides a kind of low temperature silver paste, by weight, the low temperature silver paste includes:

[0039] 40 parts of flaky silver powder (average particle size 2μm, tap density 4.6g / cm 3 ), 52 parts of spherical silver powder (average particle size 0.1μm, tap density 1.6g / cm 3 ), 2 parts of silver-indium alloy (diameter is 100nm, length is 1μm, silver content is 70wt%, indium content is 30wt%), 2 parts of resorcinol formaldehyde epoxy resin (as polyphenol type glycidyl ether epoxy resin ), 1 part diglycidylhydantoin (as heterocyclic glycidyl epoxy resin), 2.5 parts polybutadiene resin (as crack growth inhibitor), 2 parts diethylene glycol butyl ether (as solvent ), 0.3 parts of isopropyl tris(dodecylbenzenesulfonyl) titanate, 0.2 parts of boron trifluoride-monoethylamine complex (as a curing agent). Wherein, the number average molecular weight of resorcinol formaldehyde epoxy resin and diglycidyl hydantoin is controlled at 800-1200.

Embodiment 2

[0041] This embodiment provides a kind of low temperature silver paste, by weight, the low temperature silver paste includes:

[0042] 45 parts of flaky silver powder (average particle size 5μm, tap density 5g / cm 3 ), 45 parts of spherical silver powder (average particle size 1μm, tap density 2g / cm 3 ), 1 part of silver-indium alloy (diameter is 200nm, length is 2μm, silver content is 80wt%, indium content is 20wt%), 1.5 parts of resorcinol formaldehyde epoxy resin (as polyphenol type glycidyl ether epoxy resin ), 1 part of 5,5-dimethylhydantoin epoxy resin (as a heterocyclic glycidyl epoxy resin), 2.5 parts of polybutadiene resin (as a crack growth inhibitor), 1.5 parts of diethylene glycol butadiene Ether (as a solvent), 0.3 parts of isopropyl tris(dioctylpyrophosphate acyloxy) titanate, 0.3 parts of boron trifluoride-monoethylamine complex (as a curing agent). Among them, the number average molecular weight of resorcinol formaldehyde epoxy resin and 5,5-dimethylhydantoin ...

Embodiment 3

[0044] This embodiment provides a kind of low temperature silver paste, by weight, the low temperature silver paste includes:

[0045] 50 parts of flake silver powder (average particle size 10μm, tap density 4.8g / cm 3 ), 38 parts of spherical silver powder (average particle size 3μm, tap density 1.6g / cm 3 ), 4 parts of silver-indium alloy (diameter is 500nm, length is 3μm, silver content is 90wt%, indium content is 10wt%), 2.5 parts of resorcinol formaldehyde epoxy resin (as polyphenol type glycidyl ether epoxy resin ), 1.6 parts of 5,5-dimethylhydantoin epoxy resin (as a heterocyclic glycidyl epoxy resin), 2.5 parts of polybutadiene resin (as a crack growth inhibitor), 1.5 parts of diethylene glycol butyl Ether (as a solvent), 0.2 parts of isopropyl tris(dioctyl phosphate acyloxy) titanate, 0.2 parts of boron trifluoride-monoethylamine complex (as a curing agent). The number average molecular weight of resorcinol formaldehyde epoxy resin and 5,5-dimethylhydantoin epoxy resi...

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Abstract

The invention provides low-temperature silver paste and a heterojunction battery. The low-temperature silver paste comprises the following components in parts by weight: conductive silver powder, a silver-indium alloy, composite epoxy resin, a crack growth inhibitor, a titanate coupling agent, a curing agent and a solvent. The invention also provides a heterojunction battery which comprises a TCO substrate and the low-temperature silver paste. The low-temperature silver paste provided by the invention is suitable for different battery base materials and has relatively high contact tension with the battery base materials, a film layer formed after the low-temperature silver paste is cured is low in resistance and has relatively high weldability, and the battery prepared from the low-temperature silver paste has relatively long service life and relatively high light conversion efficiency.

Description

technical field [0001] The invention relates to the technical field of battery silver paste, in particular to a low-temperature silver paste and a heterojunction battery. Background technique [0002] Heterojunction Technology (HIT) combines the dual advantages of crystalline silicon solar cells and thin film technology, depositing intrinsic and doped amorphous silicon thin films and transparent conductive oxide (TCO) films on both sides of n-type silicon wafers to Absorb the electricity generated, because amorphous silicon has the characteristics of strong light absorption and excellent passivation performance, it can achieve higher conversion efficiency of solar cells, and at the same time lower production costs. [0003] One of the performance requirements of heterojunction cells for TCO films is that they can directly transmit solar radiation to the active area with little or no attenuation, thereby improving the sensitivity of solar cells to the higher photon energy ban...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01L31/0224
CPCH01B1/22H01L31/022425Y02E10/50
Inventor 洪玮汪山周欣山
Owner SUZHOU ISILVER MATERIALS
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