Electrolyte for manufacturing electrolyte copper foil and application of electrolyte

A technology of electrolyte and copper foil, which is applied in electrolysis process, electroforming, etc., can solve the problems that copper foil cannot increase the tensile strength and elongation, and achieve the effects of inhibiting recrystallization rate, excellent mechanical properties, and easy operation

Pending Publication Date: 2022-03-15
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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AI-Extracted Technical Summary

Problems solved by technology

Although the high temperature mechanical properties of the above two twin structure electrolytic copper foil materials have been improved to varying degrees, they also show the behavior of "annealing softe...
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Abstract

The invention discloses an electrolyte for copper foil manufacturing and application of the electrolyte. The electrolyte comprises an additive, the additive comprises an inhibitor and an auxiliary agent, and the auxiliary agent comprises at least one of polystyrene sulfonate, polyethylene sulfonate, alkyl sulfonate and alkylbenzene sulfonate; wherein the carbon atom number of the alkyl sulfonate and the alkyl benzene sulfonate is greater than or equal to 12. Through simple and convenient chemical regulation and control means such as selection and combination of electrolysis (electroplating) liquid additives, a pre-electroplated copper material obtained by electroplating with the electrolyte can form a high-proportion annealing twin boundary after being subjected to heat treatment at the temperature of more than or equal to 200 DEG C, and has unique mechanical characteristics of annealing strengthening and toughening.

Application Domain

Electroforming processes

Technology Topic

Copper foilPolystyrene +13

Image

  • Electrolyte for manufacturing electrolyte copper foil and application of electrolyte
  • Electrolyte for manufacturing electrolyte copper foil and application of electrolyte
  • Electrolyte for manufacturing electrolyte copper foil and application of electrolyte

Examples

  • Experimental program(5)
  • Comparison scheme(11)

Example Embodiment

[0071] Example 1
[0072] This embodiment provides an electrolytic solution for copper foil manufacturing, the electrolytic solution comprising:
[0073] Copper ion 30g/L, sulfuric acid 30g/L, chloride ion 30ppm, inhibitor 50ppm, auxiliary agent 300ppm, pure water 250mL; among them, the inhibitor is gelatin with a coagulation value of 100 bloom, and the auxiliary agent is sodium polystyrene sulfonate with a molecular weight of 40,000 .
[0074] This embodiment provides a method for preparing copper foil using the above electrolyte, the method comprising:
[0075] (1) DC electroplating
[0076] a. Cathode pretreatment. The high-purity titanium plate is used as the cathode, and it undergoes the processes of alkali washing, pickling, and water washing in sequence.
[0077] b. DC plating. Immerse the titanium plate cathode and phosphorus copper anode (phosphorus content 0.05wt.%) in the above electrolytic solution, apply 300rpm mechanical stirring, and control the constant temperature of the plating solution at 25°C. Then access the rectifier, with 3A/dm 2 The current density was applied for 120 minutes to obtain a pre-plated copper material, referred to as copper foil.
[0078] c. Post-treatment of copper foil. Take the copper foil out of the electrolyte and separate it from the substrate. Rinse the coating repeatedly with pure water to remove the residual plating solution, and finally dry the surface of the copper foil with compressed air.
[0079] (2) Annealing treatment.
[0080] Put the copper foil in a tube furnace, pass through the nitrogen protective atmosphere, set the furnace to rise from room temperature to 200°C at 10°C/min and keep it warm for 1 hour, then cool naturally, and take out the copper foil.

Example Embodiment

[0081] Example 2
[0082] The difference between this embodiment and embodiment 1 is that the temperature of the annealing treatment in step (2) is 250°C.

Example Embodiment

[0083] Example 3
[0084] The difference between this embodiment and embodiment 1 is that the temperature of the annealing treatment in step (2) is 300°C.

PUM

PropertyMeasurementUnit
Thickness350.0µm
Tensile strength>= 250.0mPa
Tensile strength>= 280.0mPa

Description & Claims & Application Information

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