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Electrolyte for manufacturing electrolyte copper foil and application of electrolyte

A technology of electrolyte and copper foil, which is applied in electrolysis process, electroforming, etc., can solve the problems that copper foil cannot increase the tensile strength and elongation, and achieve the effects of inhibiting recrystallization rate, excellent mechanical properties, and easy operation

Pending Publication Date: 2022-03-15
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the high temperature mechanical properties of the above two twin structure electrolytic copper foil materials have been improved to varying degrees, they also show the behavior of "annealing softening and toughening"
[0005] In summary, none of the existing copper foils can increase the tensile strength and elongation at the same time after annealing, so further research on it is of great significance

Method used

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  • Electrolyte for manufacturing electrolyte copper foil and application of electrolyte
  • Electrolyte for manufacturing electrolyte copper foil and application of electrolyte
  • Electrolyte for manufacturing electrolyte copper foil and application of electrolyte

Examples

Experimental program
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Embodiment 1

[0072] This embodiment provides an electrolytic solution for copper foil manufacturing, the electrolytic solution comprising:

[0073] Copper ion 30g / L, sulfuric acid 30g / L, chloride ion 30ppm, inhibitor 50ppm, auxiliary agent 300ppm, pure water 250mL; among them, the inhibitor is gelatin with a coagulation value of 100 bloom, and the auxiliary agent is sodium polystyrene sulfonate with a molecular weight of 40,000 .

[0074] This embodiment provides a method for preparing copper foil using the above electrolyte, the method comprising:

[0075] (1) DC electroplating

[0076] a. Cathode pretreatment. The high-purity titanium plate is used as the cathode, and it undergoes the processes of alkali washing, pickling, and water washing in sequence.

[0077] b. DC plating. Immerse the titanium plate cathode and phosphorus copper anode (phosphorus content 0.05wt.%) in the above electrolytic solution, apply 300rpm mechanical stirring, and control the constant temperature of the pla...

Embodiment 2

[0082] The difference between this embodiment and embodiment 1 is that the temperature of the annealing treatment in step (2) is 250°C.

Embodiment 3

[0084] The difference between this embodiment and embodiment 1 is that the temperature of the annealing treatment in step (2) is 300°C.

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Abstract

The invention discloses an electrolyte for copper foil manufacturing and application of the electrolyte. The electrolyte comprises an additive, the additive comprises an inhibitor and an auxiliary agent, and the auxiliary agent comprises at least one of polystyrene sulfonate, polyethylene sulfonate, alkyl sulfonate and alkylbenzene sulfonate; wherein the carbon atom number of the alkyl sulfonate and the alkyl benzene sulfonate is greater than or equal to 12. Through simple and convenient chemical regulation and control means such as selection and combination of electrolysis (electroplating) liquid additives, a pre-electroplated copper material obtained by electroplating with the electrolyte can form a high-proportion annealing twin boundary after being subjected to heat treatment at the temperature of more than or equal to 200 DEG C, and has unique mechanical characteristics of annealing strengthening and toughening.

Description

technical field [0001] The invention relates to the technical field of advanced preparation, processing and molding of metal and non-metal materials, in particular to an electrolyte used in the manufacture of electrolyte copper foil and its application. Background technique [0002] Electrolytic copper foil is one of the key raw materials for the manufacture of electronic circuits and lithium batteries, and plays an important role in signal and power transmission. The principle of electrolytic copper foil is similar to that of electroplating copper. First, high-purity copper material (such as copper wire) is put into a copper-dissolving tank, mixed with pure water and sulfuric acid, and compressed air is introduced to oxidize copper to form copper sulfate electrolyte; then put into organic Additive, apply direct current between titanium roller cathode and insoluble anode, make copper ions reduce and crystallize on the cathode surface, and rotate and wind with the titanium ro...

Claims

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Application Information

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IPC IPC(8): C25D1/04
CPCC25D1/04Y02E60/10
Inventor 李哲刘志权董易彭振家孙蓉
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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