Organic pouring sealant as well as preparation method and application thereof

A potting, organic technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of decreased mechanical properties, easy generation of bubbles, affecting the light output rate of LEDs, etc., to improve the hydrophobic performance, The effect of improving mechanical properties and simple preparation process

Pending Publication Date: 2022-04-12
湖南创瑾技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are some problems in the use of silicone potting adhesives, such as easy to generate air bubbles during use, which affects the light output rate of LEDs; filling thermal conductivity fillers to improve thermal conductivity; but the filling of thermal conductivity fillers will cause mechanical properties to decline.

Method used

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  • Organic pouring sealant as well as preparation method and application thereof
  • Organic pouring sealant as well as preparation method and application thereof

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preparation example Construction

[0082] The preparation method of amino-modified graphene in the embodiment of the present invention comprises the following steps:

[0083] S1: Exfoliate 100 parts of graphite powder (CAS No.: 7782-42-5, Aladdin) by supercritical carbon dioxide method (pressure 20 MPa, temperature 40 ° C), add 500 parts of water to the obtained graphite powder, and obtain a slurry The material is crushed through a homogenizer. The pressure of the homogenizer is 80MPa. After the crushing is completed, it is processed by a composite dispersion method of ultrasound, shearing and emulsification. After the dispersion is completed, it is spray-dried at a drying temperature of 150°C and the dried product is collected;

[0084] Add the dried product to 100 parts of dilute hydrochloric acid for soaking at -10°C, and then add the compound of potassium permanganate and hydrogen peroxide after 4 hours, wherein 10 parts of potassium permanganate and 10 parts of hydrogen peroxide are used, and the temperatur...

Embodiment 1

[0093] This embodiment is an organic potting compound and its preparation method.

[0094] The organic potting compound of this embodiment is composed of the following preparation raw materials in parts by weight:

[0095] Polysiloxane (CAS No.: 68083-19-2; vinyl-terminated polydimethylsiloxane, viscosity 500mPa·s, molecular weight 17200, vinyl content 0.37wt% ~ 0.43wt%, Hubei Handafei Biology Technology Co., Ltd.) 25 copies;

[0096] 5 parts of amino-modified graphene;

[0097] Thermally conductive filler (obtained by mixing surface-modified alumina and surface-modified aluminum nitride, the mass ratio of surface-modified alumina and surface-modified aluminum nitride is 2:1) 30 parts;

[0098] Fluorine-terminated vinyl silane (CAS number: 211985-86-3; vinyl (trifluoromethyl) dimethyl silane, fluorine content: 36.9 wt%, vinyl content: 17.5 wt%) 20 parts;

[0099] 3 parts of crosslinking agent (polymethylhydrogensiloxane, CAS number: 63148-57-2);

[0100] Catalyst (platinum...

Embodiment 2

[0107] This embodiment is an organic potting compound and its preparation method.

[0108] The organic potting compound of this embodiment is composed of the following preparation raw materials in parts by weight:

[0109] Polysiloxane (CAS No.: 68083-19-2; vinyl-terminated polydimethylsiloxane, viscosity 500mPa·s, molecular weight 17200, vinyl content 0.37wt% ~ 0.43wt%, Hubei Handafei Biology Technology Co., Ltd.) 25 copies;

[0110] 3 parts of amino-modified graphene;

[0111] Thermally conductive filler (obtained by mixing surface-modified alumina and surface-modified aluminum nitride, the mass ratio of surface-modified alumina and surface-modified aluminum nitride is 2:1) 30 parts;

[0112] Fluorine-terminated vinyl silane (CAS number: 211985-86-3; vinyl (trifluoromethyl) dimethyl silane, fluorine content: 36.9 wt%, vinyl content: 17.5 wt%) 10 parts;

[0113] 3 parts of crosslinking agent (polymethylhydrogensiloxane, CAS number: 63148-57-2);

[0114] Catalyst (platinum...

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Abstract

The invention discloses an organic pouring sealant as well as a preparation method and application thereof. The organic pouring sealant is prepared from the following raw materials: polysiloxane, modified graphene, a heat-conducting filler, fluorine-containing vinyl-terminated silicone oil and a cross-linking agent, the modified graphene is amino modified graphene; the cross-linking agent comprises hydrogen-containing silicone oil. According to the invention, through the amino-modified graphene material, the amino-modified graphene material is subjected to a chemical cross-linking reaction with polysiloxane and the like through a cross-linking agent, graphene is anchored on a main chain after cross-linking polymerization of polysiloxane, and finally a three-dimensional network structure is formed, so that the processing fluidity is ensured, and the processing efficiency is improved. The mechanical property and the heat-conducting property of the pouring sealant material can be improved; meanwhile, by introducing the fluorine-containing vinyl-terminated silicone oil, the cross-linking density of the final pouring sealant is adjusted, and the hydrophobic property of the pouring sealant is also improved.

Description

technical field [0001] The invention relates to the technical field of electronic packaging, in particular to an organic potting compound and its preparation method and application. Background technique [0002] LED is a solid-state semiconductor device that converts electrical energy into visible light. Its luminous efficiency can reach 80% to 90%. It is a new type of high efficiency and has the advantages of energy saving, environmental protection and long service life. Long-term exposure of LED chips to harsh and harsh environments is vulnerable to high humidity, high temperature, dust, microorganisms, ray radiation, wind and rain and other environments, which can easily cause a decrease in luminous efficiency, and serious permanent oxidative damage; followed by foreign physics. Shock and vibration cause physical damage. Therefore, in order to achieve industrial application, it is required to be potted and protected, so that the circuit board and LED are in a stable and ...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J11/04C09J11/06C09J11/08
Inventor 俞国金周佩先赖金洪
Owner 湖南创瑾技术研究院有限公司
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