Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material

Abstract

The invention discloses a method for connecting soft and hard interfaces between a flexible conductive material and a hard conductive material. The method comprises the following steps: preparing the flexible conductive material comprising a flexible material substrate and a metal conductive film I covering the flexible material substrate; preparing a modified hard conductive material comprising a hard material substrate, an elastomer layer, a metal conductive film II on the elastomer layer and an output end of the flexible conductive material; the metal conductive film I at the output end of the flexible conductive material is in contact with the metal conductive film II made of the modified hard conductive material, and the metal conductive film I and the metal conductive film II are connected and conducted through the self-adhesion effect of the elastic body. According to the invention, the connection between the flexible conductive material and the external hard signal transmission end is realized at room temperature without additional adhesive by utilizing the self-adhesion characteristic of the elastomer material. According to the method, the production process is simplified, connection of a soft material and a hard material is achieved, the conductivity and stretchability of the whole sensor are effectively guaranteed, and the obtained electrophysiological signals and strain signals are more stable.

Description

technical field [0001] The invention belongs to the field of flexible electronics, and in particular relates to a method for connecting soft and hard interfaces between flexible conductive materials and hard conductive materials. Background technique [0002] Young's modulus is one of the important indicators to measure the mechanical properties of materials. Generally speaking, the greater the Young's modulus, the greater the hardness of the material, and vice versa. Generally, materials with a large Young's modulus that are not easy to bend or stretch are called hard materials, such as metal blocks, and materials with a relatively small Young's modulus that are bendable and stretchable are called flexible materials. Such as some polymer materials, etc. Due to the large difference in Young's modulus, the amount of deformation produced by flexible materials and hard materials is different when subjected to the same external force, and the soft-hard interface composed of fl...

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Problems solved by technology

[0006] Chinese patent CN103118505A discloses a PCB board that has the advantages of soft board and hard board at the same time. Although it solves the problem of explosion board and hole wall separation, it needs browning treatment, window opening treatment, and bonding epoxy resin semi-cured pressure. Chips and other processes, the preparation process is complicated and not environmentally friendly

Chinese patent CN106550539A discloses a method for preparing soft and hard boards with simple process and low cost, that is, using laser welding or ultrasonic welding to combine flexible circuit boards with printed circuit boards. Although the production steps are greatly reduced, flexible materials are not considered. Its own physical properties, such as high temperature environment will cause material denaturation and lose mechanical and electrical resistance, etc.

Therefore, the above method is not suitable for most flexible materials with low glass transition temperature.

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