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Fluorine-containing resin-based high-thermal-conductivity high-frequency copper-clad plate with high dielectric constant

A technology of high dielectric constant and fluorine-containing resin, which is applied in the field of communication materials, can solve the problems of limited wide application and low thermal conductivity, and achieve the goal of reducing thermal expansion coefficient, reducing production cost, and improving mechanical and dielectric properties Effect

Pending Publication Date: 2022-05-27
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of fluorine-containing resin itself is extremely low (0.15W / mK), which limits its wider application. Therefore, it is imminent to develop high-frequency fluorine-containing resin-based copper-clad laminates with high thermal conductivity.

Method used

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  • Fluorine-containing resin-based high-thermal-conductivity high-frequency copper-clad plate with high dielectric constant

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0047] Take 120 parts of BN (D50=10um) and mix it with 3500 parts of pure water. After dispersing by ball milling for 30 minutes, add 70 parts of NaOH to it. After 8 hours of ultrasonic-assisted reaction at 80 °C, add acetic acid to adjust the pH value to 6- Between 7 and 7, a reaction solution of activated BN is obtained.

[0048] Prepare 100 parts of a 2wt% H2O / ethanol mixed solution, add 0.7 parts of coupling agent KH550 and 2.3 parts of coupling agent KH570, stir at 55 ° C for 5 minutes, adjust the pH of the system to 3-5, and continue to stir 15min to obtain an activated composite coupling agent solution.

[0049] Pour the activated composite coupling agent solution into the activated BN reaction solution, continue stirring at 60 ° C for 4 hours, filter and wash the product with water for several times until the pH value of the filtrate is between 7-8; After eluting with ethanol and toluene, the modified BN co-modified by KH570 / KH550 was obtained.

[0050] A homogeneous...

Synthetic example 2

[0052] Take 120 parts of BN (D50=20um) and mix it with 3500 parts of pure water. After dispersing by ball milling for 30 minutes, add 80 parts of NaOH to it. After 12 hours of ultrasonic-assisted reaction at 80 °C, add acetic acid to adjust the pH value to 6- Between 7 and 7, a reaction solution of activated BN is obtained.

[0053] Prepare 100 parts of a 2wt% H2O / ethanol mixed solution, add 0.8 parts of coupling agent perfluorodecyltrimethoxysilane and 3.5 parts of coupling agent KH570, stir at 50 °C for 10 minutes, and adjust the pH of the system to 3- 5, and continue to stir for 20 min to obtain an activated composite coupling agent solution.

[0054] Pour the activated composite coupling agent solution into the activated BN reaction solution, continue stirring at 60 ° C for 5 hours, filter and wash the product with water for several times until the pH value of the filtrate is between 7-8; After rinsing with ethanol and toluene, the modified BN co-modified with perfluorode...

Embodiment 1

[0057] Weigh 120 parts of polytetrafluoroethylene emulsion (DuPont Teflon® PTFE DISP30, solid content 60%), 60 parts tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer emulsion (DuPont Teflon® PFAD 335D, solid content 60%) ), 80 parts of polyperfluoroethylene propylene emulsion (DuPont Teflon® FEPD121, solid content 54%), 10 parts of silica, 10 parts of alumina, 150 parts of titanium oxide, 120 parts of modified BN in Synthesis Example 1, 5 parts PVDF and 50 parts of commercially available ammonia solution (26% by mass) were stirred and mixed at 25°C for 24 hours to obtain a uniform dispersion.

[0058] Acetone was added dropwise, stirred at 25° C. until white viscous precipitate no longer appeared, and the solvent was poured out to obtain a fluorine-containing resin-based composite paste.

[0059] The composite paste was scraped on a clean glass plate to form a film with a thickness of about 0.8 mm. After drying at 70 °C for 1 h, the glass plate and the film were trans...

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Abstract

The invention belongs to the technical field of communication materials, and particularly relates to a fluorine-containing resin-based high-thermal-conductivity high-frequency copper-clad plate with a high dielectric constant. The fluorine-containing resin-based high-thermal-conductivity high-frequency copper-clad plate is prepared in the mode that fluorine-containing resin mixture uniform dispersion liquid is prepared at first, then fluorine-containing resin-based composite paste is prepared, then a fluorine-containing resin-based dielectric sheet is prepared through blade coating, drying and sintering, and finally the fluorine-containing resin-based dielectric sheet and a copper foil are overlapped to prepare the final fluorine-containing resin-based high-thermal-conductivity high-frequency copper-clad plate.

Description

technical field [0001] The invention belongs to the technical field of communication materials, in particular to a high-dielectric-constant fluorine-containing resin-based high-thermal-conductivity high-frequency copper-clad laminate. Background technique [0002] As the main carrier of electronic components, copper clad laminates have higher and higher integration levels and finer lines. In order to ensure the stability of electronic components, in addition to stable insulation and thermo-mechanical properties, copper clad laminates , and also need to have a good heat dissipation function. [0003] Metal-based copper clad laminates have the best heat dissipation capacity, but their manufacturing costs remain high and production is difficult, and they are only used for high-current modules. Ceramic substrates such as alumina-based, aluminum nitride-based and silicon nitride-based also have good thermal conductivity, but ceramic substrates have poor mechanical properties. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/32B32B27/30B32B27/18B32B27/20B32B15/20B32B15/085B32B15/082C08L27/18C08L27/16C08K3/28C08K3/38C08K9/06C08K9/08C08J5/18B29D7/01
CPCB32B27/322B32B27/304B32B27/18B32B27/20B32B15/20B32B15/085B32B15/082C08J5/18B29D7/01C08J2327/18C08J2427/18C08J2427/16C08K2003/385C08K9/06C08K9/08C08K3/28B32B2307/54B32B2307/734B32B2307/302B32B2457/00Y02P20/10
Inventor 俞卫忠冯凯俞丞顾书春赵琳
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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