High-initial-bonding-strength light/moisture dual-curing polyurethane hot melt adhesive composition and preparation method thereof

A technology of polyurethane hot melt adhesive and initial bonding strength, which is applied in the direction of polyurea/polyurethane adhesive, adhesive type, adhesive, etc., can solve the problem of insufficient initial bonding strength, and achieve the improvement of initial bonding strength, Reduce volume shrinkage and good bonding performance

Pending Publication Date: 2022-06-17
XIAMEN WELDTONE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the initial bonding strength of the bonding layer formed by the light / moisture dual-curing polyurethane hot melt adhesive in the prior art is not high enough after UV curing, and there are certain limitations in application.

Method used

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  • High-initial-bonding-strength light/moisture dual-curing polyurethane hot melt adhesive composition and preparation method thereof
  • High-initial-bonding-strength light/moisture dual-curing polyurethane hot melt adhesive composition and preparation method thereof

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preparation example Construction

[0044] The present invention also proposes a method for preparing the polyurethane hot-melt adhesive composition according to any of the above embodiments, comprising the following steps:

[0045] S1, drying the raw material components that need to be dried; in the present invention, the raw materials that need to be dried include polymeric polyols and adamantane diols;

[0046] S2. Add the low-molecular-weight saturated diol and the adamantane diol into the container, heat up to 70-90° C., mix evenly, add the diisocyanate, stir and react for 2-5 hours, and then add the polymerization The substance-type polyol and the catalyst continue to react for 2-5 hours to obtain prepolymer A;

[0047] S3. Divide the prepolymer A obtained in step S1 into a first part of prepolymer and a second part of prepolymer, and the number of moles of isocyanate in the first part of prepolymer and the number of moles of hydroxyalkyl acrylate same;

[0048] S4, mixing the first part of the prepolyme...

Embodiment 1

[0054] By formula: 95 parts of PEO(10)-PPO(5) diol (where 10 and 5 represent the average degree of polymerization of PEO and PPO, respectively, and so on below), 4 parts of ethylene glycol, 0.5 part of 2,3-diol Hydroxypropyl acrylate, 15 parts 1,3-adamantanediol, 35 parts hexamethylene diisocyanate, 3 parts benzoin dimethyl ether, 2 parts hydroxypropyl acrylate, 0.5 parts stannous octoate and 1.5 parts KH-560 .

[0055] The PEO(10)-PPO(5) diol and adamantane diol were vacuum-dried at 60°C;

[0056] Add ethylene glycol and 1,3-adamantanediol into the container, heat up to 70-75°C, mix evenly, add hexamethylene diisocyanate, stir and react for 3 hours, then add PEO(10)-PPO(5 ) diol and stannous octoate, continued to react for 3 hours to obtain prepolymer A;

[0057] The above-mentioned prepolymer A is divided into the first part of the prepolymer and the second part of the prepolymer, and the number of moles of isocyanate in the first part of the prepolymer is identical with t...

Embodiment 2

[0062] The hydroxypropyl acrylate in Example 1 was adjusted to 1.5 parts, and the remaining steps remained unchanged to obtain a polyurethane hot-melt adhesive.

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Abstract

The invention provides a light/moisture dual-curing polyurethane hot melt adhesive composition with high initial bonding strength and a preparation method thereof, and relates to the technical field of hot melt adhesives. The dual-curing polyurethane hot melt adhesive composition comprises the following raw material components in parts by weight: 1-10 parts of a curing agent, 1-10 parts of a curing agent and 1-10 parts of a curing agent. The invention relates to a photocurable polyurethane resin, which is prepared from the following raw materials in parts by weight: 70 to 100 parts of polymer type polyol, 1 to 5 parts of low molecular weight saturated dihydric alcohol, 0.3 to 1 part of dihydroxy (methyl) acrylate, 15 to 30 parts of adamantane dihydric alcohol, 25 to 50 parts of diisocyanate, 1 to 5 parts of photoinitiator, 1 to 3 parts of hydroxyalkyl acrylate, 0.1 to 1 part of catalyst and 1 to 3 parts of adhesion promoter. The average molecular weight of the polymer type polyol is not less than 500, and the molecular weight of the low molecular weight saturated dihydric alcohol is not more than 200. The dual-curing polyurethane hot melt adhesive composition disclosed by the invention has the characteristics of high initial bonding strength, high moisture curing speed and high final bonding strength.

Description

technical field [0001] The invention belongs to the technical field of hot melt adhesives, and relates to a high initial bonding strength light / moisture dual curing polyurethane hot melt adhesive composition and a preparation method thereof. Background technique [0002] Light / moisture dual-curing polyurethane hot-melt adhesive can obtain initial bond strength through UV light rapid curing when it is applied to the surface of the substrate, and then slowly penetrate and cure through moisture. After a few days to ten days of curing, the final A bond layer with higher bond strength is formed. Since light / moisture dual curing polyurethane hot melt adhesive can provide a certain initial bond strength, it is widely used in electronic products. [0003] However, the light / moisture dual-curing polyurethane hot-melt adhesive in the prior art has insufficient initial bonding strength of the bonding layer formed by curing with ultraviolet light, and has certain limitations in applica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J175/16C08G18/12C08G18/66C08G18/48C08G18/32C08G18/67
CPCC09J175/14C09J175/16C08G18/12C08G18/675C08G18/3206C08G18/4837C08G18/672C08G18/6674C08G2170/20C08L75/16C08L75/14C08G18/3212C08G18/3215
Inventor 曹阳李帅林鸿腾
Owner XIAMEN WELDTONE TECH CO LTD
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