Method for preparing Kovar alloy electronic package box

Abstract

The invention provides a method for preparing a Kovar alloy electronic packaging box body. Mixing iron, nickel and cobalt powder according to weight percentage Fe:Ni:Co=53~55:29~31:16~18, milling with high-energy ball mill for 2-8 hours to obtain alloy composite powder; adding binder to alloy composite powder , mixed into a uniform feed, the powder loading is 55-64%; the feed is injection-molded on the injection machine, the temperature is 150-170°C, and the pressure is 90-110MPa; the injection-molded blank is degreased by solvent degreasing + subsequent thermal degreasing Process, solvent degreasing the injection molding blank in trichlorethylene for 2 to 6 hours, and drying at a temperature of 40 to 60°C for 30 to 60 minutes; thermal degreasing is performed at room temperature to 600°C, and the time is 6 to 8 hours; injection After degreasing the formed body, it is sintered in a sintering furnace at 1250-1280° C. and kept for 1-3 hours. The sintered product is subjected to subsequent treatment to obtain a packaging box. The advantage lies in the high material utilization rate and the high dimensional accuracy of the product.

Description

technical field [0001] The invention belongs to the technical field of powder metallurgy, and in particular provides a method for preparing a Kovar alloy electronic packaging box. Background technique [0002] The invention relates to the injection molding technology, and provides a preparation method of a Kovar alloy electronic packaging box body. [0003] Encapsulation metal box is a key part of high-power microelectronics and optical fiber communication connection devices, and the failure or unstable performance of the box is one of the most important factors affecting the quality of the whole machine. In order to ensure the working stability of the electronic components in the box, it is required that the material of the metal box must have a stable thermal expansion coefficient within a certain temperature range that is consistent with the packaging glass or ceramic material, so as to avoid excessive differences in expansion coefficients between the two. A large intern...

AI Technical Summary

Problems solved by technology

[0004] The application of Kovar alloy has a long history, but the Kovar alloy packaging box produced by the machining and stamping process currently used still has the following problems: (1) the manufacturing cost of the machining method is high, and the waste of raw materials is large; (2) due to cold working The amount of deformation is large, the thermal expansion performance of the packaging box in all directions is quite different, and the product performance consistency is poor, which often causes cracks and leakage damage at the sealing part of the device during use; (3) due to the plastic deformation of the Kovar alloy The ability is poor, and the stamping method can only be used to prepare packaging boxes with a wall thickness below 0.3mm. When used in high-power devices, thermal deformation often occurs, resulting in overall damage to the packaging device; The box body with horizontal holes, the follow-up machining not only has a long cycle, a large cost of materials, and high production costs, but also it is difficult to ensure the flatness and surface quality inside the box body

The invention provides a high-performance, high-efficiency and low-cost method for producing a Kovar alloy packaging box, and focuses on solving the problem of anisotropy of thermal expansion of the alloy and the forming of a complex-shaped box