Nano twin crystal copper material with ultrahigh strength and superhigh conductivity as well as preparation method

A nano-twinned copper, ultra-high-strength technology, applied in the field of ultra-high conductivity nano-twinned copper materials and preparation, ultra-high strength, can solve the problem of limited yield strength of pure Cu materials, and achieve excellent properties and high electrical conductivity , high-strength effect

Active Publication Date: 2004-05-26
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the above analysis, it can be seen that the yield strength of the obtained pure Cu material is limited...

Method used

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  • Nano twin crystal copper material with ultrahigh strength and superhigh conductivity as well as preparation method
  • Nano twin crystal copper material with ultrahigh strength and superhigh conductivity as well as preparation method
  • Nano twin crystal copper material with ultrahigh strength and superhigh conductivity as well as preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 1. Preparation of flaky nano-twin crystal Cu material by electrolytic deposition technology

[0031] Electrolytic deposition equipment: single pulse electrolytic deposition equipment

[0032] Electrolyte requirements for electrolytic deposition: electronically pure CuSO 4 Solution, strictly control the content of heavy metal impurities in the electrolyte, the water used for distributing the electrolyte should be high-purity deionized water, and the acidity of the electrolyte is: PH=1.

[0033] Requirements for cathode and anode: the anode is a pure copper plate with a purity higher than 99.99%, and the cathode is an iron plate coated with Ni-P amorphous layer.

[0034] 2. Electrolysis process parameters: pulse current density is 50A / cm 2 , pulse plating; conduction time (t on ) is 0.02s, closing time (t off ) is 2s, the distance between cathode and anode is 100mm, the area ratio of anode and cathode is 50:1; the electrolysis temperature is 20C, and the electrolytic ...

Embodiment 2

[0048] The difference from Example 1 is:

[0049] 1) Preparation of flaky nanocrystalline Cu materials by electrolytic deposition technology: Electron-grade high-purity copper sulfate CuSO for electrolyte 4 solution, add high-purity distilled water, and the acidity is PH=0.5; Yin and anode: the anode is a pure copper plate with a purity higher than 99.99%, and the cathode is an iron plate with a Ni-P amorphous layer on the surface, and the anode-to-cathode area ratio is 30 : 1.

[0050] 2) Additives: 0.02ml / l of gelatin aqueous solution with 5% concentration, 0.2ml / l of high-purity NaCl aqueous solution with 5% concentration; electrolysis process parameters: pulse current density is 80A / cm 2 , on-time (t on ) is 0.05s, the closing time (t off ) is 3s; the distance between cathode and anode is 50mm, and the temperature of electrolyte is 15℃;

[0051] High-purity, high-density, thin-sheet twinned nanocrystalline Cu materials can also be prepared under this process condition....

Embodiment 3

[0053] The difference from Example 1 is:

[0054] 1) Preparation of thin flaky nanocrystalline Cu materials by electrolytic deposition technology: electronically pure copper sulfate CuSO for electrolyte 4 Solution, add high-purity distilled water, acidity is PH=1.5; Yin, anode: the anode is a pure copper plate with a purity higher than 99.99%, and the cathode is a low-carbon steel plate with a Ni-P amorphous layer on the surface, and the anode-to-cathode area ratio is 40 : 1.

[0055] 2) Additives: 0.15ml / l of gelatin aqueous solution with 25% concentration, 1.0ml / l of high-purity NaCl aqueous solution with 25% concentration; electrolysis process parameters: pulse current density is 40A / cm 2 , on-time (t on ) is 0.01s, closing time (t off ) is 1s; the pole distance between cathode and anode is 150mm, and the electrolysis temperature is 25°C;

[0056] Under the process conditions, high-purity, high-density, thin-sheet twinned nanocrystalline Cu materials can also be prepare...

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Abstract

A nano-class twin-crystal copper material with ultrahigh strength and ultrahigh electric conductivity is prepared by electrolytic deposition technique. The resultant high-purity polycrystal copper material features that its microstructure is composed of nearly equiaxed submicron (300-1000 nm) crystals, and in the crystal there are high-density parallel twin crystal layers with different orientations. Its advantages are high yield strength up to 900 MPa and break strength up to 1086 MPa, and high electric conductivity (1.75+/- 0.02 X to the power -8 ohm.m).

Description

technical field [0001] The invention relates to a nano-crystal metal material, in particular to a super-high-strength, super-high-conductivity nano-twinned copper material and a preparation method. Background technique [0002] Copper and its alloys are the earliest and most widely used non-ferrous metals. my country is one of the earliest countries to use copper alloys. Bronze was used to make bells, tripods and weapons as far back as the Yin and Zhou Dynasties more than 3,700 years ago. Until now, copper and its alloys are still the most widely used metal materials. The main characteristics of copper and its alloys are electrical conductivity, good thermal conductivity, good corrosion resistance in the atmosphere, sea water and many media, and good plasticity and wear resistance. They are suitable for various plastic processing and casting methods. It is an indispensable metal material in industrial sectors such as electric power, electrician, thermal engineering, chemica...

Claims

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Application Information

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IPC IPC(8): C25C1/12
CPCY02P10/20
Inventor 卢磊斯晓申勇峰卢柯
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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