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Direct-coated-sticked superthin polyimide rolled substrate material and its preparing method

The technology of polyimide roll and polyetherimide is applied in the field of flexible circuit roll substrate and its preparation, which can solve the problems of unavoidable substrate and complicated process, and achieve the effect of simple process and low cost.

Inactive Publication Date: 2005-02-16
SHENZHEN DANBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another non-adhesive polyimide roll substrate uses three layers of different polyimide resins, namely polyimide acid primer, thermoplastic polyimide resin, and modified phenylene or Biphenyl polyimide resin, which has been disclosed in Chinese patent CN 1269285A, but its process is very complicated, the raw material purification requirements of each polyimide resin with different structures are as high as 99.99%, the mechanical precision of the equipment and the precision of electronic control, The electric heating system, nitrogen protection drying tunnel and other aspects are also very strict. When using continuous coating process, problems such as curling, twisting and warping of the substrate cannot be avoided.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Weigh 300g of 2,2-bis[4-dicarboxyphenoxyphenyl]propane dianhydride, 44g of polyetherimide, 170g of diaminodiphenyl ether, 40g of benzophenone tetracarboxylic dianhydride, triphenyl ether 42g of tetraformic dianhydride, 20g of p-diaminobenzene, 4g of tetraethoxysilane, 2g of diaminopolysiloxane, and 3000g of dimethylacetamide. First, add polyetherimide to 1000 g of dimethylacetamide solvent for stirring and dissolving, then add it to the reaction box in sequence, then add 1000 g of dimethylacetamide solvent, and add tetraethoxysilane at the same time. Since the amount of tetraethoxysilane is relatively small, it is necessary to add diamino-terminated polysiloxane, and then immediately pass nitrogen gas, stir with electricity until the dianhydrides are completely dissolved, then add diaminodiphenyl ether, and then add dimethyl ethyl ether. Amide solvent 1000g, dissolve and add p-diaminobenzene, because p-diaminobenzene is easy to oxidize, pay attention to anti-oxidation d...

Embodiment 2

[0021] Weigh 100g of 2,2-bis[4-dicarboxyphenoxyphenyl]propane dianhydride, 20g of polyetherimide, 100g of diaminodiphenyl ether, 40g of benzophenone tetracarboxylic dianhydride, and triphenyl ether 42g of tetraformic dianhydride, 40g of p-diaminobenzene, 8g of tetraethoxysilane, 16g of diaminopolysiloxane, and 3000g of dimethylacetamide. First, add polyetherimide to 1000 g of dimethylacetamide solvent for stirring and dissolving, then add it to the reaction box in sequence, then add 1000 g of dimethylacetamide solvent, and add tetraethoxysilane at the same time. Since the amount of tetraethoxysilane is relatively small, it is necessary to add diamino-terminated polysiloxane, and then immediately pass nitrogen gas, stir with electricity until the dianhydrides are completely dissolved, then add diaminodiphenyl ether, and then add dimethyl ethyl ether. Amide solvent 1000g, dissolve and then add p-diaminobenzene, because p-diaminobenzene is easy to oxidize, pay attention to anti-o...

Embodiment 3

[0030] Weigh 400g of 2,2-bis[4-dicarboxyphenoxyphenyl]propane dianhydride, 70g of polyetherimide, 300g of diaminodiphenyl ether, 40g of benzophenone tetracarboxylic dianhydride, and triphenyl ether 42g of tetraformic dianhydride, 40g of p-diaminobenzene, 15g of tetraethoxysilane, 30g of diaminopolysiloxane, and 3000g of dimethylacetamide. First, add polyetherimide to 1000 g of dimethylacetamide solvent for stirring and dissolving, then add it to the reaction box in sequence, then add 1000 g of dimethylacetamide solvent, and add tetraethoxysilane at the same time. Since the amount of tetraethoxysilane is relatively small, it is necessary to add diamino-terminated polysiloxane, and then immediately pass nitrogen gas, stir with electricity until the dianhydrides are completely dissolved, then add diaminodiphenyl ether, and then add dimethyl ethyl ether. Amide solvent 1000g, dissolve and add p-diaminobenzene, because p-diaminobenzene is easy to oxidize, pay attention to anti-oxida...

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Abstract

The invention relates to a kind of hybridization silicon dioxide polyimides resins which is used to roll coat or adhere to ultrathin tortile polyimides backing material. It is composed by aromatic dianhydride, aromatic diamine, condensation composed by polyimides acid alkyl liquor containing ac lateral group or diamine. Add tetraethoxy silicane two amino end group siloxanes, prepare resin mixed with hybridization silicon dioxide polyimides, butter on copper foil and get the end outcome on the insulating layer of polyimides membranes on the copper foil. The preparation process of wrapped backing material follows this. First, butter hybridization polyimides resins on the foil fro three times, the coating is about 20-30 microns. Second, it changes wraps automatically through drying tunnel and then do the process of imine through nitrogen gas drying tunnel in temperature of 350 degree for 30 seconds. Third, get wraped backing material after post-treatment and anti oxidation treatment. Compared with exiting technology, the preparation of the backing material does not need viscose and can meet the making need of COF ultramicro circuit, besides, it craft is easy and cost is low.

Description

technical field [0001] The present invention relates to a layered product composed of metal and synthetic resin, in particular to a flexible circuit roll-shaped base material with a polyimide film insulation layer formed on a copper foil and a preparation method thereof. Background technique [0002] As the requirements for ultra-micro-flexible circuits are getting higher and higher, and the accuracy of line spacing and line width is required to be below 50 microns, the polyimide substrate with adhesive in the prior art can no longer meet the requirements. At present, the line spacing and line width above 70 microns are generally used with adhesive sheet and roll materials, and the line space and line width below 70 microns are generally used without adhesive sheet lamination process to suppress the occurrence of curling. . The lamination process generally adopts a three-layer structure, which has the defects of high cost and inability to achieve ultra-thin. The insulating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D7/14C09D179/08
Inventor 刘萍
Owner SHENZHEN DANBOND TECH