Modified epoxy resin adhesive and its preparation process

A technology of epoxy resin and modified resin, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of environmental pollution, inability to meet the curing time and long curing time of packaging materials, etc.

Inactive Publication Date: 2005-09-21
徐良衡
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The currently used epoxy resin encapsulation adhesive requires a relatively long curing time (>18 hours) and a high curing temperature (>150°C), which cannot meet the requirements of

Method used

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  • Modified epoxy resin adhesive and its preparation process
  • Modified epoxy resin adhesive and its preparation process
  • Modified epoxy resin adhesive and its preparation process

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0052] Example 1

[0053] The molecular structure of reactant 4-(4-aminobenzyl)aniline is as follows:

[0054]

[0055] reaction process:

[0056] Add 29.7 g (0.15 mol) of the reactants ambenzyl aniline and 17.6 g (0.1 mol) of 1-chlorodecane into a glass reactor, add 80 ml of 15% NaOH alkaline solution, and stir at 1500 rpm. The reaction temperature was 90°C, and after rising to the reaction temperature, the reaction was carried out for 3 hours. After the reaction is over, it is extracted with cyclohexane, and the solvent is removed by rotary distillation to obtain the product as a colorless or light yellow transparent liquid. Viscosity 320mp, curing conditions: curing at a temperature above 60°C, no effect at low temperatures.

Example Embodiment

[0057] Example 2

[0058] The structural formula of the reactant 4-(2-aminoethyl)-1-methylcyclohexylamine is as follows:

[0059]

[0060] reaction process:

[0061] The reactants 4-(2-aminoethyl)-1-methylcyclohexylamine 46.9g (0.3mol) and 12.1g (0.1mol) were added to the glass reactor, and 15% Na was added 2 CO 3 Of 100ml, stir quickly. The reaction temperature was 120°C, and the reaction was conducted for 6 hours. After the reaction, it was extracted with n-hexane, and after three times, the solvent was removed by rotating distillation to obtain a light yellow transparent viscous liquid. The viscosity is 280mp. Low temperature has no effect, and the temperature is increased to 45°C for curing.

[0062] II Surface active treatment of filler

Example Embodiment

[0063] Example 3 Surface Treatment of Silicon Micropowder

[0064] In 50ml of organosiloxane solution, add 4.5% molten silicon powder in methanol (the maximum diameter of silicon powder should be less than 10μm), stir vigorously at 5000rpm to promote the full dispersion of silicon powder in the system, and then heat to reflux, stirring at medium speed , The reaction time is 1h, continue to heat up and distill out methanol. Control the temperature within 80-100°C, and react for 20h within this temperature range. After the surface treatment is completed, the excess siloxane is distilled off under reduced pressure. The system was cooled to room temperature. After separation and drying, it is repeatedly washed and filtered with distilled water or deionized water, dehydrated with absolute ethanol, vacuum dried and ground into fine powder to obtain 2.6 g of surface-treated molten silicon fine powder filler.

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Abstract

The invention discloses a thermosetting multi-component modified epoxy binder for using in the middle between IC cores and insulating underlay base boards and its preparation process, which belongs to the electronic device packaging technical field. The said binding agent is made of combined modified epoxide resin, latent curing agent, filler and addition auxiliary agent in a correct proportion, wherein the combined modified epoxide resin is made of bisphenol ethylene oxide resin as the main resin, alicyclic rings and naphthalene epoxide resin as the modified resin, the said latent curing agent is aromatic terminal group amine or alicyclic ring terminal group amine, the said filler is inorganic powder prepared by tensioactive treatment, the said addition auxiliary agent contains toning agent, accelerating agent, flame retardant and phenols curing agent. The said binding agent in the invention has many advantages such as high glass transition temperature, high adhesive property, high heat resistance, middle-and-low graded curing temperature and short curing time.

Description

technical field [0001] The invention belongs to the technical field of packaging materials for electronic devices, and in particular relates to a thermosetting multi-component modified epoxy resin adhesive used between an IC chip and an insulating substrate substrate and a preparation method thereof. technical background [0002] Silicone polymers and epoxy resins are commonly used packaging materials for electronic devices in the electronics industry. Silicone material has the advantages of low temperature flexibility (Tg=120°C), low surface energy, high temperature resistance, weather resistance, corrosion resistance, good hydrophobicity, and high dielectric strength, but it also has poor mechanical properties and wear resistance. , solvent resistance, poor adhesion, high cost and other shortcomings. Epoxy resin has the advantages of excellent mechanical properties, chemical solvent resistance, oxygen permeability resistance, water resistance, good bonding performance, ea...

Claims

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Application Information

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IPC IPC(8): C09J163/00
Inventor 徐良衡王群英高芸
Owner 徐良衡
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