Halogen-free phosphor-free combustion-proof epoxide resin composition

Abstract

The invention discloses a halogen-free phosphor-free combustion-proof epoxide resin composition, which comprises polyhydric benzene phenol boric acid ester, dihydroxydiphenyl sulfone epoxy resin, alpha-methacrylic acid deactivated imidazole and gamma-glycidol ether propyl trimethylsilicane by the weight ratio of 10-50 : 20-50 : 0.5-15 : 0.5-10.

Description

technical field [0001] The invention relates to an environment-friendly flame-retardant material, in particular to a material which can be used to manufacture printed circuit board substrates. Background technique [0002] Traditional flame-retardant printed circuit board (PCB) substrates use halogen-based flame retardants. When these halogen-containing compounds are incompletely burned, they will produce dioxin substances that are extremely harmful to the human body and the environment. Many countries in the world have Formulate and promulgate substrate regulations that restrict or ban halogen-containing flame retardants. Therefore, halogen-free substrates have become a hot spot in the development of the PCB field. The currently used halogen-free flame-retardant PCB base material is added with phosphorus-containing compounds. Although it can be well flame-retardant, it has the problems of low heat resistance, low moisture resistance, and poor interlayer adhesion. Japanese ...

AI Technical Summary

Problems solved by technology

Although the flame retardancy is improved, the heat resistance and moisture resistance are not enough

Japanese Patent Laid-Open No. 11-60689 proposes a technical route of reacting epoxy resin with phenyl phosphate compound, but the improvement of moisture resistance is not obvious

Benzoxazine was used to prepare halogen-free and phosphorus-free flame-retardant PCB boards in the fourth issue of "Copper Clad Laminate Information" magazine published in 2005. Although it has a high carbon formation rate, it has certain flame retardancy and mechanical properties. , but the flame retardancy cannot meet the requirements of UL94VO level

This kind of high thermal conductivity, halogen-free and phosphorus-free flame retardant resin does not have phosphorus-containing flame retardants, so it will not cause environmental pollution problems due to hydrolysis. The disadvantage is that inorganic powder and metal powder reduce the insulation and drilling performance of PCB boards.

Chinese patent application 200410039268 (publication date is 20050817) uses a halogen-free, phosphorus-free and high-nitrogen-containing polycyclic compound as a flame retardant. Because the flame retardant has amido and hydroxyl functional groups, it can be used with epoxy resin Carry out chemical bond reaction to form a reactive flame-retardant semi-cured epoxy resin, and then add this flame-retardant semi-cured epoxy resin with inorganic additives to the epoxy resin to prepare an environmentally friendly, halogen-free, and phosphorus-free product that can be used for PCB or semiconductor packaging. The flame retardant epoxy resin composition, the disadvantage is that the inorganic additives bring poor moisture resistance of the PCB