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Copper-clad laminated sheet

A technology of copper clad laminates and copper foils, applied in the field of copper clad laminates, can solve problems such as inability to improve adhesion

Inactive Publication Date: 2006-08-23
NIPPON STEEL CHEMICAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, organic antirust agents such as benzotriazole are used in the formation of the antirust coating film on copper foil, but since the purpose of using the organic antirust agent is to improve the wettability of polyamic acid and copper alloy foil, even Can make laminates with stable adhesion and don't have much hope for improved adhesion with organic rust inhibitors

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0053] The polyamic acid-containing varnish used in the examples was prepared as follows. In a 3-neck flask, add 425g dimethylacetamide, 31.8g 2,2'-dimethyl-4,4'-diaminobiphenyl and 4.9g1,3-bis(4-aminophenoxy)benzene , and stirred at room temperature for 30 minutes. Then, 28.6 g of pyromellitic dianhydride and biphenyl-3,4,3',4'-tetracarboxylic dianhydride were added, and stirred at room temperature for 3 hours under a nitrogen atmosphere. The viscosity was measured and found to be 28000 cps at 30°C.

Embodiment 1

[0055] As the copper foil, untreated electrolytic copper foil (surface roughness: ten-point average roughness (Rz) = about 0.8 μm, thickness: 18 μm, 20 cm×13 cm square) without surface treatment was used. First, in order to remove the surface oxide film on the surface of the copper foil, it was immersed for 60 seconds in a 5% hydrochloric acid aqueous solution (pH<1, bath temperature: about 20° C.). In order to remove the adhering acid, thoroughly wash with ion-exchanged water, and blow compressed air to dry. The copper foil thus treated was immersed in a treatment solution in which 160 mg of 2-amino-1,3,5-triazine-4,6-dithiol was dissolved in methanol (1 L) in which an organic surface treatment agent was dissolved (bath temperature is about 20°C) for 30 seconds for surface treatment.

[0056] Next, it was immersed in 750 mL of ion-exchanged water (bath temperature: about 20° C.) for washing treatment for 60 seconds, and then dried by blowing compressed air for about 15 secon...

Embodiment 2

[0061] It carried out similarly to Example 1 except that the usage-amount of 2-amino-1,3,5-triazine-4,6-dithiol of an organic surface treatment agent was 80 mg in the processing liquid which processed copper foil.

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Abstract

This invention relate to a copper-clad laminate with good adhesion between a copper foil and a layer of polyimide resin useful for high-density printed wiring boards. The copper-clad laminate having a copper foil treated with a heterocyclic compound containing nitrogen and sulfur as an organic surface treating agent and a layer of polyimide resin satisfying either of the following requirements: the concentration of sulfur atoms derived from the organic surface treating agent in the interface of copper and polyimide is in the range of 0.01-0.24 wt % as determined by an Energy dispersive X-ray spectroscopy (EDX); the weight of sulfur atoms derived from the organic surface treating agent per unit area of the copper foil is in the range of 2.5-3.1 mg / m2; and the concentration of sulfur atoms derived from the organic surface treating agent existing in the range from the surface to a depth of 16 nm of the copper foil is in the range of 1.73-2.30 atom % as determined by X-ray photoelectron spectroscopy (XPS).

Description

【Technical field】 [0001] The present invention relates to a copper clad laminate suitable for use in circuit components of electronic equipment. 【Background technique】 [0002] In an electronic circuit of an electronic device, a printed circuit board in which a laminated board composed of an insulating material and a conductive material is subjected to circuit processing is generally used. A printed circuit board is a circuit board in which a conductive pattern based on an electrical design is formed on the surface (or inside) of an insulating material through a conductive material. According to the type of resin forming the insulating material, etc., it is roughly divided into a plate-shaped rigid printed circuit board and rich Flexibility of flexible printed circuit boards. A flexible printed circuit board is characterized by being flexible, and is generally made as an essential part used in connection parts of mobile phones and the like that are often repeatedly bent. I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38B32B15/08H05K1/09
CPCY10T428/12569H05K2201/0154H05K3/389C23C28/00Y10T428/12556H05K2201/0355H05K2203/124B32B15/088H05K3/38
Inventor 新田龙三松村康史川里浩信
Owner NIPPON STEEL CHEMICAL CO LTD
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