Laser COD eliminating method suitable for mass production
A laser and mass-volume technology, applied in the direction of lasers, laser components, semiconductor lasers, etc., can solve problems such as defects at the acceleration interface, unsuitable for industrialized mass production, and inability to significantly increase the COD optical power threshold, so as to improve the bearing capacity , Improve the effect of light output power
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[0026] The specific technical process of a laser COD elimination method suitable for mass production according to specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
[0027] The present invention is to selectively mix quantum wells on the epitaxial wafer of semiconductor material for making lasers. The actual operation is simple, and the process steps are as follows. Please refer to figure 2 :
[0028] (1) Production of solid zinc source
[0029] First, a dense silicon oxynitride layer 22 is grown on the epitaxial wafer of semiconductor material for making the laser, and the silicon oxynitride layer on the end face of the laser is etched away. The etching solution is hydrofluoric acid buffer solution. The surface has little effect. Then, a zinc oxide layer 21 is grown on the silicon oxynitride layer 22 and the electrode contact layer 16 of the semiconductor laser, and the growth temperature is 120-300...
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